W25Q256FV Datasheet by Winbond Electronics

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'1' winband .1. spy/a5];
W25Q256FV
Publication Release Date: April 29, 2013
Preliminary - Revision F
3V 256M-BIT
SERIAL FLASH MEMORY WITH
DUAL/QUAD SPI & QPI
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W25Q256FV
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Table of Contents
1.
GENERAL DESCRIPTIONS ........................................................................................................ 5
2.
FEATURES ................................................................................................................................. 5
3.
PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 6
3.1
Pad Configuration WSON 8x6-mm ................................................................................... 6
3.2
Pad Description WSON 8x6-mm ...................................................................................... 6
3.3
Pin Configuration SOIC 300-mil ........................................................................................ 7
3.4
Pin Description SOIC 300-mil ........................................................................................... 7
3.5
Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ............................................... 8
3.6
Ball Description TFBGA 8x6-mm ...................................................................................... 8
4.
PIN DESCRIPTIONS ................................................................................................................... 9
4.1
Chip Select (/CS) ............................................................................................................. 9
4.2
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................. 9
4.3
Write Protect (/WP) ......................................................................................................... 9
4.4
HOLD (/HOLD) ................................................................................................................ 9
4.5
Serial Clock (CLK) ........................................................................................................... 9
4.6
Reset (/RESET) ............................................................................................................... 9
5.
BLOCK DIAGRAM ..................................................................................................................... 10
6.
FUNCTIONAL DESCRIPTIONS ................................................................................................. 11
6.1
SPI / QPI Operations ..................................................................................................... 11
6.1.1
Standard SPI Instructions .................................................................................................... 11
6.1.2
Dual SPI Instructions ............................................................................................................ 11
6.1.3
Quad SPI Instructions .......................................................................................................... 12
6.1.4
QPI Instructions .................................................................................................................... 12
6.1.5
3-Byte / 4-Byte Address Modes ............................................................................................ 12
6.1.6
Hold Function ....................................................................................................................... 13
6.1.7
Software Reset & Hardware /RESET pin ............................................................................. 13
6.2
Write Protection ............................................................................................................. 14
7.
STATUS AND CONFIGURATION REGISTERS ......................................................................... 15
7.1
Status Registers ............................................................................................................ 15
7.1.1
Erase/Write In Progress (BUSY) – Status Only ................................................................... 15
7.1.2
Write Enable Latch (WEL) – Status Only ............................................................................. 15
7.1.3
Block Protect Bits (BP3, BP2, BP1, BP0) – Volatile/Non-Volatile Writable .......................... 16
7.1.4
Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable .......................................... 16
7.1.5
Complement Protect (CMP) – Volatile/Non-Volatile Writable ............................................... 16
7.1.6
Status Register Protect (SRP1, SRP0) – Volatile/Non-Volatile Writable .............................. 16
7.1.7
Erase/Program Suspend Status (SUS) – Status Only ......................................................... 17
7.1.8
Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable ............. 17
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W25Q256FV
Publication Release Date: April 29, 2013
- 2 - Preliminary - Revision F
7.1.9
Quad Enable (QE) – Volatile/Non-Volatile Writable ............................................................. 17
7.1.10
Current Address Mode (ADS) – Status Only ...................................................................... 18
7.1.11
Power-Up Address Mode (ADP) – Non-Volatile Writable ................................................... 18
7.1.12
Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ......................................... 18
7.1.13
Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable ............................. 19
7.1.14
HOLD or /RESET Pin Function (HOLD/RST) – Volatile/Non-Volatile Writable................... 19
7.1.15
Reserved Bits – Non Functional ......................................................................................... 19
7.1.16
W25Q256FV Status Register Memory Protection (WPS = 0, CMP = 0) ............................ 20
7.1.17
W25Q256FV Status Register Memory Protection (WPS = 0, CMP = 1) ............................ 21
7.1.18
W25Q256FV Individual Block Memory Protection (WPS=1) .............................................. 22
7.2
Extended Address Register – Volatile Writable Only ....................................................... 23
8.
INSTRUCTIONS ........................................................................................................................ 24
8.1
Device ID and Instruction Set Tables ............................................................................. 24
8.1.1
Manufacturer and Device Identification ................................................................................ 24
8.1.2
Instruction Set Table 1 (Standard/Dual/Quad SPI, 3-Byte & 4-Byte Address Mode)
(1)
........ 25
8.1.3
Instruction Set Table 2 (Standard/Dual/Quad SPI Instructions, 3-Byte Address Mode)
(1)
.... 26
8.1.4
Instruction Set Table 3 (Standard/Dual/Quad SPI Instructions, 4-Byte Address Mode)
(1)
.... 27
8.1.5
Instruction Set Table 4 (QPI Instructions, 3-Byte & 4-Byte Address Mode)
(14)
..................... 28
8.1.6
Instruction Set Table 5 (QPI Instructions, 3-Byte Address Mode)
(14)
.................................... 29
8.1.7
Instruction Set Table 6 (QPI Instructions, 4-Byte Address Mode)
(14)
.................................... 29
8.2
Instruction Descriptions .................................................................................................. 31
8.2.1
Write Enable (06h) ............................................................................................................... 31
8.2.2
Write Enable for Volatile Status Register (50h) .................................................................... 31
8.2.3
Write Disable (04h) .............................................................................................................. 32
8.2.4
Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .............. 32
8.2.5
Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .............. 33
8.2.6
Read Extended Address Register (C8h) .............................................................................. 36
8.2.7
Write Extended Address Register (C5h) .............................................................................. 37
8.2.8
Enter 4-Byte Address Mode (B7h) ....................................................................................... 38
8.2.9
Exit 4-Byte Address Mode (E9h) .......................................................................................... 38
8.2.10
Read Data (03h) ................................................................................................................. 39
8.2.11
Read Data with 4-Byte Address (13h) ................................................................................ 40
8.2.12
Fast Read (0Bh) ................................................................................................................. 41
8.2.13
Fast Read with 4-Byte Address (0Ch) ................................................................................ 43
8.2.14
Fast Read Dual Output (3Bh) ............................................................................................. 44
8.2.15
Fast Read Dual Output with 4-Byte Address (3Ch) ............................................................ 45
8.2.16
Fast Read Quad Output (6Bh) ........................................................................................... 46
8.2.17
Fast Read Quad Output with 4-Byte Address (6Ch) .......................................................... 47
8.2.18
Fast Read Dual I/O (BBh) .................................................................................................. 48
8.2.19
Fast Read Dual I/O with 4-Byte Address (BCh) ................................................................. 50
8.2.20
Fast Read Quad I/O (EBh) ................................................................................................. 52
8.2.21
Fast Read Quad I/O with 4-Byte Address (ECh) ................................................................ 55
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8.2.22
Word Read Quad I/O (E7h)................................................................................................ 57
8.2.23
Octal Word Read Quad I/O (E3h) ...................................................................................... 59
8.2.24
Set Burst with Wrap (77h) .................................................................................................. 61
8.2.25
Page Program (02h) ........................................................................................................... 62
8.2.26
Quad Input Page Program (32h) ........................................................................................ 64
8.2.27
Sector Erase (20h) ............................................................................................................. 65
8.2.28
32KB Block Erase (52h) ..................................................................................................... 66
8.2.29
64KB Block Erase (D8h) .................................................................................................... 67
8.2.30
Chip Erase (C7h / 60h)....................................................................................................... 68
8.2.31
Erase / Program Suspend (75h)......................................................................................... 69
8.2.32
Erase / Program Resume (7Ah) ......................................................................................... 71
8.2.33
Power-down (B9h).............................................................................................................. 72
8.2.34
Release Power-down / Device ID (ABh) ............................................................................ 73
8.2.35
Read Manufacturer / Device ID (90h) ................................................................................ 75
8.2.36
Read Manufacturer / Device ID Dual I/O (92h) .................................................................. 76
8.2.37
Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 77
8.2.38
Read Unique ID Number (4Bh) .......................................................................................... 78
8.2.39
Read JEDEC ID (9Fh) ........................................................................................................ 79
8.2.40
Read SFDP Register (5Ah) ................................................................................................ 80
8.2.41
Erase Security Registers (44h) .......................................................................................... 81
8.2.42
Program Security Registers (42h) ...................................................................................... 82
8.2.43
Read Security Registers (48h) ........................................................................................... 83
8.2.44
Set Read Parameters (C0h) ............................................................................................... 84
8.2.45
Burst Read with Wrap (0Ch) .............................................................................................. 85
8.2.46
Enter QPI Mode (38h) ........................................................................................................ 86
8.2.47
Exit QPI Mode (FFh) .......................................................................................................... 87
8.2.48
Individual Block/Sector Lock (36h) ..................................................................................... 88
8.2.49
Individual Block/Sector Unlock (39h) .................................................................................. 89
8.2.50
Read Block/Sector Lock (3Dh) ........................................................................................... 90
8.2.51
Global Block/Sector Lock (7Eh) ......................................................................................... 91
8.2.52
Global Block/Sector Unlock (98h) ...................................................................................... 91
8.2.53
Enable Reset (66h) and Reset Device (99h) ...................................................................... 92
9.
ELECTRICAL CHARACTERISTICS ........................................................................................... 93
9.1
Absolute Maximum Ratings (1) ...................................................................................... 93
9.2
Operating Ranges .......................................................................................................... 93
9.3
Power-up Timing and Write Inhibit Threshold ................................................................. 94
9.4
DC Electrical Characteristics .......................................................................................... 95
9.5
AC Measurement Conditions .......................................................................................... 96
9.6
AC Electrical Characteristics
(6)
....................................................................................... 97
9.7
AC Electrical Characteristics (cont’d) ............................................................................. 98
9.8
Serial Output Timing ...................................................................................................... 99
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W25Q256FV
Publication Release Date: April 29, 2013
- 4 - Preliminary - Revision F
9.9
Serial Input Timing ......................................................................................................... 99
9.10
HOLD Timing ................................................................................................................. 99
9.11
WP Timing ..................................................................................................................... 99
10.
PACKAGE SPECIFICATIONS ................................................................................................. 100
10.1
8-Pad WSON 8x6-mm (Package Code E) .................................................................... 100
10.2
16-Pin SOIC 300-mil (Package Code F) ....................................................................... 102
10.3
24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array) ....................................... 103
10.4
24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array) .......................................... 104
11.
ORDERING INFORMATION .................................................................................................... 105
11.1
Valid Part Numbers and Top Side Marking ................................................................... 106
12.
REVISION HISTORY ............................................................................................................... 107
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W25Q256FV
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1. GENERAL DESCRIPTIONS
The W25Q256FV (256M-bit) Serial Flash memory provides a storage solution for systems with limited
space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial
Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI
(XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with
current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-
saving packages.
The W25Q256FV array is organized into 131,072 programmable pages of 256-bytes each. Up to 256
bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of
128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The
W25Q256FV has 8,192 erasable sectors and 512 erasable blocks respectively. The small 4KB sectors
allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.)
The W25Q256FV support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2-
clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI),
I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 80MHz are supported allowing
equivalent clock rates of 160MHz (80MHz x 2) for Dual I/O and 320MHz (80MHz x 4) for Quad I/O when
using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard
Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient
memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true
XIP (execute in place) operation.
A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide
further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device ID
and SFDP Register, a 64-bit Unique Serial Number and three 256-bytes Security Registers.
2. FEATURES
• New Family of SpiFlash Memories
– W25Q256FV: 256M-bit / 32M-byte
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO
0
, IO
1
, /WP, /Hold
– Quad SPI: CLK, /CS, IO
0
, IO
1
, IO
2
, IO
3
– 3 or 4-Byte Addressing Mode
– Software & Hardware Reset
• Highest Performance Serial Flash
– 80MHz Standard/Dual/Quad SPI clocks
– 160/320MHz equivalent Dual/Quad SPI
– 40MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention
• Efficient “Continuous Read”
– Continuous Read with 8/16/32/64-Byte
Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces
instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
• Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
• Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
• Space Efficient Packaging
– 8-pad WSON 8x6-mm
– 16-pin SOIC 300-mil (additional /RESET pin)
– 24-ball TFBGA 8x6-mm
– Contact Winbond for KGD and other options
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W25Q256FV
Publication Release Date: April 29, 2013
- 6 - Preliminary - Revision F
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q256FV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package
code F) and two 24-ball 8x6-mm TFBGA (package code B & C) packages as shown in Figure 1a-c
respectively. Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pad Configuration WSON 8x6-mm
1
2
3
4
/CS
DO (IO
1
)
/WP (IO
2
)
GND
VCC
/HOLD or /RESET
(IO
3
)
DI (IO
0
)
CLK
Top View
8
7
6
5
Figure 1a. W25Q256FV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E)
3.2 Pad Description WSON 8x6-mm
PAD NO. PAD NAME I/O FUNCTION
1 /CS I Chip Select Input
2 DO (IO1) I/O Data Output (Data Input Output 1)
(1)
3 /WP (IO2) I/O Write Protect Input ( Data Input Output 2)
(2)
4 GND Ground
5 DI (IO0) I/O Data Input (Data Input Output 0)
(1)
6 CLK I Serial Clock Input
7 /HOLD or /RESET
(IO3) I/O Hold or Reset Input (Data Input Output 3)
(2)
8 VCC Power Supply
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.
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W25Q256FV
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3.3 Pin Configuration SOIC 300-mil
1
2
3
4
/CS
DO (IO
1
) /WP (IO
2
)
GND
VCC
/HOLD (IO
3
)
DI (IO
0
)
CLK
Top View
NC
/RESET
NC
NC
NC
NC
NC
NC5
6
7
8
10
9
11
12
13
14
15
16
Figure 1b. W25Q256FV Pin Assignments, 16-pin SOIC 300-mil (Package Code F)
3.4 Pin Description SOIC 300-mil
PIN NO. PIN NAME I/O FUNCTION
1 /HOLD (IO3) I/O Hold Input (Data Input Output 3)
(2)
2 VCC Power Supply
3 /RESET I Reset Input
(3)
4 N/C No Connect
5 N/C No Connect
6 N/C No Connect
7 /CS I Chip Select Input
8 DO (IO1) I/O Data Output (Data Input Output 1)
(1)
9 /WP (IO2) I/O Write Protect Input (Data Input Output 2)
(2)
10 GND Ground
11 N/C No Connect
12 N/C No Connect
13 N/C No Connect
14 N/C No Connect
15 DI (IO0) I/O Data Input (Data Input Output 0)
(1)
16 CLK I Serial Clock Input
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.
3. The /RESET pin on SOIC-16 package is independent of the SPI modes and HOLD/RST bit & QE bit settings in the Status
Register.
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W25Q256FV
Publication Release Date: April 29, 2013
- 8 - Preliminary - Revision F
3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)
Figure 1c. W25Q256FV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code B & C)
3.6 Ball Description TFBGA 8x6-mm
BALL NO.
PIN NAME I/O FUNCTION
B2 CLK I Serial Clock Input
B3 GND Ground
B4 VCC Power Supply
C2 /CS I Chip Select Input
C4 /WP (IO2) I/O Write Protect Input (Data Input Output 2)
(2)
D2 DO (IO1) I/O Data Output (Data Input Output 1)
(1)
D3 DI (IO0) I/O Data Input (Data Input Output 0)
(1)
D4 /HOLD or /RESET
(IO3) I/O Hold or Reset Input (Data Input Output 3)
(2)
Multiple NC No Connect
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.
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4. PIN DESCRIPTIONS
4.1 Chip Select (/CS)
The SPI Chip Select (/CS) pin enables and disables device operation. When /CS is high the device is
deselected and the Serial Data Output (DO, or IO0, IO1, IO2, IO3) pins are at high impedance. When
deselected, the devices power consumption will be at standby levels unless an internal erase, program or
write status register cycle is in progress. When /CS is brought low the device will be selected, power
consumption will increase to active levels and instructions can be written to and data read from the device.
After power-up, /CS must transition from high to low before a new instruction will be accepted. The /CS
input must track the VCC supply level at power-up (see “Write Protection” and Figure 58). If needed a
pull-up resister on the /CS pin can be used to accomplish this.
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)
The W25Q256FV supports standard SPI, Dual SPI and Quad SPI operation. Standard SPI instructions
use the unidirectional DI (input) pin to serially write instructions, addresses or data to the device on the
rising edge of the Serial Clock (CLK) input pin. Standard SPI also uses the unidirectional DO (output) to
read data or status from the device on the falling edge of CLK.
Dual and Quad SPI instructions use the bidirectional IO pins to serially write instructions, addresses or
data to the device on the rising edge of CLK and read data or status from the device on the falling edge
of CLK. Quad SPI instructions require the non-volatile Quad Enable bit (QE) in Status Register-2 to be
set. When QE=1, the /WP pin becomes IO2 and /HOLD pin becomes IO3.
4.3 Write Protect (/WP)
The Write Protect (/WP) pin can be used to prevent the Status Register from being written. Used in
conjunction with the Status Register’s Block Protect (CMP, TB, BP3, BP2, BP1 and BP0) bits and Status
Register Protect (SRP) bits, a portion as small as a 4KB sector or the entire memory array can be
hardware protected. The /WP pin is active low. When the QE bit of Status Register-2 is set for Quad I/O,
the /WP pin function is not available since this pin is used for IO2. See Figure 1a-c for the pin
configuration of Quad I/O operation.
4.4 HOLD (/HOLD)
The /HOLD pin allows the device to be paused while it is actively selected. When /HOLD is brought low,
while /CS is low, the DO pin will be at high impedance and signals on the DI and CLK pins will be ignored
(don’t care). When /HOLD is brought high, device operation can resume. The /HOLD function can be
useful when multiple devices are sharing the same SPI signals. The /HOLD pin is active low. When the
QE bit of Status Register-2 is set for Quad I/O, the /HOLD pin function is not available since this pin is
used for IO3. See Figure 1a-c for the pin configuration of Quad I/O operation.
4.5 Serial Clock (CLK)
The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See SPI
Operations")
4.6 Reset (/RESET)
The /RESET pin allows the device to be reset by the controller. For 8-pin packages, when QE=0, the IO3
pin can be configured either as a /HOLD pin or as a /RESET pin depending on Status Register setting.
When QE=1, the /HOLD or /RESET function is not available for 8-pin configuration.
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W25Q256FV
Publication Release Date: April 29, 2013
- 10 - Preliminary - Revision F
5. BLOCK DIAGRAM
Figure 2. W25Q256FV Serial Flash Memory Block Diagram
003000h 0030FFh
002000h 0020FFh
001000h 0010FFh
Column Decode
And 256-Byte Page Buffer
Beginning
Page Address Ending
Page Address
W25Q256FV
SPI
Command &
Control Logic
Byte Address
Latch / Counter
Status
Register
Write Control
Logic
Page Address
Latch / Counter
DO (IO
1
)
DI (IO
0
)
/CS
CLK
/HOLD (IO
3
)
or RESET
/WP (IO
2
)
High Voltage
Generators
xx0F00h xx0FFFh
• Sector 0 (4KB) •
xx0000h xx00FFh
xx1F00h xx1FFFh
• Sector 1 (4KB) •
xx1000h xx10FFh
xx2F00h xx2FFFh
• Sector 2 (4KB) •
xx2000h xx20FFh
•
•
•
xxDF00h xxDFFFh
• Sector 13 (4KB) •
xxD000h xxD0FFh
xxEF00h xxEFFFh
• Sector 14 (4KB) •
xxE000h xxE0FFh
xxFF00h xxFFFFh
• Sector 15 (4KB) •
xxF000h xxF0FFh
Block Segmentation
Data
Security Register 1 - 3
Write Protect Logic and Row Decode
000000h 0000FFh
SFDP Register
0000FF00h 0000FFFFh
• Block 0 (64KB) •
00000000h 000000FFh
•
•
•
007FFF00h 007FFFFFh
• Block 127 (64KB) •
007F0000h 007F00FFh
0080FF00h 0080FFFFh
• Block 128 (64KB) •
00800000h 008000FFh
•
•
•
00FFFF00h 00FFFFFFh
• Block 255 (64KB) •
00FF0000h 00FF00FFh
0100FF00h 0100FFFFh
• Block 256 (64KB) •
01000000h 010000FFh
•
•
•
01FFFF00h 01FFFFFFh
• Block 511 (64KB) •
01FF0000h 01FF00FFh
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W25Q256FV
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6. FUNCTIONAL DESCRIPTIONS
6.1 SPI / QPI Operations
Power Up
ADP bit value
3-Byte Address
Standard SPI
Dual SPI
Quad SPI
Enable 4-Byte (B7h)
4-Byte Address
QPI
4-Byte Address
Standard SPI
Dual SPI
Quad SPI
3-Byte Address
QPI
Disable 4-Byte (E9h)
Enable 4-Byte (B7h)
Disable 4-Byte (E9h)
Enable QPI (38h) Enable QPI (38h)Disable QPI (FFh) Disable QPI (FFh)
SPI Reset
(66h + 99h)
QPI Reset
(66h + 99h)
ADP = 0 ADP = 1
Device Initialization
& Status Register Refresh
(Non-Volatile Cells)
Hardware
Reset
Hardware
Reset
Figure 3. W25Q256FV Serial Flash Memory Operation Diagram
6.1.1 Standard SPI Instructions
The W25Q256FV is accessed through an SPI compatible bus consisting of four signals: Serial Clock
(CLK), Chip Select (/CS), Serial Data Input (DI) and Serial Data Output (DO). Standard SPI instructions
use the DI input pin to serially write instructions, addresses or data to the device on the rising edge of
CLK. The DO output pin is used to read data or status from the device on the falling edge of CLK.
SPI bus operation Mode 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and
Mode 3 concerns the normal state of the CLK signal when the SPI bus master is in standby and data is
not being transferred to the Serial Flash. For Mode 0, the CLK signal is normally low on the falling and
rising edges of /CS. For Mode 3, the CLK signal is normally high on the falling and rising edges of /CS.
6.1.2 Dual SPI Instructions
The W25Q256FV supports Dual SPI operation when using instructions such as “Fast Read Dual Output
(3Bh)” and “Fast Read Dual I/O (BBh)”. These instructions allow data to be transferred to or from the
device at two to three times the rate of ordinary Serial Flash devices. The Dual SPI Read instructions are
ideal for quickly downloading code to RAM upon power-up (code-shadowing) or for executing non-speed-
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Publication Release Date: April 29, 2013
- 12 - Preliminary - Revision F
critical code directly from the SPI bus (XIP). When using Dual SPI instructions, the DI and DO pins
become bidirectional I/O pins: IO0 and IO1.
6.1.3 Quad SPI Instructions
The W25Q256FV supports Quad SPI operation when using instructions such as “Fast Read Quad Output
(6Bh)”, “Fast Read Quad I/O (EBh)”, “Word Read Quad I/O (E7h)” and “Octal Word Read Quad I/O
(E3h)”. These instructions allow data to be transferred to or from the device four to six times the rate of
ordinary Serial Flash. The Quad Read instructions offer a significant improvement in continuous and
random access transfer rates allowing fast code-shadowing to RAM or execution directly from the SPI
bus (XIP). When using Quad SPI instructions the DI and DO pins become bidirectional IO0 and IO1, and
the /WP and /HOLD pins become IO2 and IO3 respectively. Quad SPI instructions require the non-
volatile Quad Enable bit (QE) in Status Register-2 to be set.
6.1.4 QPI Instructions
The W25Q256FV supports Quad Peripheral Interface (QPI) operations only when the device is switched
from Standard/Dual/Quad SPI mode to QPI mode using the “Enter QPI (38h)” instruction. The typical SPI
protocol requires that the byte-long instruction code being shifted into the device only via DI pin in eight
serial clocks. The QPI mode utilizes all four IO pins to input the instruction code, thus only two serial
clocks are required. This can significantly reduce the SPI instruction overhead and improve system
performance in an XIP environment. Standard/Dual/Quad SPI mode and QPI mode are exclusive. Only
one mode can be active at any given time. “Enter QPI (38h)” and “Exit QPI (FFh)” instructions are used to
switch between these two modes. Upon power-up or after a software reset using “Reset (99h)” instruction,
the default state of the device is Standard/Dual/Quad SPI mode. To enable QPI mode, the non-volatile
Quad Enable bit (QE) in Status Register-2 is required to be set. When using QPI instructions, the DI and
DO pins become bidirectional IO0 and IO1, and the /WP and /HOLD pins become IO2 and IO3
respectively. See Figure 3 for the device operation modes.
6.1.5 3-Byte / 4-Byte Address Modes
The W25Q256FV provides two Address Modes that can be used to specify any byte of data in the
memory array. The 3-Byte Address Mode is backward compatible to older generations of serial flash
memory that only support up to 128M-bit data. To address the 256M-bit or more data in 3-Byte Address
Mode, Extended Address Register must be used in addition to the 3-Byte addresses.
4-Byte Address Mode is designed to support Serial Flash Memory devices from 256M-bit to 32G-bit. The
extended Address Register is not necessary when the 4-Byte Address Mode is enabled.
Upon power up, the W25Q256FV can operate in either 3-Byte Address Mode or 4-Byte Address Mode,
depending on the Non-Volatile Status Register Bit ADP (S17) setting. If ADP=0, the device will operate in
3-Byte Address Mode; if ADP=1, the device will operate in 4-Byte Address Mode. The factory default
value for ADP is 0.
To switch between the 3-Byte or 4-Byte Address Modes, “Enter 4-Byte Mode (B7h)” or “Exit 4-Byte Mode
(E9h)” instructions must be used. The current address mode is indicated by the Status Register Bit ADS
(S16).
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6.1.6 Hold Function
For Standard SPI and Dual SPI operations, the /HOLD signal allows the W25Q256FV operation to be
paused while it is actively selected (when /CS is low). The /HOLD function may be useful in cases where
the SPI data and clock signals are shared with other devices. For example, consider if the page buffer
was only partially written when a priority interrupt requires use of the SPI bus. In this case the /HOLD
function can save the state of the instruction and the data in the buffer so programming can resume
where it left off once the bus is available again. The /HOLD function is only available for standard SPI and
Dual SPI operation, not during Quad SPI. The Quad Enable Bit QE in Status Register-2 is used to
determine if the pin is used as /HOLD pin or data I/O pin. When QE=0 (factory default), the pin is /HOLD,
when QE=1, the pin will become an I/O pin, /HOLD function is no longer available.
To initiate a /HOLD condition, the device must be selected with /CS low. A /HOLD condition will activate
on the falling edge of the /HOLD signal if the CLK signal is already low. If the CLK is not already low the
/HOLD condition will activate after the next falling edge of CLK. The /HOLD condition will terminate on the
rising edge of the /HOLD signal if the CLK signal is already low. If the CLK is not already low the /HOLD
condition will terminate after the next falling edge of CLK. During a /HOLD condition, the Serial Data
Output (DO) is high impedance, and Serial Data Input (DI) and Serial Clock (CLK) are ignored. The Chip
Select (/CS) signal should be kept active (low) for the full duration of the /HOLD operation to avoid
resetting the internal logic state of the device.
6.1.7 Software Reset & Hardware /RESET pin
The W25Q256FV can be reset to the initial power-on state by a software Reset sequence, either in SPI
mode or QPI mode. This sequence must include two consecutive commands: Enable Reset (66h) &
Reset (99h). If the command sequence is successfully accepted, the device will take approximately 30uS
(
t
RST
)
to reset. No command will be accepted during the reset period.
For the WSON-8 and TFBGA package types, W25Q256FV can also be configured to utilize a hardware
/RESET pin. The HOLD/RST bit in the Status Register-3 is the configuration bit for /HOLD pin function or
RESET pin function. When HOLD/RST=0 (factory default), the pin acts as a /HOLD pin as described
above; when HOLD/RST=1, the pin acts as a /RESET pin. Drive the /RESET pin low for a minimum
period of ~1us (tRESET*) will reset the device to its initial power-on state. Any on-going Program/Erase
operation will be interrupted and data corruption may happen. While /RESET is low, the device will not
accept any command input.
If QE bit is set to 1, the /HOLD or /RESET function will be disabled, the pin will become one of the four
data I/O pins.
Hardware /RESET pin has the highest priority among all the input signals. Drive /RESET low for a
minimum period of ~1us (tRESET*) will interrupt any on-going external/internal operations, regardless the
status of other SPI signals (/CS, CLK, IOs, /WP and/or /HOLD).
Note: While a faster /RESET pulse (as short as a few hundred nanoseconds) will often reset the device,
a 1us minimum is recommended to ensure reliable operation.
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W25Q256FV
Publication Release Date: April 29, 2013
- 14 - Preliminary - Revision F
6.2 Write Protection
Applications that use non-volatile memory must take into consideration the possibility of noise and other
adverse system conditions that may compromise data integrity. To address this concern, the
W25Q256FV provides several means to protect the data from inadvertent writes.
• Device resets when VCC is below threshold
• Time delay write disable after Power-up
• Write enable/disable instructions and automatic write disable after erase or program
• Software and Hardware (/WP pin) write protection using Status Registers
• Additional Individual Block/Sector Locks for array protection
• Write Protection using Power-down instruction
• Lock Down write protection for Status Register until the next power-up
• One Time Program (OTP) write protection for array and Security Registers using Status Register
*
* Note: This feature is available upon special order. Please contact Winbond for details.
Upon power-up or at power-down, the W25Q256FV will maintain a reset condition while VCC is below the
threshold value of V
WI
, (See Power-up Timing and Voltage Levels and Figure 43). While reset, all
operations are disabled and no instructions are recognized. During power-up and after the VCC voltage
exceeds V
WI
, all program and erase related instructions are further disabled for a time delay of t
PUW
. This
includes the Write Enable, Page Program, Sector Erase, Block Erase, Chip Erase and the Write Status
Register instructions. Note that the chip select pin (/CS) must track the VCC supply level at power-up until
the VCC-min level and t
VSL
time delay is reached.
After power-up the device is automatically placed in a write-disabled state with the Status Register Write
Enable Latch (WEL) set to a 0. A Write Enable instruction must be issued before a Page Program, Sector
Erase, Block Erase, Chip Erase or Write Status Register instruction will be accepted. After completing a
program, erase or write instruction the Write Enable Latch (WEL) is automatically cleared to a write-
disabled state of 0.
Software controlled write protection is facilitated using the Write Status Register instruction and setting
the Status Register Protect (SRP0, SRP1) and Block Protect (CMP, TB, BP[3:0]) bits. These settings
allow a portion or the entire memory array to be configured as read only. Used in conjunction with the
Write Protect (/WP) pin, changes to the Status Register can be enabled or disabled under hardware
control. See Status Register section for further information. Additionally, the Power-down instruction
offers an extra level of write protection as all instructions are ignored except for the Release Power-down
instruction.
The W25Q256FV also provides another Write Protect method using the Individual Block Locks. Each
64KB block (except the top and bottom blocks, total of 510 blocks) and each 4KB sector within the
top/bottom blocks (total of 32 sectors) are equipped with an Individual Block Lock bit. When the lock bit is
0, the corresponding sector or block can be erased or programmed; when the lock bit is set to 1, Erase or
Program commands issued to the corresponding sector or block will be ignored. When the device is
powered on, all Individual Block Lock bits will be 1, so the entire memory array is protected from
Erase/Program. An “Individual Block Unlock (39h)” instruction must be issued to unlock any specific
sector or block.
The WPS bit in Status Register-3 is used to decide which Write Protect scheme should be used. When
WPS=0 (factory default), the device will only utilize CMP, TB, BP[3:0] bits to protect specific areas of the
array; when WPS=1, the device will utilize the Individual Block Locks for write protection.
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7. STATUS AND CONFIGURATION REGISTERS
Three Status and Configuration Registers are provided for W25Q256FV. The Read Status Register-1/2/3
instructions can be used to provide status on the availability of the flash memory array, whether the
device is write enabled or disabled, the state of write protection, Quad SPI setting, Security Register lock
status, Erase/Program Suspend status, output driver strength, power-up and current Address Mode.
The Write Status Register instruction can be used to configure the device write protection features, Quad
SPI setting, Security Register OTP locks, Hold/Reset functions, output driver strength and power-up
Address Mode. Write access to the Status Register is controlled by the state of the non-volatile Status
Register Protect bits (SRP0, SRP1), the Write Enable instruction, and during Standard/Dual SPI
operations, the /WP pin.
7.1 Status Registers
S7 S6 S5 S4 S3 S2 S1 S0
SRP0 TB BP3 BP2 BP1 BP0 WEL BUSY
Status Register Protect 0
(Volatile/Non-Volatile Writable)
Top/Bottom Protect Bit
(Volatile/Non-Volatile Writable)
Block Protect Bits
(Volatile/Non-Volatile Writable)
Write Enable Latch
(Status-Only)
Erase/Write In Progress
(Status-Only)
Figure 4a. Status Register-1
7.1.1 Erase/Write In Progress (BUSY) – Status Only
BUSY is a read only bit in the status register (S0) that is set to a 1 state when the device is executing a
Page Program, Quad Page Program, Sector Erase, Block Erase, Chip Erase, Write Status Register or
Erase/Program Security Register instruction. During this time the device will ignore further instructions
except for the Read Status Register and Erase/Program Suspend instruction (see t
W
, t
PP
, t
SE
,
t
BE
, and
t
CE
in AC Characteristics). When the program, erase or write status/security register instruction has
completed, the BUSY bit will be cleared to a 0 state indicating the device is ready for further instructions.
7.1.2 Write Enable Latch (WEL) – Status Only
Write Enable Latch (WEL) is a read only bit in the status register (S1) that is set to 1 after executing a
Write Enable Instruction. The WEL status bit is cleared to 0 when the device is write disabled. A write
disable state occurs upon power-up or after any of the following instructions: Write Disable, Page
Program, Quad Page Program, Sector Erase, Block Erase, Chip Erase, Write Status Register, Erase
Security Register and Program Security Register.
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Publication Release Date: April 29, 2013
- 16 - Preliminary - Revision F
7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) – Volatile/Non-Volatile Writable
The Block Protect Bits (BP3, BP2, BP1, BP0) are non-volatile read/write bits in the status register (S5, S4,
S3, and S2) that provide Write Protection control and status. Block Protect bits can be set using the Write
Status Register Instruction (see t
W
in AC characteristics). All, none or a portion of the memory array can
be protected from Program and Erase instructions (see Status Register Memory Protection table). The
factory default setting for the Block Protection Bits is 0, none of the array protected.
7.1.4 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable
The non-volatile Top/Bottom bit (TB) controls if the Block Protect Bits (BP3, BP2, BP1, BP0) protect from
the Top (TB=0) or the Bottom (TB=1) of the array as shown in the Status Register Memory Protection
table. The factory default setting is TB=0. The TB bit can be set with the Write Status Register Instruction
depending on the state of the SRP0, SRP1 and WEL bits.
7.1.5 Complement Protect (CMP) – Volatile/Non-Volatile Writable
The Complement Protect bit (CMP) is a non-volatile read/write bit in the status register (S14). It is used in
conjunction with TB, BP3, BP2, BP1 and BP0 bits to provide more flexibility for the array protection. Once
CMP is set to 1, previous array protection set by TB, BP3, BP2, BP1 and BP0 will be reversed. For
instance, when CMP=0, a top 64KB block can be protected while the rest of the array is not; when
CMP=1, the top 64KB block will become unprotected while the rest of the array become read-only. Please
refer to the Status Register Memory Protection table for details. The default setting is CMP=0.
7.1.6 Status Register Protect (SRP1, SRP0) – Volatile/Non-Volatile Writable
The Status Register Protect bits (SRP1 and SRP0) are non-volatile read/write bits in the status register
(S8 and S7). The SRP bits control the method of write protection: software protection, hardware
protection, power supply lock-down or one time programmable (OTP) protection.
SRP1
SRP0
/WP
Status
Register Description
0 0 X Software
Protection /WP pin has no control. The Status register can be written to
after a Write Enable instruction, WEL=1. [Factory Default]
0 1 0 Hardware
Protected When /WP pin is low the Status Register locked and cannot
be written to.
0 1 1 Hardware
Unprotected
When /WP pin is high the Status register is unlocked and can
be written to after a Write Enable instruction, WEL=1.
1 0 X Power Supply
Lock-Down Status Register is protected and cannot be written to again
until the next power-down, power-up cycle.
(1)
1 1 X One Time
Program
(2)
Status Register is permanently protected and cannot be
written to.
Notes:
1. When SRP1, SRP0 = (1, 0), a power-down, power-up cycle will change SRP1, SRP0 to (0, 0) state.
2. This feature is available upon special order. Please contact Winbond for details.
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W25Q256FV
- 17 -
S15 S14 S13 S12 S11 S10 S9 S8
SUS CMP LB3 LB2 LB1 (R) QE SRP1
Status Register Protect 1
(Volatile/Non-Volatile Writable)
Complement Protect
(Volatile/Non-Volatile Writable)
Security Register Lock Bits
(Volatile/Non-Volatile OTP Writable)
Reserved
Quad Enable
(Volatile/Non-Volatile Writable)
Suspend Status
(Status-Only)
Figure 4b. Status Register-2
7.1.7 Erase/Program Suspend Status (SUS) – Status Only
The Suspend Status bit is a read only bit in the status register (S15) that is set to 1 after executing a
Erase/Program Suspend (75h) instruction. The SUS status bit is cleared to 0 by Erase/Program Resume
(7Ah) instruction as well as a power-down, power-up cycle.
7.1.8 Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable
The Security Register Lock Bits (LB3, LB2, LB1) are non-volatile One Time Program (OTP) bits in Status
Register (S13, S12, S11) that provide the write protect control and status to the Security Registers. The
default state of LB3-1 is 0, Security Registers are unlocked. LB3-1 can be set to 1 individually using the
Write Status Register instruction. LB3-1 are One Time Programmable (OTP), once it’s set to 1, the
corresponding 256-Byte Security Register will become read-only permanently.
7.1.9 Quad Enable (QE) – Volatile/Non-Volatile Writable
The Quad Enable (QE) bit is a non-volatile read/write bit in the status register (S9) that enables Quad SPI
operation. When the QE bit is set to a 0 state (factory default for part number with ordering options
“IG”,”IP” and “IF”), the /WP pin and /HOLD are enabled, the device operates in Standard/Dual SPI modes.
When the QE bit is set to a 1(factory default for Quad Enabled part numbers with ordering option “IQ”),
the Quad IO2 and IO3 pins are enabled, and /WP and /HOLD functions are disabled, the device operates
in Standard/Dual/Quad SPI modes.
QE bit is required to be set to a 1 before issuing an “Enter QPI (38h)” to switch the device from
Standard/Dual/Quad SPI to QPI, otherwise the command will be ignored. When the device is in QPI
mode, QE bit will remain to be 1. A “Write Status Register” command in QPI mode cannot change QE bit
from a “1” to a “0”.
WARNING: If the /WP or /HOLD pins are tied directly to the power supply or ground during
standard SPI or Dual SPI operation, the QE bit should never be set to a 1.
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S23 S22 S21 S20 S19 S18 S17 S16
HOLD
/RST DRV1 DRV0 (R) (R) WPS ADP ADS
Power Up Address Mode
(Non-Volatile Writable)
Output Driver Strength
(Volatile/Non-Volatile Writable)
Reserved
Write Protect Selection
(Volatile/Non-Volatile Writable)
Current Address Mode
(Status-Only)
/HOLD or /RESET Function
(Volatile/Non-Volatile Writable)
Figure 4c. Status Register-3
7.1.10 Current Address Mode (ADS) – Status Only
The Current Address Mode bit is a read only bit in the Status Register-3 that indicates which address
mode the device is currently operating in. When ADS=0, the device is in the 3-Byte Address Mode, when
ADS=1, the device is in the 4-Byte Address Mode.
7.1.11 Power-Up Address Mode (ADP) – Non-Volatile Writable
The ADP bit is a non-volatile bit that determines the initial address mode when the device is powered on
or reset. This bit is only used during the power on or device reset initialization period, and it is only
writable by the non-volatile Write Status sequence (06h + 11h). When ADP=0 (factory default), the device
will power up into 3-Byte Address Mode, the Extended Address Register must be used to access memory
regions beyond 128Mb. When ADP=1, the device will power up into 4-Byte Address Mode directly.
7.1.12 Write Protect Selection (WPS) – Volatile/Non-Volatile Writable
The WPS bit is used to select which Write Protect scheme should be used. When WPS=0, the device will
use the combination of CMP, TB, BP[3:0] bits to protect a specific area of the memory array. When
WPS=1, the device will utilize the Individual Block Locks to protect any individual sector or blocks. The
default value for all Individual Block Lock bits is 1 upon device power on or after reset.
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7.1.13 Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable
The DRV1 & DRV0 bits are used to determine the output driver strength for the Read operations.
DRV1, DRV0
Driver Strength
0, 0 100%
0, 1 75%
1, 0 50%
1, 1 25%(default)
7.1.14 /HOLD or /RESET Pin Function (HOLD/RST) – Volatile/Non-Volatile Writable
The HOLD/RST bit is used to determine whether /HOLD or /RESET function should be implemented on
the hardware pin. When HOLD/RST=0 (factory default), the pin acts as /HOLD; when HOLD/RST=1, the
pin acts as /RESET. However, /HOLD or /RESET functions are only available when QE=0. If QE is set to
1, the /HOLD and /RESET functions are disabled, the pin acts as a dedicated data I/O pin.
7.1.15 Reserved Bits – Non Functional
There are a few reserved Status Register bits that may be read out as a “0” or “1”. It is recommended to
ignore the values of those bits. During a “Write Status Register” instruction, the Reserved Bits can be
written as “0”, but there will not be any effects.
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W25Q256FV
Publication Release Date: April 29, 2013
- 20 - Preliminary - Revision F
7.1.16 W25Q256FV Status Register Memory Protection (WPS = 0, CMP = 0)
STATUS REGISTER
(1)
W25Q256FV (256M-BIT / 32M-BYTE) MEMORY PROTECTION
(2)
TB
BP3 BP2
BP1
BP0
PROTECTED
BLOCK(S)
PROTECTED
ADDRESSES
PROTECTED
DENSITY
PROTECTED
PORTION
X 0 0 0 0 NONE NONE NONE NONE
0 0 0 0 1 511 01FF0000h - 01FFFFFFh
64KB Upper 1/512
0 0 0 1 0 510 thru 511 01FE0000h - 01FFFFFFh
128KB Upper 1/256
0 0 0 1 1 508 thru 511 01FC0000h - 01FFFFFFh
256KB Upper 1/128
0 0 1 0 0 504 thru 511 01F80000h - 01FFFFFFh
512KB Upper 1/64
0 0 1 0 1 496 thru 511 01F00000h - 01FFFFFFh
1MB Upper 1/32
0 0 1 1 0 480 thru 511 01E00000h - 01FFFFFFh
2MB Upper 1/16
0 0 1 1 1 448 thru 511 01C00000h - 01FFFFFFh
4MB Upper 1/8
0 1 0 0 0 384 thru 511 01800000h - 01FFFFFFh 8MB Upper 1/4
0 1 0 0 1 256 thru 511 01000000h - 01FFFFFFh 16MB Upper 1/2
1 0 0 0 1 0 00000000h - 0000FFFFh 64KB Lower 1/512
1 0 0 1 0 0 thru 1 00000000h - 0001FFFFh 128KB Lower 1/256
1 0 0 1 1 0 thru 3 00000000h - 0003FFFFh 256KB Lower 1/128
1 0 1 0 0 0 thru 7 00000000h - 0007FFFFh 512KB Lower 1/64
1 0 1 0 1 0 thru 15 00000000h - 000FFFFFh 1MB Lower 1/32
1 0 1 1 0 0 thru 31 00000000h - 001FFFFFh 2MB Lower 1/16
1 0 1 1 1 0 thru 63 00000000h - 003FFFFFh 4MB Lower 1/8
1 1 0 0 0 0 thru 127 00000000h - 007FFFFFh 8MB Lower 1/4
1 1 0 0 1 0 thru 255 00000000h - 00FFFFFFh 16MB Lower 1/2
X 1 1 0 X 0 thru 511 00000000h - 01FFFFFFh 32MB ALL
X 1 X 1 X 0 thru 511 00000000h - 01FFFFFFh 32MB ALL
Notes:
1. X = don’t care
2. If any Erase or Program command specifies a memory region that contains protected data portion, this command will be
ignored.
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W25Q256FV
- 21 -
7.1.17 W25Q256FV Status Register Memory Protection (WPS = 0, CMP = 1)
STATUS REGISTER
(1)
W25Q256FV (256M-BIT / 32M-BYTE) MEMORY PROTECTION
(2)
TB
BP3 BP2
BP1
BP0
PROTECTED
BLOCK(S)
PROTECTED
ADDRESSES
PROTECTED
DENSITY
PROTECTED
PORTION
X 0 0 0 0 ALL 00000000h - 01FFFFFFh ALL ALL
0 0 0 0 1 0 thru 510 00000000h - 01FEFFFFh
32,704KB Lower 511/512
0 0 0 1 0 0 thru 509 00000000h - 01FDFFFFh
32,640KB Lower 255/256
0 0 0 1 1 0 thru 507 00000000h - 01FBFFFFh
32,512KB Lower 127/128
0 0 1 0 0 0 thru 503 00000000h - 01F7FFFFh 32,256KB Lower 63/64
0 0 1 0 1 0 thru 495 00000000h - 01EFFFFFh
31MB Lower 31/32
0 0 1 1 0 0 thru 479 00000000h - 01DFFFFFh
30MB Lower 15/16
0 0 1 1 1 0 thru 447 00000000h - 01BFFFFFh
28MB Lower 7/8
0 1 0 0 0 0 thru 383 00000000h - 017FFFFFh 24MB Lower 3/4
0 1 0 0 1 0 thru 255 00000000h - 00FFFFFFh 16MB Lower 1/2
1 0 0 0 1 1 thru 511 00010000h - 01FFFFFFh 32,704KB Upper 511/512
1 0 0 1 0 2 thru 511 00020000h - 01FFFFFFh 32,640KB Upper 255/256
1 0 0 1 1 4 thru 511 00040000h - 01FFFFFFh 32,512KB Upper 127/128
1 0 1 0 0 8 thru 511 00080000h - 01FFFFFFh 32,256KB Upper 63/64
1 0 1 0 1 16 thru 511 00100000h - 01FFFFFFh 31MB Upper 31/32
1 0 1 1 0 32 thru 511 00200000h - 01FFFFFFh 30MB Upper 15/16
1 0 1 1 1 64 thru 511 00400000h - 01FFFFFFh 28MB Upper 7/8
1 1 0 0 0 128 thru 511 00800000h - 01FFFFFFh 24MB Upper 3/4
1 1 0 0 1 256 thru 511 01000000h - 01FFFFFFh 16MB Upper 1/2
X 1 1 0 X NONE NONE NONE NONE
X 1 X 1 X NONE NONE NONE NONE
Notes:
1. X = don’t care
2. If any Erase or Program command specifies a memory region that contains protected data portion, this command will be
ignored.
winband 1'. Sector 15 (4KB) 4— ,\ : A Sector 14 (4K3) <7 m="" m="" 5="" ¥="" 5="" 9="" 9="" sector="" 1="" (4kb)="" 47="" ed="" individual="" block="" locks:="" 590“”="" 0="" w3)="" ‘—="" 32="" sectors="" (toplbottom)="" 510="" blocks="" block="" 510="" (64kb)="" ‘—="" lndlv‘dua‘="" block="" lock:="" 36h="" +addrsss="" indlvwdual="" block="" umock:="" ‘="" \="" ¥="" 39h="" +addrsss="" read="" block="" lock="" 30h="" +address="" block="" 1="" (64kb)="" ‘7="" globa\="" block="" lock="" 7eh="" sector="" 15="" (4k3)=""><7 ggbm="" block="" unlock="" o="" a="" sector14(4kb)="" ‘—="" x="" q="" .="" :5="" g="" :="" m="" "="" sector="" 1="" (4k3)="" ‘—="" sectoro(4kb)="" 47="">
W25Q256FV
Publication Release Date: April 29, 2013
- 22 - Preliminary - Revision F
7.1.18 W25Q256FV Individual Block Memory Protection (WPS=1)
Figure 4d. Individual Block/Sector Locks
Notes:
1. Individual Block/Sector protection is only valid when WPS=1.
2. All individual block/sector lock bits are set to 1 by default after power up, all memory array is protected.
'1' winband 1'. EA7 EAfi EA5 EA4 EA3 EA2 EA1 EAD A31 A30 A29 A28 A27 A26 A25 A24 Reserved for mgher densmes 5 1 2M in ~ SZGb (Vu‘allle Wmable omy) Address alum e‘ect \ower128Mb e‘ect upper 128Mb (Vo‘allle wmame omy)
W25Q256FV
- 23 -
7.2 Extended Address Register – Volatile Writable Only
In addition to the Status Registers, W25Q256FV provides a volatile Extended Address Register which
consists of the 4
th
byte of memory address. The Extended Address Register is used only when the device
is operating in the 3-Byte Address Mode (ADS=0). The lower 128Mb memory array (00000000h –
00FFFFFFh) is selected when A24=0, all instructions with 3-Byte addresses will be executed within that
region. When A24=1, the upper 128Mb memory array (01000000h – 01FFFFFFh) will be selected.
If the device powers up with ADP bit set to 1, or an “Enter 4-Byte Address Mode (B7h)” instruction is
issued, the device will require 4-Byte address input for all address related instructions, and the Extended
Address Register setting will be ignored. However, any command with 4-byte address input will replace
the Extended Address Register Bits (A31-A24) with new settings.
Upon power up or after the execution of a Software/Hardware Reset, the Extended Address Register
values will be cleared to 0.
Figure 4e. Extended Address Register
'1. winband 1'.
W25Q256FV
Publication Release Date: April 29, 2013
- 24 - Preliminary - Revision F
8. INSTRUCTIONS
The Standard/Dual/Quad SPI instruction set of the W25Q256FV consists of 48 basic instructions that are
fully controlled through the SPI bus (see Instruction Set Table1-3). Instructions are initiated with the falling
edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction code.
Data on the DI input is sampled on the rising edge of clock with most significant bit (MSB) first.
The QPI instruction set of the W25Q256FV consists of 35 basic instructions that are fully controlled
through the SPI bus (see Instruction Set Table 4-6). Instructions are initiated with the falling edge of Chip
Select (/CS). The first byte of data clocked through IO[3:0] pins provides the instruction code. Data on all
four IO pins are sampled on the rising edge of clock with most significant bit (MSB) first. All QPI
instructions, addresses, data and dummy bytes are using all four IO pins to transfer every byte of data
with every two serial clocks (CLK).
SPI/QPI Protocol 3-Byte Address Mode (ADS=0)
4-Byte Address Mode (ADS=1)
Standard/Dual/Quad SPI Instruction Set Table 1 & 2 Instruction Set Table 1 & 3
QPI Instruction Set Table 4 & 5 Instruction Set Table 4 & 6
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in Figures 5
through 57. All read instructions can be completed after any clocked bit. However, all instructions that
Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been
clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent
writes. Additionally, while the memory is being programmed or erased, or when the Status Register is
being written, all instructions except for Read Status Register will be ignored until the program or erase
cycle has completed.
8.1 Device ID and Instruction Set Tables
8.1.1 Manufacturer and Device Identification
MANUFACTURER ID (MF7 - MF0)
Winbond Serial Flash
EFh
Device ID (ID7 - ID0) (ID15 - ID0)
Instruction ABh, 90h, 92h, 94h 9Fh
W25Q256FV (SPI Mode) 18h 4019h
W25Q256FV (QPI Mode) 18h 6019h
winband gag"
W25Q256FV
- 25 -
8.1.2 Instruction Set Table 1 (Standard/Dual/Quad SPI, 3-Byte & 4-Byte Address Mode)
(1)
Data Input Output Byte 1
Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7
Clock Number (0 – 7)
(8 – 15) (16 – 23) (24 – 31) (32 – 39) (40 – 47) (48 – 55)
Write Enable 06h
Volatile SR Write Enable 50h
Write Disable 04h
Read Status Register-1 05h (S7-S0)
(2)
Write Status Register-1
(4)
01h (S7-S0)
(4)
Read Status Register-2 35h (S15-S8)
(2)
Write Status Register-2 31h (S15-S8)
Read Status Register-3 15h (S23-S16)
(2)
Write Status Register-3 11h (S23-S16)
Read Extended Addr. Register
C8h (EA7-EA0)
(2)
Write Extended Addr. Register
C5h (EA7-EA0)
Chip Erase C7h/60h
Erase / Program Suspend 75h
Erase / Program Resume 7Ah
Power-down B9h
Release Power-down / ID ABh Dummy Dummy Dummy (ID7-ID0)
(2)
Manufacturer/Device ID 90h Dummy Dummy 00h (MF7-MF0) (ID7-ID0)
JEDEC ID 9Fh (MF7-MF0) (ID15-ID8) (ID7-ID0)
Global Block Lock 7Eh
Global Block Unlock 98h
Enter QPI Mode 38h
Enter 4-Byte Address Mode B7h
Exit 4-Byte Address Mode E9h
Enable Reset 66h
Reset Device 99h
Read Data
with 4-Byte Address 13h A31-A24 A23-A16 A15-A8 A7-A0 (D7-D0)
Fast Read
with 4-Byte Address 0Ch A31-A24 A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Fast Read Dual Output
with 4-Byte Address 3Ch A31-A24 A23-A16 A15-A8 A7-A0 Dummy (D7-D0, …)
(7)
Fast Read Quad Output
with 4-Byte Address 6Ch A31-A24 A23-A16 A15-A8 A7-A0 Dummy (D7-D0, …)
(9)
Data Input Output Byte 1
Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7
Clock Number (0 – 7)
(8 – 11) (12 – 15) (16 – 19) (20 – 23) (24 – 27) (28 – 31)
Fast Read Dual I/O
with 4-Byte Address BCh A31-A24 A23-A16 A15-A8 A7-A0 M7-M0 (D7-D0)
Data Input Output Byte 1
Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7 Byte 8 Byte 9
Clock Number (0 – 7)
(8, 9) (10, 11) (12, 13) (14, 15) (16, 17) (18, 19) (20, 21) (22, 23)
Fast Read Quad I/O
with 4-Byte Address ECh A31-A24 A23-A16 A15-A8 A7-A0 M7-M0 Dummy Dummy (D7-D0)
winband gag"
W25Q256FV
Publication Release Date: April 29, 2013
- 26 - Preliminary - Revision F
8.1.3 Instruction Set Table 2 (Standard/Dual/Quad SPI Instructions, 3-Byte Address Mode)
(1)
Data Input Output Byte 1
Byte 2 Byte 3 Byte 4 Byte 5 Byte 6
Clock Number (0 – 7)
(8 – 15) (16 – 23) (24 – 31) (32 – 39) (40 – 47)
Read Unique ID 4Bh Dummy Dummy Dummy Dummy (UID63-UID0)
Page Program 02h A23-A16 A15-A8 A7-A0 D7-D0 D7-D0
(3)
Quad Page Program 32h A23-A16 A15-A8 A7-A0 D7-D0, …
(9)
D7-D0, …
(3)
Sector Erase (4KB) 20h A23-A16 A15-A8 A7-A0
Block Erase (32KB) 52h A23-A16 A15-A8 A7-A0
Block Erase (64KB) D8h A23-A16 A15-A8 A7-A0
Read Data 03h A23-A16 A15-A8 A7-A0 (D7-D0)
Fast Read 0Bh A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Fast Read Dual Output 3Bh A23-A16 A15-A8 A7-A0 Dummy (D7-D0, …)
(7)
Fast Read Quad Output 6Bh A23-A16 A15-A8 A7-A0 Dummy (D7-D0, …)
(9)
Read SFDP Register 5Ah A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Erase Security Register
(5)
44h A23-A16 A15-A8 A7-A0
Program Security Register
(5)
42h A23-A16 A15-A8 A7-A0 D7-D0 D7-D0
(3)
Read Security Register
(5)
48h A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Individual Block Lock 36h A23-A16 A15-A8 A7-A0
Individual Block Unlock 39h A23-A16 A15-A8 A7-A0
Read Block Lock 3Dh A23-A16 A15-A8 A7-A0 D7-D0
Data Input Output Byte 1
Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7
Clock Number (0 – 7)
(8 – 11) (12 – 15) (16 – 19) (20 – 23) (24 – 27) (28 – 31)
Fast Read Dual I/O BBh A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Mftr./Device ID Dual I/O 92h A23-A16 A15-A8 A7-A0 Dummy (MF7-MF0) (ID7-ID0)
Data Input Output Byte 1
Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7
Byte 8 Byte 9
Clock Number (0 – 7)
(8, 9) (10, 11) (12, 13) (14, 15) (16, 17) (18, 19)
(20, 21) (22, 23)
Set Burst with Wrap 77h Dummy Dummy Dummy W8-W0
Fast Read Quad I/O EBh A23-A16
A15-A8 A7-A0 M7-M0 Dummy Dummy
(D7-D0) (D7-D0)
Word Read Quad I/O
(12)
E7h A23-A16
A15-A8 A7-A0 M7-M0 Dummy (D7-D0)
(D7-D0) (D7-D0)
Octal Word Read Quad I/O
(13)
E3h A23-A16
A15-A8 A7-A0 M7-M0 (D7-D0)
(D7-D0)
(D7-D0) (D7-D0)
Mftr./Device ID Quad I/O 94h A23-A16
A15-A8 A7-A0 M7-M0 Dummy Dummy
(MF7-MF0)
(ID7-ID0)
winband gag"
W25Q256FV
- 27 -
8.1.4 Instruction Set Table 3 (Standard/Dual/Quad SPI Instructions, 4-Byte Address Mode)
(1)
Data Input Output Byte 1
Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7
Clock Number (0 – 7)
(8 – 15) (16 – 23) (24 – 31) (32 – 39) (40 – 47) (48 – 55)
Read Unique ID 4Bh Dummy Dummy Dummy Dummy Dummy (UID63-UID0)
Page Program 02h A31-A24 A23-A16 A15-A8 A7-A0 D7-D0 D7-D0
(3)
Quad Page Program 32h A31-A24 A23-A16 A15-A8 A7-A0 D7-D0, …
(9)
D7-D0, …
(3)
Sector Erase (4KB) 20h A31-A24 A23-A16 A15-A8 A7-A0
Block Erase (32KB) 52h A31-A24 A23-A16 A15-A8 A7-A0
Block Erase (64KB) D8h A31-A24 A23-A16 A15-A8 A7-A0
Read Data 03h A31-A24 A23-A16 A15-A8 A7-A0 (D7-D0)
Fast Read 0Bh A31-A24 A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Fast Read Dual Output 3Bh A31-A24 A23-A16 A15-A8 A7-A0 Dummy (D7-D0, …)
(7)
Fast Read Quad Output 6Bh A31-A24 A23-A16 A15-A8 A7-A0 Dummy (D7-D0, …)
(9)
Read SFDP Register 5Ah A31-A24 A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Erase Security Register
(5)
44h A31-A24 A23-A16 A15-A8 A7-A0
Program Security Register
(5)
42h A31-A24 A23-A16 A15-A8 A7-A0 D7-D0 D7-D0
(3)
Read Security Register
(5)
48h A31-A24 A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Individual Block Lock 36h A31-A24 A23-A16 A15-A8 A7-A0
Individual Block Unlock 39h A31-A24 A23-A16 A15-A8 A7-A0
Read Block Lock 3Dh A31-A24 A23-A16 A15-A8 A7-A0 D7-D0
Data Input Output Byte 1
Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7 Byte 8
Clock Number (0 – 7)
(8 – 11) (12 – 15) (16 – 19) (20 – 23) (24 – 27) (28 – 31) (32 – 35)
Fast Read Dual I/O BBh A31-A24 A23-A16 A15-A8 A7-A0 Dummy (D7-D0) (D7-D0)
Mftr./Device ID Dual I/O 92h A31-A24 A23-A16 A15-A8 A7-A0 Dummy (MF7-MF0)
(ID7-ID0)
Data Input Output Byte 1
Byte 2
Byte 3
Byte 4
Byte 5
Byte 6
Byte 7
Byte 8
Byte 9 Byte 10
Clock Number (0 – 7)
(8, 9) (10, 11)
(12, 13)
(14, 15)
(16, 17)
(18, 19)
(20, 21)
(22, 23) (24, 25)
Set Burst with Wrap 77h Dummy
Dummy
Dummy
Dummy
W8-W0
Fast Read Quad I/O EBh A31-A24
A23-A16
A15-A8
A7-A0 M7-M0
Dummy
Dummy
(D7-D0) (D7-D0)
Word Read Quad I/O
(12)
E7h A31-A24
A23-A16
A15-A8
A7-A0 M7-M0
Dummy
(D7-D0)
(D7-D0) (D7-D0)
Octal Word Read Quad I/O
(13)
E3h A31-A24
A23-A16
A15-A8
A7-A0 M7-M0
(D7-D0)
(D7-D0)
(D7-D0) (D7-D0)
Mftr./Device ID Quad I/O 94h A31-A24
A23-A16
A15-A8
A7-A0 M7-M0
Dummy
Dummy
(MF7-MF0)
(ID7-ID0)
1" winband 1..
W25Q256FV
Publication Release Date: April 29, 2013
- 28 - Preliminary - Revision F
8.1.5 Instruction Set Table 4 (QPI Instructions, 3-Byte & 4-Byte Address Mode)
(14)
Data Input Output Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6
Clock Number (0, 1) (2, 3) (4, 5) (6, 7) (8, 9) (10, 11)
Write Enable 06h
Volatile SR Write Enable 50h
Write Disable 04h
Read Status Register-1 05h (S7-S0)
(2)
Write Status Register-1
(4)
01h (S7-S0)
(4)
Read Status Register-2 35h (S15-S8)
(2)
Write Status Register-2 31h (S15-S8)
Read Status Register-3 15h (S23-S16)
(2)
Write Status Register-3 11h (S23-S16)
Read Extended Addr. Register
C8h (EA7-EA0)
(2)
Write Extended Addr. Register
C5h (EA7-EA0)
Chip Erase C7h/60h
Erase / Program Suspend 75h
Erase / Program Resume 7Ah
Power-down B9h
Set Read Parameters C0h P7-P0
Release Powerdown / ID ABh Dummy Dummy Dummy (ID7-ID0)
(2)
Manufacturer/Device ID 90h Dummy Dummy 00h (MF7-MF0) (ID7-ID0)
JEDEC ID 9Fh (MF7-MF0) (ID15-ID8) (ID7-ID0)
Global Block Lock 7Eh
Global Block Unlock 98h
Exit QPI Mode FFh
Enter 4-Byte Address Mode B7h
Exit 4-Byte Address Mode E9h
Enable Reset 66h
Reset Device 99h
1" winband '1.
W25Q256FV
- 29 -
8.1.6 Instruction Set Table 5 (QPI Instructions, 3-Byte Address Mode)
(14)
Data Input Output Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6
Clock Number (0, 1) (2, 3) (4, 5) (6, 7) (8, 9) (10, 11)
Page Program 02h A23-A16 A15-A8 A7-A0 D7-D0
(9)
D7-D0
(3)
Sector Erase (4KB) 20h A23-A16 A15-A8 A7-A0
Block Erase (32KB) 52h A23-A16 A15-A8 A7-A0
Block Erase (64KB) D8h A23-A16 A15-A8 A7-A0
Fast Read 0Bh A23-A16 A15-A8 A7-A0 Dummy
(15)
(D7-D0)
Burst Read with Wrap
(16)
0Ch A23-A16 A15-A8 A7-A0 Dummy
(15)
(D7-D0)
Fast Read Quad I/O EBh A23-A16 A15-A8 A7-A0 M7-M0
(15)
(D7-D0)
Individual Block Lock 36h A23-A16 A15-A8 A7-A0
Individual Block Unlock 39h A23-A16 A15-A8 A7-A0
Read Block Lock 3Dh A23-A16 A15-A8 A7-A0 (L7-L0)
8.1.7 Instruction Set Table 6 (QPI Instructions, 4-Byte Address Mode)
(14)
Data Input Output Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7
Clock Number (0, 1) (2, 3) (4, 5) (6, 7) (8, 9) (10, 11) (12, 13)
Page Program 02h A31-A24 A23-A16 A15-A8 A7-A0 D7-D0
(9)
D7-D0
(3)
Sector Erase (4KB) 20h A31-A24 A23-A16 A15-A8 A7-A0
Block Erase (32KB) 52h A31-A24 A23-A16 A15-A8 A7-A0
Block Erase (64KB) D8h A31-A24 A23-A16 A15-A8 A7-A0
Fast Read 0Bh A31-A24 A23-A16 A15-A8 A7-A0 Dummy
(15)
(D7-D0)
Burst Read with Wrap
(16)
0Ch A31-A24 A23-A16 A15-A8 A7-A0 Dummy
(15)
(D7-D0)
Fast Read Quad I/O EBh A31-A24 A23-A16 A15-A8 A7-A0 M7-M0
(15)
(D7-D0)
Individual Block Lock 36h A31-A24 A23-A16 A15-A8 A7-A0
Individual Block Unlock 39h A31-A24 A23-A16 A15-A8 A7-A0
Read Block Lock 3Dh A31-A24 A23-A16 A15-A8 A7-A0 (L7-L0)
1" winband .1. CLK#0 1 2 3 4 5 6 7 8 9 1011
W25Q256FV
Publication Release Date: April 29, 2013
- 30 - Preliminary - Revision F
Notes:
1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data
output from the device on either 1, 2 or 4 IO pins.
2. The Status Register contents and Device ID will repeat continuously until /CS terminates the instruction.
3. At least one byte of data input is required for Page Program, Quad Page Program and Program Security
Registers, up to 256 bytes of data input. If more than 256 bytes of data are sent to the device, the
addressing will wrap to the beginning of the page and overwrite previously sent data.
4. Write Status Register-1 (01h) can also be used to program Status Register-1&2, see section 8.2.5.
5. Security Register Address:
Security Register 1: A23-16 = 00h; A15-8 = 10h; A7-0 = byte address
Security Register 2: A23-16 = 00h; A15-8 = 20h; A7-0 = byte address
Security Register 3: A23-16 = 00h; A15-8 = 30h; A7-0 = byte address
6. Dual SPI address input format:
IO0 = A22, A20, A18, A16, A14, A12, A10, A8 A6, A4, A2, A0, M6, M4, M2, M0
IO1 = A23, A21, A19, A17, A15, A13, A11, A9 A7, A5, A3, A1, M7, M5, M3, M1
7. Dual SPI data output format:
IO0 = (D6, D4, D2, D0)
IO1 = (D7, D5, D3, D1)
8. Quad SPI address input format: Set Burst with Wrap input format:
IO0 = A20, A16, A12, A8, A4, A0, M4, M0 IO0 = x, x, x, x, x, x, W4, x
IO1 = A21, A17, A13, A9, A5, A1, M5, M1 IO1 = x, x, x, x, x, x, W5, x
IO2 = A22, A18, A14, A10,
A6, A2, M6, M2 IO2 = x, x, x, x, x, x, W6, x
IO3 = A23, A19, A15, A11,
A7, A3, M7, M3 IO3 = x, x, x, x, x, x, x,
x
9. Quad SPI data input/output format:
IO0 = (D4, D0, …..)
IO1 = (D5, D1, …..)
IO2 = (D6, D2, …..)
IO3 = (D7, D3, …..)
10. Fast Read Quad I/O data output format:
IO0 = (x, x, x, x, D4, D0, D4, D0)
IO1 = (x, x, x, x, D5, D1, D5, D1)
IO2 = (x, x, x, x, D6, D2, D6, D2)
IO3 = (x, x, x, x, D7, D3, D7, D3)
11. Word Read Quad I/O data output format:
IO0 = (x, x, D4, D0, D4, D0, D4, D0)
IO1 = (x, x, D5, D1, D5, D1, D5, D1)
IO2 = (x, x, D6, D2, D6, D2, D6, D2)
IO3 = (x, x, D7, D3, D7, D3, D7, D3)
12. For Word Read Quad I/O, the lowest address bit must be 0. (A0 = 0)
13. For Octal Word Read Quad I/O, the lowest four address bits must be 0. (A3, A2, A1, A0 = 0)
14. QPI Command, Address, Data input/output format:
CLK # 0 1 2 3 4 5 6 7 8 9 10 11
IO0 = C4, C0, A20, A16, A12, A8, A4, A0, D4, D0, D4, D0
IO1 = C5, C1, A21, A17, A13, A9, A5, A1, D5, D1, D5, D1
IO2 = C6, C2, A22, A18, A14, A10, A6, A2, D6, D2, D6, D2
IO3 = C7, C3, A23, A19, A15, A11, A7, A3, D7, D3, D7, D3
15. The number of dummy clocks for QPI Fast Read, QPI Fast Read Quad I/O & QPI Burst Read with Wrap is
controlled by read parameter P7 – P4.
16. The wrap around length for QPI Burst Read with Wrap is controlled by read parameter P3 – P0.
1'. winband 1..
W25Q256FV
- 31 -
8.2 Instruction Descriptions
8.2.1 Write Enable (06h)
The Write Enable instruction (Figure 5) sets the Write Enable Latch (WEL) bit in the Status Register to a
1. The WEL bit must be set prior to every Page Program, Quad Page Program, Sector Erase, Block
Erase, Chip Erase, Write Status Register and Erase/Program Security Registers instruction. The Write
Enable instruction is entered by driving /CS low, shifting the instruction code “06h” into the Data Input (DI)
pin on the rising edge of CLK, and then driving /CS high.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Mode 0
Mode 3
Instruction (06h)
High Impedance
/CS
CLK
Mode 0
Mode 3 0 1
Mode 0
Mode 3
IO
0
IO
1
IO
2
IO
3
06h
Instruction
Figure 5. Write Enable Instruction for SPI Mode (left) or QPI Mode (right)
8.2.2 Write Enable for Volatile Status Register (50h)
The non-volatile Status Register bits described in section 7.1 can also be written to as volatile bits. This
gives more flexibility to change the system configuration and memory protection schemes quickly without
waiting for the typical non-volatile bit write cycles or affecting the endurance of the Status Register non-
volatile bits. To write the volatile values into the Status Register bits, the Write Enable for Volatile Status
Register (50h) instruction must be issued prior to a Write Status Register (01h) instruction. Write Enable
for Volatile Status Register instruction (Figure 6) will not set the Write Enable Latch (WEL) bit, it is only
valid for the Write Status Register instruction to change the volatile Status Register bit values.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Mode 0
Mode 3
Instruction (50h)
High Impedance
/CS
CLK
Mode 0
Mode 3 0 1
Mode 0
Mode 3
IO
0
IO
1
IO
2
IO
3
50h
Instruction
Figure 6. Write Enable for Volatile Status Register Instruction for SPI Mode (left) or QPI Mode (right)
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W25Q256FV
Publication Release Date: April 29, 2013
- 32 - Preliminary - Revision F
8.2.3 Write Disable (04h)
The Write Disable instruction (Figure 7) resets the Write Enable Latch (WEL) bit in the Status Register to
a 0. The Write Disable instruction is entered by driving /CS low, shifting the instruction code “04h” into the
DI pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up and upon
completion of the Write Status Register, Erase/Program Security Registers, Page Program, Quad Page
Program, Sector Erase, Block Erase, Chip Erase and Reset instructions.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Mode 0
Mode 3
Instruction (04h)
High Impedance
/CS
CLK
Mode 0
Mode 3 0 1
Mode 0
Mode 3
IO
0
IO
1
IO
2
IO
3
04h
Instruction
Figure 7. Write Disable Instruction for SPI Mode (left) or QPI Mode (right)
8.2.4 Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h)
The Read Status Register instructions allow the 8-bit Status Registers to be read. The instruction is
entered by driving /CS low and shifting the instruction code “05h” for Status Register-1, “35h” for Status
Register-2 or “15h” for Status Register-3 into the DI pin on the rising edge of CLK. The status register bits
are then shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 8. Refer to section 7.1 for Status Register descriptions.
The Read Status Register instruction may be used at any time, even while a Program, Erase or Write
Status Register cycle is in progress. This allows the BUSY status bit to be checked to determine when
the cycle is complete and if the device can accept another instruction. The Status Register can be read
continuously, as shown in Figure 8. The instruction is completed by driving /CS high.
Figure 8a. Read Status Register Instruction (SPI Mode)
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W25Q256FV
- 33 -
Figure 8b. Read Status Register Instruction (QPI Mode)
8.2.5 Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h)
The Write Status Register instruction allows the Status Registers to be written. The writable Status
Register bits include: SRP0, TB, BP[3:0] in Status Register-1; CMP, LB[3:1], QE, SRP1 in Status
Register-2; HOLD/RST, DRV1, DRV0, WPS & ADP in Status Register-3. All other Status Register bit
locations are read-only and will not be affected by the Write Status Register instruction. LB[3:1] are non-
volatile OTP bits, once it is set to 1, it cannot be cleared to 0.
To write non-volatile Status Register bits, a standard Write Enable (06h) instruction must previously have
been executed for the device to accept the Write Status Register instruction (Status Register bit WEL
must equal 1). Once write enabled, the instruction is entered by driving /CS low, sending the instruction
code “01h/31h/11h”, and then writing the status register data byte as illustrated in Figure 9a & 9b.
To write volatile Status Register bits, a Write Enable for Volatile Status Register (50h) instruction must
have been executed prior to the Write Status Register instruction (Status Register bit WEL remains 0).
However, SRP1 and LB[3:1] cannot be changed from “1” to “0” because of the OTP protection for these
bits. Upon power off or the execution of a Software/Hardware Reset, the volatile Status Register bit
values will be lost, and the non-volatile Status Register bit values will be restored.
During non-volatile Status Register write operation (06h combined with 01h/31h/11h), after /CS is driven
high, the self-timed Write Status Register cycle will commence for a time duration of t
W
(See AC
Characteristics). While the Write Status Register cycle is in progress, the Read Status Register
instruction may still be accessed to check the status of the BUSY bit. The BUSY bit is a 1 during the
Write Status Register cycle and a 0 when the cycle is finished and ready to accept other instructions
again. After the Write Status Register cycle has finished, the Write Enable Latch (WEL) bit in the Status
Register will be cleared to 0.
During volatile Status Register write operation (50h combined with 01h/31h/11h), after /CS is driven high,
the Status Register bits will be refreshed to the new values within the time period of t
SHSL2
(See AC
Characteristics). BUSY bit will remain 0 during the Status Register bit refresh period.
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W25Q256FV
Publication Release Date: April 29, 2013
- 34 - Preliminary - Revision F
The Write Status Register instruction can be used in both SPI mode and QPI mode. However, the QE bit
cannot be written to when the device is in the QPI mode, because QE=1 is required for the device to
enter and operate in the QPI mode.
Refer to section 7.1 for Status Register descriptions. Factory default for all status Register bits are 0.
Figure 9a. Write Status Register-1/2/3 Instruction (SPI Mode)
Figure 9b. Write Status Register-1/2/3 Instruction (QPI Mode)
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W25Q256FV
- 35 -
The W25Q256FV is also backward compatible to Winbond’s previous generations of serial flash
memories, in which the Status Register-1&2 can be written using a single “Write Status Register-1 (01h)”
command. To complete the Write Status Register-1&2 instruction, the /CS pin must be driven high after
the sixteenth bit of data that is clocked in as shown in Figure 9c & 9d. If /CS is driven high after the eighth
clock, the Write Status Register-1 (01h) instruction will only program the Status Register-1, the Status
Register-2 will not be affected (Previous generations will clear CMP and QE bits).
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (01h)
High Impedance
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
7 6 5 4 3 2 1 0 15 14 13 12 11 10 9 8
Status Register 1 in Status Register 2 in
Mode 0
Mode 3
* *
= MSB
*
Figure 9c. Write Status Register-1/2 Instruction (SPI Mode)
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
01h
2 3 4 5
4 0 12 8
5 1
6 2
7 3
13 9
14 10
15 11
SR1 in SR2 in
Mode 0
Mode 3
Instruction
Figure 9d. Write Status Register-1/2 Instruction (QPI Mode)
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W25Q256FV
Publication Release Date: April 29, 2013
- 36 - Preliminary - Revision F
8.2.6 Read Extended Address Register (C8h)
When the device is in the 3-Byte Address Mode, the Extended Address Register is used as the 4
th
address byte A[31:24] to access memory regions beyond 128Mb. The Read Extended Address Register
instruction is entered by driving /CS low and shifting the instruction code “C8h” into the DI pin on the
rising edge of CLK. The Extended Address Register bits are then shifted out on the DO pin at the falling
edge of CLK with most significant bit (MSB) first as shown in Figure 10.
When the device is in the 4-Byte Address Mode, the Extended Address Register is not used.
Figure 10a. Read Extended Address Register Instruction (SPI Mode)
Figure 10b. Read Extended Address Register Instruction (QPI Mode)
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W25Q256FV
- 37 -
8.2.7 Write Extended Address Register (C5h)
The Extended Address Register is a volatile register that stores the 4
th
byte address (A31-A24) when the
device is operating in the 3-Byte Address Mode (ADS=0). To write the Extended Address Register bits, a
Write Enable (06h) instruction must previously have been executed for the device to accept the Write
Extended Address Register instruction (Status Register bit WEL must equal 1). Once write enabled, the
instruction is entered by driving /CS low, sending the instruction code “C5h”, and then writing the
Extended Address Register data byte as illustrated in Figure 11.
Upon power up or the execution of a Software/Hardware Reset, the Extended Address Register bit values
will be cleared to 0.
The Extended Address Register is only effective when the device is in the 3-Byte Address Mode. When
the device operates in the 4-Byte Address Mode (ADS=1), any command with address input of A31-A24
will replace the Extended Address Register values. It is recommended to check and update the Extended
Address Register if necessary when the device is switched from 4-Byte to 3-Byte Address Mode.
Figure 11a. Write Extended Address Register Instruction (SPI Mode)
Figure 11b. Write Extended Address Register Instruction (QPI Mode)
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W25Q256FV
Publication Release Date: April 29, 2013
- 38 - Preliminary - Revision F
8.2.8 Enter 4-Byte Address Mode (B7h)
The Enter 4-Byte Address Mode instruction (Figure 12) will allow 32-bit address (A31-A0) to be used to
access the memory array beyond 128Mb. The Enter 4-Byte Address Mode instruction is entered by
driving /CS low, shifting the instruction code “B7h” into the DI pin and then driving /CS high.
Figure 12. Enter 4-Byte Address Mode instruction for SPI Mode (left) or QPI Mode (right)
8.2.9 Exit 4-Byte Address Mode (E9h)
In order to be backward compatible, the Exit 4-Byte Address Mode instruction (Figure 13) will only allow
24-bit address (A23-A0) to be used to access the memory array up to 128Mb. The Extended Address
Register must be used to access the memory array beyond 128Mb. The Exit 4-Byte Address Mode
instruction is entered by driving /CS low, shifting the instruction code “E9h” into the DI pin and then driving
/CS high.
/CS
CLK Mode 0
Mode 3 0 1
Mode 0
Mode 3
IO0
IO1
IO2
IO3
E9h
Instruction
Figure 13. Exit 4-Byte Address Mode instruction for SPI Mode (left) or QPI Mode (right)
'1. winband 1'.
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8.2.10 Read Data (03h)
The Read Data instruction allows one or more data bytes to be sequentially read from the memory. The
instruction is initiated by driving the /CS pin low and then shifting the instruction code “03h” followed by a
24-bit address (A23-A0) or a 32-bit address (A31-A0) into the DI pin. The code and address bits are
latched on the rising edge of the CLK pin. After the address is received, the data byte of the addressed
memory location will be shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB)
first. The address is automatically incremented to the next higher address after each byte of data is
shifted out allowing for a continuous stream of data. This means that the entire memory can be accessed
with a single instruction as long as the clock continues. The instruction is completed by driving /CS high.
The Read Data instruction sequence is shown in Figure 14. If a Read Data instruction is issued while an
Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any
effects on the current cycle. The Read Data instruction allows clock rates from D.C. to a maximum of f
R
(see AC Electrical Characteristics).
The Read Data (03h) instruction is only supported in Standard SPI mode.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (03h)
High Impedance
8 9 10 28 29 30 31 32 33 34 35 36 37 38 39
765432107
24-Bit Address
23 22 21 3 2 1 0
Data Out 1
*
*
= MSB
*
Figure 14. Read Data Instruction (SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
Publication Release Date: April 29, 2013
- 40 - Preliminary - Revision F
8.2.11 Read Data with 4-Byte Address (13h)
The Read Data with 4-Byte Address instruction is similar to the Read Data (03h) instruction. Instead of
24-bit address, 32-bit address is needed following the instruction code 13h. No matter the device is
operating in 3-Byte Address Mode or 4-byte Address Mode, the Read Data with 4-Byte Address
instruction will always require 32-bit address to access the entire 256Mb memory.
The Read Data with 4-Byte Address instruction sequence is shown in Figure 15. If this instruction is
issued while an Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will
not have any effects on the current cycle. The Read Data with 4-Byte Address instruction allows clock
rates from D.C. to a maximum of f
R
(see AC Electrical Characteristics).
The Read Data with 4-Byte Address (13h) instruction is only supported in Standard SPI mode.
Figure 15. Read Data with 4-Byte Address Instruction (SPI Mode only)
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8.2.12 Fast Read (0Bh)
The Fast Read instruction is similar to the Read Data instruction except that it can operate at the highest
possible frequency of F
R
(see AC Electrical Characteristics). This is accomplished by adding eight
“dummy” clocks after the 24/32-bit address as shown in Figure 16. The dummy clocks allow the devices
internal circuits additional time for setting up the initial address. During the dummy clocks the data value
on the DO pin is a “don’t care”.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (0Bh)
High Impedance
8 9 10 28 29 30 31
24-Bit Address
23 22 21 3 2 1 0
Data Out 1
*
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
32 33 34 35 36 37 38 39
Dummy Clocks
High Impedance
40 41 42 44 45 46 47 48 49 50 51 52 53 54 55
7 6 5 4 3 2 1 0 7
Data Out 2
*
7 6 5 4 3 2 1 0
*
4331
0
= MSB
*
Figure 16a. Fast Read Instruction (SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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Publication Release Date: April 29, 2013
- 42 - Preliminary - Revision F
Fast Read (0Bh) in QPI Mode
The Fast Read instruction is also supported in QPI mode. When QPI mode is enabled, the number of
dummy clocks is configured by the “Set Read Parameters (C0h)” instruction to accommodate a wide
range of applications with different needs for either maximum Fast Read frequency or minimum data
access latency. Depending on the Read Parameter Bits P[5:4] setting, the number of dummy clocks can
be configured as either 2, 4, 6 or 8. The default number of dummy clocks upon power up or after a Reset
instruction is 2.
/CS
CLK Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
0Bh
2345
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6789
4 0
5 1
6 2
7 3
A15-8 A7-0 Dummy*
Byte 1 Byte 2
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
10 11 12 13
4
5
6
7
IOs switch from
Input to Output
* "Set Read Parameters" instruction (C0h) can set
the number of dummy clocks.
Instruction
Figure 16b. Fast Read Instruction (QPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
- 43 -
8.2.13 Fast Read with 4-Byte Address (0Ch)
The Fast Read with 4-Byte Address instruction is similar to the Fast Read instruction except that it
requires 32-bit address instead of 24-bit address. No matter the device is operating in 3-Byte Address
Mode or 4-byte Address Mode, the Read Data with 4-Byte Address instruction will always require 32-bit
address to access the entire 256Mb memory.
The Fast Read with 4-Byte Address (0Ch) instruction is only supported in Standard SPI mode. In QPI
mode, the instruction code 0Ch is used for the “Burst Read with Wrap” instruction.
Figure 17. Fast Read with 4-Byte Address Instruction (SPI Mode only)
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Publication Release Date: April 29, 2013
- 44 - Preliminary - Revision F
8.2.14 Fast Read Dual Output (3Bh)
The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction except
that data is output on two pins; IO
0
and IO
1
. This allows data to be transferred at twice the rate of
standard SPI devices. The Fast Read Dual Output instruction is ideal for quickly downloading code from
Flash to RAM upon power-up or for applications that cache code-segments to RAM for execution.
Similar to the Fast Read instruction, the Fast Read Dual Output instruction can operate at the highest
possible frequency of F
R
(see AC Electrical Characteristics). This is accomplished by adding eight
“dummy” clocks after the 24/32-bit address as shown in Figure 18. The dummy clocks allow the device's
internal circuits additional time for setting up the initial address. The input data during the dummy clocks
is “don’t care”. However, the IO
0
pin should be high-impedance prior to the falling edge of the first data
out clock.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (3Bh)
High Impedance
8 9 10 28 29 30
32 33 34 35 36 37 38 39
6 4 2 0
24-Bit Address
23 22 21 3 2 1 0
*
*
31
31
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Dummy Clocks
0
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
7 5 3 1
High Impedance
6 4 2 0
7 5 3 1
6 4 2 0
7 5 3 1
6 4 2 0
7 5 3 1
IO0 switches from
Input to Output
6
7
Data Out 1
*
Data Out 2
*
Data Out 3
*
Data Out 4
= MSB
*
Figure 18. Fast Read Dual Output Instruction (SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
- 45 -
8.2.15 Fast Read Dual Output with 4-Byte Address (3Ch)
The Fast Read Dual Output with 4-Byte Address instruction is similar to the Fast Read Dual Output
instruction except that it requires 32-bit address instead of 24-bit address. No matter the device is
operating in 3-Byte Address Mode or 4-byte Address Mode, the Fast Read Dual Output with 4-Byte
Address instruction will always require 32-bit address to access the entire 256Mb memory.
The Fast Read Dual Output with 4-Byte Address (3Ch) instruction is only supported in Standard SPI
mode.
Figure 19. Fast Read Dual Output with 4-Byte Address Instruction (SPI Mode only)
1'. winband 1..
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Publication Release Date: April 29, 2013
- 46 - Preliminary - Revision F
8.2.16 Fast Read Quad Output (6Bh)
The Fast Read Quad Output (6Bh) instruction is similar to the Fast Read Dual Output (3Bh) instruction
except that data is output on four pins, IO
0
, IO
1
, IO
2
, and IO
3
. The Quad Enable (QE) bit in Status
Register-2 must be set to 1 before the device will accept the Fast Read Quad Output Instruction. The
Fast Read Quad Output Instruction allows data to be transferred at four times the rate of standard SPI
devices.
The Fast Read Quad Output instruction can operate at the highest possible frequency of F
R
(see AC
Electrical Characteristics). This is accomplished by adding eight “dummy” clocks after the 24/32-bit
address as shown in Figure 20. The dummy clocks allow the device's internal circuits additional time for
setting up the initial address. The input data during the dummy clocks is “don’t care”. However, the IO
pins should be high-impedance prior to the falling edge of the first data out clock.
/CS
CLK
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (6Bh)
High Impedance
8 9 10 28 29 30
32 33 34 35 36 37 38 39
4 0
24-Bit Address
23 22 21 3 2 1 0
*
31
31
/CS
CLK
Dummy Clocks
0
40 41 42 43 44 45 46 47
5 1
High Impedance
4
5
Byte 1
High Impedance
High Impedance
6 2
7 3
High Impedance
6
7
High Impedance
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
Byte 2 Byte 3 Byte 4
IO
0
switches from
Input to Output
IO
0
IO
1
IO
2
IO
3
IO
0
IO
1
IO
2
IO
3
= MSB
*
Figure 20. Fast Read Quad Output Instruction (SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
- 47 -
8.2.17 Fast Read Quad Output with 4-Byte Address (6Ch)
The Fast Read Quad Output with 4-Byte Address instruction is similar to the Fast Read Quad Output
instruction except that it requires 32-bit address instead of 24-bit address. No matter the device is
operating in 3-Byte Address Mode or 4-byte Address Mode, the Fast Read Quad Output with 4-Byte
Address instruction will always require 32-bit address to access the entire 256Mb memory.
The Fast Read Quad Output with 4-Byte Address (6Ch) instruction is only supported in Standard SPI
mode.
Figure 21. Fast Read Quad Output with 4-Byte Address Instruction (SPI Mode only)
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Publication Release Date: April 29, 2013
- 48 - Preliminary - Revision F
8.2.18 Fast Read Dual I/O (BBh)
The Fast Read Dual I/O (BBh) instruction allows for improved random access while maintaining two IO
pins, IO
0
and IO
1
. It is similar to the Fast Read Dual Output (3Bh) instruction but with the capability to
input the Address bits (A23/A31-0) two bits per clock. This reduced instruction overhead may allow for
code execution (XIP) directly from the Dual SPI in some applications.
Fast Read Dual I/O with “Continuous Read Mode”
The Fast Read Dual I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23/A31-0), as shown in Figure 22a.
The upper nibble of the (M7-4) controls the length of the next Fast Read Dual I/O instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don’t care
(“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock.
If the “Continuous Read Mode” bits M5-4 = (1,0), then the next Fast Read Dual I/O instruction (after /CS
is raised and then lowered) does not require the BBh instruction code, as shown in Figure 22b. This
reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered
after /CS is asserted low. If the “Continuous Read Mode” bits M5-4 do not equal to (1,0), the next
instruction (after /CS is raised and then lowered) requires the first byte instruction code, thus returning to
normal operation. It is recommended to input FFFFh/FFFFFh on IO0 for the next instruction (16/20
clocks), to ensure M4 = 1 and return the device to normal operation.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (BBh)
8 9 10 12 13 14
24 25 26 27 28 29 30 31
6 4 2 0
*
*
23
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
0
32 33 34 35 36 37 38 39
7 5 3 1
*
6 4 2 0
7 5 3 1
6 4 2 0
7 5 3 1
6 4 2 0
7 5 3 1
* *
IOs switch from
Input to Output
6
7
22 20 18 16
23 21 19 17
14 12 10 8
15 13 11 9
6 4 2 0
7 5 3 1
6 4 2 0
7 5 3 1
11 15 16 17 18 20 21 2219 23
1
A23-16 A15-8 A7-0 M7-0
Byte 1 Byte 2 Byte 3 Byte 4
= MSB
**
Figure 22a. Fast Read Dual I/O Instruction (Initial instruction or previous M5-4 ≠ 10, SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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- 49 -
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 8 9 10 12 13 14
24 25 26 27 28 29 30 31
6420
*
*
15
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
0
7531
*
6420
7531
6420
7531
6420
7531
* *
IOs switch from
Input to Output
6
7
22 20 18 16
23 21 19 17
14 12 10 8
15 13 11 9
6420
7531
6420
7531
11 15
1
A23-16 A15-8 A7-0 M7-0
Byte 1 Byte 2 Byte 3 Byte 4
01234567
16 17 18 20 21 2219 23
*
= MSB
*
Figure 22b. Fast Read Dual I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
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8.2.19 Fast Read Dual I/O with 4-Byte Address (BCh)
The Fast Read Dual I/O with 4-Byte Address instruction is similar to the Fast Read Dual I/O instruction
except that it requires 32-bit address instead of 24-bit address. No matter the device is operating in 3-
Byte Address Mode or 4-byte Address Mode, the Fast Read Dual I/O with 4-Byte Address instruction will
always require 32-bit address to access the entire 256Mb memory.
The Fast Read Dual I/O with 4-Byte Address (BCh) instruction is only supported in Standard SPI mode.
Figure 23a. Fast Read Dual I/O with 4-Byte Address Instruction (Initial instruction or previous M5-4 ≠ 10, SPI Mode only)
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Figure 23b. Fast Read Dual I/O with 4-Byte Address Instruction (Previous instruction set M5-4 = 10, SPI Mode only)
'1. winband 1'. I HHHHT
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Publication Release Date: April 29, 2013
- 52 - Preliminary - Revision F
8.2.20 Fast Read Quad I/O (EBh)
The Fast Read Quad I/O (EBh) instruction is similar to the Fast Read Dual I/O (BBh) instruction except
that address and data bits are input and output through four pins IO
0
, IO
1
, IO
2
and IO
3
and four Dummy
clocks are required in SPI mode prior to the data output. The Quad I/O dramatically reduces instruction
overhead allowing faster random access for code execution (XIP) directly from the Quad SPI. The Quad
Enable bit (QE) of Status Register-2 must be set to enable the Fast Read Quad I/O Instruction.
Fast Read Quad I/O with “Continuous Read Mode”
The Fast Read Quad I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23/A31-0), as shown in Figure 24a.
The upper nibble of the (M7-4) controls the length of the next Fast Read Quad I/O instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don’t care
(“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock.
If the “Continuous Read Mode” bits M5-4 = (1,0), then the next Fast Read Quad I/O instruction (after /CS
is raised and then lowered) does not require the EBh instruction code, as shown in Figure 24b. This
reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered
after /CS is asserted low. If the “Continuous Read Mode” bits M5-4 do not equal to (1,0), the next
instruction (after /CS is raised and then lowered) requires the first byte instruction code, thus returning to
normal operation. It is recommended to input FFh/3FFh on IO0 for the next instruction (8/10 clocks), to
ensure M4 = 1 and return the device to normal operation.
Figure 24a. Fast Read Quad I/O Instruction (Initial instruction or previous M5-4
≠
10, SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
M7-0
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
2345
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6 7 8 9
4 0
5 1
6 2
7 3
A15-8 A7-0
Byte 1 Byte 2
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
10 11 12 13 14
4
5
6
7
IOs switch from
Input to Output
Byte 3
15 16 17 18 19 20 21 22 23
Dummy Dummy
Instruction (EBh)
I HHHHT
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M7-0
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
2345
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6789
4 0
5 1
6 2
7 3
A15-8 A7-0
Byte 1 Byte 2
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
10 11 12 13 14
4
5
6
7
IOs switch from
Input to Output
Byte 3
15
Dummy Dummy
Figure 24b. Fast Read Quad I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
Fast Read Quad I/O with “8/16/32/64-Byte Wrap Around” in Standard SPI mode
The Fast Read Quad I/O instruction can also be used to access a specific portion within a page by
issuing a “Set Burst with Wrap” (77h) command prior to EBh. The “Set Burst with Wrap” (77h) command
can either enable or disable the “Wrap Around” feature for the following EBh commands. When “Wrap
Around” is enabled, the data being accessed can be limited to either an 8, 16, 32 or 64-byte section of a
256-byte page. The output data starts at the initial address specified in the instruction, once it reaches the
ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary
automatically until /CS is pulled high to terminate the command.
The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then
fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read
commands.
The “Set Burst with Wrap” instruction allows three “Wrap Bits”, W6-4 to be set. The W4 bit is used to
enable or disable the “Wrap Around” operation while W6-5 are used to specify the length of the wrap
around section within a page. Refer to section 8.2.24 for detail descriptions.
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Fast Read Quad I/O (EBh) in QPI Mode
The Fast Read Quad I/O instruction is also supported in QPI mode, as shown in Figure 19c. When QPI
mode is enabled, the number of dummy clocks is configured by the “Set Read Parameters (C0h)”
instruction to accommodate a wide range of applications with different needs for either maximum Fast
Read frequency or minimum data access latency. Depending on the Read Parameter Bits P[5:4] setting,
the number of dummy clocks can be configured as either 2, 4, 6 or 8. The default number of dummy
clocks upon power up or after a Reset instruction is 2. In QPI mode, the “Continuous Read Mode” bits
M7-0 are also considered as dummy clocks. In the default setting, the data output will follow the
Continuous Read Mode bits immediately.
“Continuous Read Mode” feature is also available in QPI mode for Fast Read Quad I/O instruction.
Please refer to the description on previous pages.
“Wrap Around” feature is not available in QPI mode for Fast Read Quad I/O instruction. To perform a read
operation with fixed data length wrap around in QPI mode, a dedicated “Burst Read with Wrap” (0Ch)
instruction must be used. Please refer to 8.2.45 for details.
Figure 24c. Fast Read Quad I/O Instruction (Initial instruction or previous M5-4
≠
10, QPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
M7-0
*
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
EBh
2345
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6789
4 0
5 1
6 2
7 3
A15-8 A7-0
Byte 1 Byte 2
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
10 11 12 13 14
4
5
6
7
IOs switch from
Input to Output
*
"Set Read Parameters" instruction (C0h) can
set the number of dummy clocks.
Byte 3
Instruction
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8.2.21 Fast Read Quad I/O with 4-Byte Address (ECh)
The Fast Read Quad I/O with 4-Byte Address instruction is similar to the Fast Read Dual I/O instruction
except that it requires 32-bit address instead of 24-bit address. No matter the device is operating in 3-
Byte Address Mode or 4-byte Address Mode, the Fast Read Quad I/O with 4-Byte Address instruction will
always require 32-bit address to access the entire 256Mb memory.
The Fast Read Quad I/O with 4-Byte Address (ECh) instruction is only supported in Standard SPI mode.
Figure 25a. Fast Read Quad I/O with 4-Byte Address Instruction (Initial instruction or previous M5-4
≠
10, SPI Mode only)
Ion—00C ‘7 32—EItAddress a M74.) inummy i Dummy‘ 3 Byte 1 By1e2 1 Byte s T HHHHT
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Publication Release Date: April 29, 2013
- 56 - Preliminary - Revision F
Figure 25b. Fast Read Quad I/O with 4-Byte Address Instruction (Previous instruction set M5-4 = 10, SPI Mode only)
Fast Read Quad I/O with “8/16/32/64-Byte Wrap Around” in Standard SPI mode
The Fast Read Quad I/O instruction can also be used to access a specific portion within a page by
issuing a “Set Burst with Wrap” (77h) command prior to ECh. The “Set Burst with Wrap” (77h) command
can either enable or disable the “Wrap Around” feature for the following ECh commands. When “Wrap
Around” is enabled, the data being accessed can be limited to either an 8, 16, 32 or 64-byte section of a
256-byte page. The output data starts at the initial address specified in the instruction, once it reaches the
ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary
automatically until /CS is pulled high to terminate the command.
The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then
fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read
commands.
The “Set Burst with Wrap” instruction allows three “Wrap Bits”, W6-4 to be set. The W4 bit is used to
enable or disable the “Wrap Around” operation while W6-5 are used to specify the length of the wrap
around section within a page. Refer to section 8.2.24 for detail descriptions.
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8.2.22 Word Read Quad I/O (E7h)
The Word Read Quad I/O (E7h) instruction is similar to the Fast Read Quad I/O (EBh) instruction except
that the lowest Address bit (A0) must equal 0 and only two Dummy clocks are required prior to the data
output. The Quad I/O dramatically reduces instruction overhead allowing faster random access for code
execution (XIP) directly from the Quad SPI. The Quad Enable bit (QE) of Status Register-2 must be set to
enable the Word Read Quad I/O Instruction.
Word Read Quad I/O with “Continuous Read Mode”
The Word Read Quad I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23/A31-0), as shown in Figure 26a.
The upper nibble of the (M7-4) controls the length of the next Fast Read Quad I/O instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don’t care
(“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock.
If the “Continuous Read Mode” bits M5-4 = (1,0), then the next Fast Read Quad I/O instruction (after /CS
is raised and then lowered) does not require the E7h instruction code, as shown in Figure 26b. This
reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered
after /CS is asserted low. If the “Continuous Read Mode” bits M5-4 do not equal to (1,0), the next
instruction (after /CS is raised and then lowered) requires the first byte instruction code, thus returning to
normal operation. It is recommended to input FFh/3FFh on IO0 for the next instruction (8/10 clocks), to
ensure M4 = 1 and return the device to normal operation.
Figure 26a. Word Read Quad I/O Instruction (Initial instruction or previous M5-4
≠
10, SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
M7-0
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
2 3 4 5
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6 7 8 9
4 0
5 1
6 2
7 3
A15-8 A7-0
Byte 1 Byte 2
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
10 11 12 13 14
4
5
6
7
IOs switch from
Input to Output
Byte 3
15 16 17 18 19 20 21
Dummy
Instruction (E7h)
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M7-0
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
2345
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6 7
4 0
5 1
6 2
7 3
A15-8 A7-0
4 0
5 1
6 2
7 3
Byte 1 Byte 2
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4
5
6
7
IOs switch from
Input to Output
Byte 3
8 9 10 11 12 13
Dummy
Figure 26b. Word Read Quad I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
Word Read Quad I/O with “8/16/32/64-Byte Wrap Around” in Standard SPI mode
The Word Read Quad I/O instruction can also be used to access a specific portion within a page by
issuing a “Set Burst with Wrap” (77h) command prior to E7h. The “Set Burst with Wrap” (77h) command
can either enable or disable the “Wrap Around” feature for the following E7h commands. When “Wrap
Around” is enabled, the data being accessed can be limited to either an 8, 16, 32 or 64-byte section of a
256-byte page. The output data starts at the initial address specified in the instruction, once it reaches the
ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary
automatically until /CS is pulled high to terminate the command.
The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then
fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read
commands.
The “Set Burst with Wrap” instruction allows three “Wrap Bits”, W6-4 to be set. The W4 bit is used to
enable or disable the “Wrap Around” operation while W6-5 are used to specify the length of the wrap
around section within a page. See 8.2.24 for detail descriptions.
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8.2.23 Octal Word Read Quad I/O (E3h)
The Octal Word Read Quad I/O (E3h) instruction is similar to the Fast Read Quad I/O (EBh) instruction
except that the lower four Address bits (A0, A1, A2, A3) must equal 0. As a result, the dummy clocks are
not required, which further reduces the instruction overhead allowing even faster random access for code
execution (XIP). The Quad Enable bit (QE) of Status Register-2 must be set to enable the Octal Word
Read Quad I/O Instruction.
Octal Word Read Quad I/O with “Continuous Read Mode”
The Octal Word Read Quad I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23/A31-0), as shown in Figure 27a.
The upper nibble of the (M7-4) controls the length of the next Octal Word Read Quad I/O instruction
through the inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are
don’t care (“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data
out clock.
If the “Continuous Read Mode” bits M5-4 = (1,0), then the next Fast Read Quad I/O instruction (after /CS
is raised and then lowered) does not require the E3h instruction code, as shown in Figure 27b. This
reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered
after /CS is asserted low. If the “Continuous Read Mode” bits M5-4 do not equal to (1,0), the next
instruction (after /CS is raised and then lowered) requires the first byte instruction code, thus returning to
normal operation. It is recommended to input FFh/3FFh on IO0 for the next instruction (8/10 clocks), to
ensure M4 = 1 and return the device to normal operation.
M7-0
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
2345
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6789
4 0
5 1
6 2
7 3
A15-8 A7-0
Byte 1 Byte 2
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
10 11 12 13 14
4
5
6
7
IOs switch from
Input to Output
Byte 3
15 16 17 18 19 20 21
Instruction (E3h)
4 0
5 1
6 2
7 3
Byte 4
Figure 27a. Octal Word Read Quad I/O Instruction (Initial instruction or previous M5-4
≠
10, SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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M7-0
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
2345
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6 7
4 0
5 1
6 2
7 3
A15-8 A7-0
4 0
5 1
6 2
7 3
Byte 1 Byte 2
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4
5
6
7
IOs switch from
Input to Output
Byte 3
8 9 10 11 12 13
4 0
5 1
6 2
7 3
Byte 4
Figure 27b. Octal Word Read Quad I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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8.2.24 Set Burst with Wrap (77h)
In Standard SPI mode, the Set Burst with Wrap (77h) instruction is used in conjunction with “Fast Read
Quad I/O” and “Word Read Quad I/O” instructions to access a fixed length of 8/16/32/64-byte section
within a 256-byte page. Certain applications can benefit from this feature and improve the overall system
code execution performance.
Similar to a Quad I/O instruction, the Set Burst with Wrap instruction is initiated by driving the /CS pin low
and then shifting the instruction code “77h” followed by 24/32 dummy bits and 8 “Wrap Bits”, W7-0. The
instruction sequence is shown in Figure 28. Wrap bit W7 and the lower nibble W3-0 are not used.
W6, W5 W4 = 0 W4 =1 (DEFAULT)
Wrap Around Wrap Length Wrap Around Wrap Length
0 0 Yes 8-byte No N/A
0 1 Yes 16-byte No N/A
1 0 Yes 32-byte No N/A
1 1
Yes 64-byte No N/A
Once W6-4 is set by a Set Burst with Wrap instruction, all the following “Fast Read Quad I/O” and “Word
Read Quad I/O” instructions will use the W6-4 setting to access the 8/16/32/64-byte section within any
page. To exit the “Wrap Around” function and return to normal read operation, another Set Burst with
Wrap instruction should be issued to set W4 = 1. The default value of W4 upon power on or after a
software/hardware reset is 1.
In QPI mode, the “Burst Read with Wrap (0Ch)” instruction should be used to perform the Read operation
with “Wrap Around” feature. The Wrap Length set by W5-4 in Standard SPI mode is still valid in QPI
mode and can also be re-configured by “Set Read Parameters (C0h)” instruction. Refer to 8.2.44 and
8.2.45 for details.
Wrap Bit
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
2345
X X
X X
X X
X X
don't
care
6789
don't
care don't
care
10 11 12 13 14 15
Instruction (77h)
Mode 0
Mode 3
X X
X X
X X
X X
X X
X X
X X
X X
w4 X
w5 X
w6 X
X X
Figure 28. Set Burst with Wrap Instruction (SPI Mode only)
32-Bit dummy bits are required when the device is operating in 4-Byte Address Mode
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8.2.25 Page Program (02h)
The Page Program instruction allows from one byte to 256 bytes (a page) of data to be programmed at
previously erased (FFh) memory locations. A Write Enable instruction must be executed before the
device will accept the Page Program Instruction (Status Register bit WEL= 1). The instruction is initiated
by driving the /CS pin low then shifting the instruction code “02h” followed by a 24/32-bit address
(A23/A31-A0) and at least one data byte, into the DI pin. The /CS pin must be held low for the entire
length of the instruction while data is being sent to the device. The Page Program instruction sequence is
shown in Figure 29.
If an entire 256 byte page is to be programmed, the last address byte (the 8 least significant address bits)
should be set to 0. If the last address byte is not zero, and the number of clocks exceeds the remaining
page length, the addressing will wrap to the beginning of the page. In some cases, less than 256 bytes (a
partial page) can be programmed without having any effect on other bytes within the same page. One
condition to perform a partial page program is that the number of clocks cannot exceed the remaining
page length. If more than 256 bytes are sent to the device the addressing will wrap to the beginning of the
page and overwrite previously sent data.
As with the write and erase instructions, the /CS pin must be driven high after the eighth bit of the last
byte has been latched. If this is not done the Page Program instruction will not be executed. After /CS is
driven high, the self-timed Page Program instruction will commence for a time duration of tpp (See AC
Characteristics). While the Page Program cycle is in progress, the Read Status Register instruction may
still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the Page Program
cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions
again. After the Page Program cycle has finished the Write Enable Latch (WEL) bit in the Status Register
is cleared to 0. The Page Program instruction will not be executed if the addressed page is protected by
the Block Protect (CMP, TB, BP3, BP2, BP1, and BP0) bits or the Individual Block/Sector Locks.
/CS
CLK
DI
(IO
0
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (02h)
8 9 10 28 29 30 39
24-Bit Address
23 22 21 3 2 1
*
/CS
CLK
DI
(IO
0
)
40 41 42 43 44 45 46 47
Data Byte 2
48 49 50 52 53 54 55
2072
76543210
5139
0
31
0
32 33 34 35 36 37 38
Data Byte 1
7654321
*
Mode 0
Mode 3
Data Byte 3
2073
2074
2075
2076
2077
2078
2079
0
Data Byte 256
*
76543210
*
76543210
*
= MSB
*
Figure 29a. Page Program Instruction (SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
02h
Instruction
2 3 4 5
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6 7 8 9
4 0
5 1
6 2
7 3
A15-8 A7-0 Byte1 Byte 2 Byte 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
10 11 12 13
Byte 255 Byte 256
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
Mode 0
Mode 3
516
517
518
519
Figure 29b. Page Program Instruction (QPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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8.2.26 Quad Input Page Program (32h)
The Quad Page Program instruction allows up to 256 bytes of data to be programmed at previously
erased (FFh) memory locations using four pins: IO
0
, IO
1
, IO
2
, and IO
3
. The Quad Page Program can
improve performance for PROM Programmer and applications that have slow clock speeds <5MHz.
Systems with faster clock speed will not realize much benefit for the Quad Page Program instruction
since the inherent page program time is much greater than the time it take to clock-in the data.
To use Quad Page Program the Quad Enable (QE) bit in Status Register-2 must be set to 1. A Write
Enable instruction must be executed before the device will accept the Quad Page Program instruction
(Status Register-1, WEL=1). The instruction is initiated by driving the /CS pin low then shifting the
instruction code “32h” followed by a 24/32-bit address (A23/A31-A0) and at least one data byte, into the
IO pins. The /CS pin must be held low for the entire length of the instruction while data is being sent to the
device. All other functions of Quad Page Program are identical to standard Page Program. The Quad
Page Program instruction sequence is shown in Figure 30.
/CS
CLK
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (32h)
8 9 10 28 29 30
32 33 34 35 36 37
4 0
24-Bit Address
23 22 21 3 2 1 0
*
31
31
/CS
CLK
5 1
Byte 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
Byte 2 Byte 3 Byte
256
040
5 1
6 2
7 3
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
536
537
538
539
540
541
542
543
Mode 0
Mode 3
Byte
253 Byte
254 Byte
255
IO0
IO1
IO2
IO3
IO0
IO1
IO2
IO3
*** ****
= MSB
*
Figure 30. Quad Input Page Program Instruction (SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
- 65 -
8.2.27 Sector Erase (20h)
The Sector Erase instruction sets all memory within a specified sector (4K-bytes) to the erased state of all
1s (FFh). A Write Enable instruction must be executed before the device will accept the Sector Erase
Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low
and shifting the instruction code “20h” followed a 24/32-bit sector address (A23/A31-A0). The Sector
Erase instruction sequence is shown in Figure 31a & 31b.
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done
the Sector Erase instruction will not be executed. After /CS is driven high, the self-timed Sector Erase
instruction will commence for a time duration of t
SE
(See AC Characteristics). While the Sector Erase
cycle is in progress, the Read Status Register instruction may still be accessed for checking the status of
the BUSY bit. The BUSY bit is a 1 during the Sector Erase cycle and becomes a 0 when the cycle is
finished and the device is ready to accept other instructions again. After the Sector Erase cycle has
finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Sector Erase
instruction will not be executed if the addressed page is protected by the Block Protect (CMP, TB, BP3,
BP2, BP1, and BP0) bits or the Individual Block/Sector Locks.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (20h)
High Impedance
8 9 29 30 31
24-Bit Address
23 22 2 1 0
*
Mode 0
Mode 3
= MSB
*
Figure 31a. Sector Erase Instruction (SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
20h
Instruction
2 3 4 5
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6 7
4 0
5 1
6 2
7 3
A15-8 A7-0
Mode 0
Mode 3
Figure 31b. Sector Erase Instruction (QPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
1'. winband 1.. x @emaooox x 6990...}
W25Q256FV
Publication Release Date: April 29, 2013
- 66 - Preliminary - Revision F
8.2.28 32KB Block Erase (52h)
The Block Erase instruction sets all memory within a specified block (32K-bytes) to the erased state of all
1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase
Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low
and shifting the instruction code “52h” followed a 24/32-bit block address (A23/A31-A0). The Block Erase
instruction sequence is shown in Figure 32a & 32b.
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done
the Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block Erase
instruction will commence for a time duration of t
BE
1 (See AC Characteristics). While the Block Erase
cycle is in progress, the Read Status Register instruction may still be accessed for checking the status of
the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is
finished and the device is ready to accept other instructions again. After the Block Erase cycle has
finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase
instruction will not be executed if the addressed page is protected by the Block Protect (CMP, TB, BP3,
BP2, BP1, and BP0) bits or the Individual Block/Sector Locks.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (52h)
High Impedance
8 9 29 30 31
24-Bit Address
23 22 2 1 0
*
Mode 0
Mode 3
= MSB
*
Figure 32a. 32KB Block Erase Instruction (SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
52h
Instruction
2 3 4 5
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6 7
4 0
5 1
6 2
7 3
A15-8 A7-0
Mode 0
Mode 3
Figure 32b. 32KB Block Erase Instruction (QPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
1'. winband 1.. x @emaooox xv awaaonox
W25Q256FV
- 67 -
8.2.29 64KB Block Erase (D8h)
The Block Erase instruction sets all memory within a specified block (64K-bytes) to the erased state of all
1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase
Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low
and shifting the instruction code “D8h” followed a 24/32-bit block address (A23/A31-A0). The Block Erase
instruction sequence is shown in Figure 33a & 33b.
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done
the Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block Erase
instruction will commence for a time duration of t
BE
(See AC Characteristics). While the Block Erase cycle
is in progress, the Read Status Register instruction may still be accessed for checking the status of the
BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is finished
and the device is ready to accept other instructions again. After the Block Erase cycle has finished the
Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase instruction will not
be executed if the addressed page is protected by the Block Protect (CMP, TB, BP3, BP2, BP1, and BP0)
bits or the Individual Block/Sector Locks.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (D8h)
High Impedance
8 9 29 30 31
24-Bit Address
23 22 2 1 0
*
Mode 0
Mode 3
= MSB
*
Figure 33a. 64KB Block Erase Instruction (SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
D8h
Instruction
2 3 4 5
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6 7
4 0
5 1
6 2
7 3
A15-8 A7-0
Mode 0
Mode 3
Figure 33b. 64KB Block Erase Instruction (QPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
'1. winband 1'.
W25Q256FV
Publication Release Date: April 29, 2013
- 68 - Preliminary - Revision F
8.2.30 Chip Erase (C7h / 60h)
The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A Write
Enable instruction must be executed before the device will accept the Chip Erase Instruction (Status
Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the
instruction code “C7h” or “60h”. The Chip Erase instruction sequence is shown in Figure 34.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Chip Erase
instruction will not be executed. After /CS is driven high, the self-timed Chip Erase instruction will
commence for a time duration of t
CE
(See AC Characteristics). While the Chip Erase cycle is in progress,
the Read Status Register instruction may still be accessed to check the status of the BUSY bit. The
BUSY bit is a 1 during the Chip Erase cycle and becomes a 0 when finished and the device is ready to
accept other instructions again. After the Chip Erase cycle has finished the Write Enable Latch (WEL) bit
in the Status Register is cleared to 0. The Chip Erase instruction will not be executed if any memory
region is protected by the Block Protect (CMP, TB, BP3, BP2, BP1, and BP0) bits or the Individual
Block/Sector Locks.
/CS
CLK
DI
(IO0)
DO
(IO1)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (C7h/60h)
High Impedance
Mode 0
Mode 3
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
C7h/60h
Instruction
Mode 0
Mode 3
Figure 34. Chip Erase Instruction for SPI Mode (left) or QPI Mode (right)
'1' winband 1'.
W25Q256FV
- 69 -
8.2.31 Erase / Program Suspend (75h)
The Erase/Program Suspend instruction “75h”, allows the system to interrupt a Sector or Block Erase
operation or a Page Program operation and then read from or program/erase data to, any other sectors or
blocks. The Erase/Program Suspend instruction sequence is shown in Figure 35a & 35b.
The Write Status Register instruction (01h) and Erase instructions (20h, 52h, D8h, C7h, 60h, 44h) are not
allowed during Erase Suspend. Erase Suspend is valid only during the Sector or Block erase operation. If
written during the Chip Erase operation, the Erase Suspend instruction is ignored. The Write Status
Register instruction (01h) and Program instructions (02h, 32h, 42h) are not allowed during Program
Suspend. Program Suspend is valid only during the Page Program or Quad Page Program operation.
The Erase/Program Suspend instruction “75h” will be accepted by the device only if the SUS bit in the
Status Register equals to 0 and the BUSY bit equals to 1 while a Sector or Block Erase or a Page
Program operation is on-going. If the SUS bit equals to 1 or the BUSY bit equals to 0, the Suspend
instruction will be ignored by the device. A maximum of time of “t
SUS
” (See AC Characteristics) is required
to suspend the erase or program operation. The BUSY bit in the Status Register will be cleared from 1 to
0 within “t
SUS
” and the SUS bit in the Status Register will be set from 0 to 1 immediately after
Erase/Program Suspend. For a previously resumed Erase/Program operation, it is also required that the
Suspend instruction “75h” is not issued earlier than a minimum of time of “t
SUS
” following the preceding
Resume instruction “7Ah”.
Unexpected power off during the Erase/Program suspend state will reset the device and release the
suspend state. SUS bit in the Status Register will also reset to 0. The data within the page, sector or
block that was being suspended may become corrupted. It is recommended for the user to implement
system design techniques against the accidental power interruption and preserve data integrity during
erase/program suspend state.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (75h)
High Impedance
Mode 0
Mode 3
tSUS
Accept instructions
Figure 35a. Erase/Program Suspend Instruction (SPI Mode)
winband 1'. F—>\
W25Q256FV
Publication Release Date: April 29, 2013
- 70 - Preliminary - Revision F
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
75h
Instruction
Mode 0
Mode 3
tSUS
Accept instructions
Figure 35b. Erase/Program Suspend Instruction (QPI Mode)
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W25Q256FV
- 71 -
8.2.32 Erase / Program Resume (7Ah)
The Erase/Program Resume instruction “7Ah” must be written to resume the Sector or Block Erase
operation or the Page Program operation after an Erase/Program Suspend. The Resume instruction
“7Ah” will be accepted by the device only if the SUS bit in the Status Register equals to 1 and the BUSY
bit equals to 0. After issued the SUS bit will be cleared from 1 to 0 immediately, the BUSY bit will be set
from 0 to 1 within 200ns and the Sector or Block will complete the erase operation or the page will
complete the program operation. If the SUS bit equals to 0 or the BUSY bit equals to 1, the Resume
instruction “7Ah” will be ignored by the device. The Erase/Program Resume instruction sequence is
shown in Figure 36a & 36b.
Resume instruction is ignored if the previous Erase/Program Suspend operation was interrupted by
unexpected power off. It is also required that a subsequent Erase/Program Suspend instruction not to be
issued within a minimum of time of “t
SUS
” following a previous Resume instruction.
/CS
CLK
DI
(IO
0
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (7Ah)
Mode 0
Mode 3
Resume previously
suspended Program or
Erase
Figure 36a. Erase/Program Resume Instruction (SPI Mode)
/CS
CLK
Mode 0
Mode 3 0 1
IO0
IO1
IO2
IO3
7Ah
Instruction
Mode 0
Mode 3
Resume previously
suspended Program or
Erase
Figure 36b. Erase/Program Resume Instruction (QPI Mode)
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Publication Release Date: April 29, 2013
- 72 - Preliminary - Revision F
8.2.33 Power-down (B9h)
Although the standby current during normal operation is relatively low, standby current can be further
reduced with the Power-down instruction. The lower power consumption makes the Power-down
instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC Characteristics).
The instruction is initiated by driving the /CS pin low and shifting the instruction code “B9h” as shown in
Figure 37a & 37b.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Power-down
instruction will not be executed. After /CS is driven high, the power-down state will entered within the time
duration of t
DP
(See AC Characteristics). While in the power-down state only the Release Power-down /
Device ID (ABh) instruction, which restores the device to normal operation, will be recognized. All other
instructions are ignored. This includes the Read Status Register instruction, which is always available
during normal operation. Ignoring all but one instruction makes the Power Down state a useful condition
for securing maximum write protection. The device always powers-up in the normal operation with the
standby current of ICC1.
/CS
CLK
DI
(IO
0
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (B9h)
Mode 0
Mode 3
tDP
Power-down currentStand-by current
Figure 37a. Deep Power-down Instruction (SPI Mode)
/CS
CLK
Mode 0
Mode 3 0 1
IO0
IO1
IO2
IO3
B9h
Instruction
Mode 0
Mode 3
tDP
Power-down currentStand-by current
Figure 37b. Deep Power-down Instruction (QPI Mode)
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W25Q256FV
- 73 -
8.2.34 Release Power-down / Device ID (ABh)
The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the power-down state, or obtain the devices electronic identification (ID) number.
To release the device from the power-down state, the instruction is issued by driving the /CS pin low,
shifting the instruction code “ABh” and driving /CS high as shown in Figure 38a & 38b. Release from
power-down will take the time duration of t
RES1
(See AC Characteristics) before the device will resume
normal operation and other instructions are accepted. The /CS pin must remain high during the t
RES1
time
duration.
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by
driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device ID
bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first. The Device ID
values for the W25Q256FV is listed in Manufacturer and Device Identification table. The Device ID can be
read continuously. The instruction is completed by driving /CS high.
When used to release the device from the power-down state and obtain the Device ID, the instruction is
the same as previously described, and shown in Figure 38c & 38d, except that after /CS is driven high it
must remain high for a time duration of t
RES2
(See AC Characteristics). After this time duration the device
will resume normal operation and other instructions will be accepted. If the Release from Power-down /
Device ID instruction is issued while an Erase, Program or Write cycle is in process (when BUSY equals
1) the instruction is ignored and will not have any effects on the current cycle.
/CS
CLK
DI
(IO
0
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (ABh)
Mode 0
Mode 3
tRES1
Power-down current Stand-by current
Figure 38a. Release Power-down Instruction (SPI Mode)
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
ABh
Instruction
Mode 0
Mode 3
tRES1
Power-down current Stand-by current
#7 a? 4‘ « » mm
W25Q256FV
Publication Release Date: April 29, 2013
- 74 - Preliminary - Revision F
Figure 38b. Release Power-down Instruction (QPI Mode)
tRES2
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (ABh)
High Impedance
8 9 29 30 31
3 Dummy Bytes
23 22 2 1 0
*
Mode 0
Mode 3
76543210
*
32 33 34 35 36 37 38
Device ID
Power-down current Stand-by current
= MSB
*
Figure 38c. Release Power-down / Device ID Instruction (SPI Mode)
Power-down current Stand-by current
Device ID
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
ABh
2 3 4 5
X X
X X
X X
X X
6 7 8
4 0
5 1
6 2
7 3
IOs switch from
Input to Output
Instruction
tRES2
Mode 0
Mode 3
X X
X X
X X
X X
X X
X X
X X
X X
3 Dummy Bytes
Figure 38d. Release Power-down / Device ID Instruction (QPI Mode)
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W25Q256FV
- 75 -
8.2.35 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 39. The Device ID values for the W25Q256FV are listed in Manufacturer and Device
Identification table. The instruction is completed by driving /CS high.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (90h)
High Impedance
8 9 10 28 29 30 31
Address (000000h)
23 22 21 3 2 1 0
Device ID
*
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
32 33 34 35 36 37 38 39
Manufacturer ID (EFh)
40 41 42 44 45 46
76543210
*
4331
0
Mode 0
Mode 3
= MSB
*
Figure 39. Read Manufacturer / Device ID Instruction (SPI Mode)
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Publication Release Date: April 29, 2013
- 76 - Preliminary - Revision F
8.2.36 Read Manufacturer / Device ID Dual I/O (92h)
The Read Manufacturer / Device ID Dual I/O instruction is an alternative to the Read Manufacturer /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID
at 2x speed.
The Read Manufacturer / Device ID Dual I/O instruction is similar to the Fast Read Dual I/O instruction.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “92h” followed by a
24/32-bit address (A23/A31-A0) of 000000h, but with the capability to input the Address bits two bits per
clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out 2 bits per
clock on the falling edge of CLK with most significant bits (MSB) first as shown in Figure 40. The Device
ID values for the W25Q256FV are listed in Manufacturer and Device Identification table. If the 24-bit
address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer
ID. The Manufacturer and Device IDs can be read continuously, alternating from one to the other. The
instruction is completed by driving /CS high.
/CS
CLK
DI
(IO0)
DO
(IO1)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (92h)
High Impedance
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
7 5 3 1
* *
6 4 2 0
7531
6420
7531
6420
7531
6420
23
* *
A23-16 A15-8 A7-0 (00h) M7-0
/CS
CLK
DI
(IO0)
DO
(IO1)
24 25 26 27 28 29 30 31 32 33 34 36 37 383523
0
Mode 0
Mode 3
7 5 3 1
6 4 2 0
7 5 3 1
6 4 2 0
7531
6420
753
642
1
0
1
MFR ID Device ID MFR ID
(repeat) Device ID
(repeat)
IOs switch from
Input to Output
* ** *
= MSB
*
Figure 40. Read Manufacturer / Device ID Dual I/O Instruction (SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
Note:
The “Continuous Read Mode” bits M(7-0) must be set to Fxh to be compatible with Fast Read Dual I/O instruction.
1'. winband 1..
W25Q256FV
- 77 -
8.2.37 Read Manufacturer / Device ID Quad I/O (94h)
The Read Manufacturer / Device ID Quad I/O instruction is an alternative to the Read Manufacturer /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID
at 4x speed.
The Read Manufacturer / Device ID Quad I/O instruction is similar to the Fast Read Quad I/O instruction.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “94h” followed by a
four clock dummy cycles and then a 24/32-bit address (A23/A31-A0) of 000000h, but with the capability to
input the Address bits four bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the
Device ID are shifted out four bits per clock on the falling edge of CLK with most significant bit (MSB) first
as shown in Figure 41. The Device ID values for the W25Q256FV are listed in Manufacturer and Device
Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then
followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating
from one to the other. The instruction is completed by driving /CS high.
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (94h)
High Impedance
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
5 1
4 0
23
Mode 0
Mode 3
IOs switch from
Input to Output
High Impedance
7 3
6 2
/CS
CLK
IO
0
IO
1
IO
2
IO
3
High Impedance
A23-16 A15-8 A7-0
(00h) M7-0
MFR ID Device ID
Dummy Dummy
/CS
CLK
IO
0
IO
1
IO
2
IO
3
23
0
1
2
3
5 1
4 0
7 3
6 2
5 1
4 0
7 3
6 2
5 1
4 0
7 3
6 2
5 1
4 0
7 3
6 2
5 1
4 0
7 3
6 2
5 1
4 0
7 3
6 2
5 1
4 0
7 3
6 2
5 1
4 0
7 3
6 2
5 1
4 0
7 3
6 2
24 25 26 27 28 29 30
MFR ID
(repeat) Device ID
(repeat) MFR ID
(repeat) Device ID
(repeat)
Figure 41. Read Manufacturer / Device ID Quad I/O Instruction (SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
Note:
The “Continuous Read Mode” bits M(7-0) must be set to Fxh to be compatible with Fast Read Quad I/O instruction.
1'. winband 1.. ---------
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Publication Release Date: April 29, 2013
- 78 - Preliminary - Revision F
8.2.38 Read Unique ID Number (4Bh)
The Read Unique ID Number instruction accesses a factory-set read-only 64-bit number that is unique to
each W25Q256FV device. The ID number can be used in conjunction with user software methods to help
prevent copying or cloning of a system. The Read Unique ID instruction is initiated by driving the /CS pin
low and shifting the instruction code “4Bh” followed by a four bytes of dummy clocks. After which, the 64-
bit ID is shifted out on the falling edge of CLK as shown in Figure 42.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (4Bh)
High Impedance
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
24 25 26 27 28 29 30 31 32 33 34 36 37 383523
Mode 0
Mode 3
*
Dummy Byte 1 Dummy Byte 2
39 40 41 42
Dummy Byte 3 Dummy Byte 4
63 62 61 2 1 0
64-bit Unique Serial Number
100
101
102
High Impedance
= MSB
*
Figure 42. Read Unique ID Number Instruction (SPI Mode only)
5 Dummy Bytes are required when the device is operating in 4-Byte Address Mode
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8.2.39 Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q256FV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh)
and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the
falling edge of CLK with most significant bit (MSB) first as shown in Figure 43a & 43b. For memory type
and capacity values refer to Manufacturer and Device Identification table.
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (9Fh)
High Impedance
8 9 10 12 13 14 15
Capacity ID7-0
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
16 17 18 19 20 21 22 23
Manufacturer ID (EFh)
24 25 26 28 29 30
7 6 5 4 3 2 1 0
*
2715
Mode 0
Mode 3
11
7 6 5 4 3 2 1 0
*
Memory Type ID15-8
= MSB
*
Figure 43a. Read JEDEC ID Instruction (SPI Mode)
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
9Fh
2 3 4 5
12 8
13 9
14 10
15 11
EFh
6
4 0
5 1
6 2
7 3
ID15-8 ID7-0
IOs switch from
Input to Output
Instruction
Mode 0
Mode 3
Figure 43b. Read JEDEC ID Instruction (QPI Mode)
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W25Q256FV
Publication Release Date: April 29, 2013
- 80 - Preliminary - Revision F
8.2.40 Read SFDP Register (5Ah)
The W25Q256FV features a 256-Byte Serial Flash Discoverable Parameter (SFDP) register that contains
information about device configurations, available instructions and other features. The SFDP parameters
are stored in one or more Parameter Identification (PID) tables. Currently only one PID table is specified,
but more may be added in the future. The Read SFDP Register instruction is compatible with the SFDP
standard initially established in 2010 for PC and other applications, as well as the JEDEC standard
JESD216 that is published in 2011. Most Winbond SpiFlash Memories shipped after June 2011 (date
code 1124 and beyond) support the SFDP feature as specified in the applicable datasheet.
The Read SFDP instruction is initiated by driving the /CS pin low and shifting the instruction code “5Ah”
followed by a 24-bit address (A23-A0)
(1)
into the DI pin. Eight “dummy” clocks are also required before the
SFDP register contents are shifted out on the falling edge of the 40
th
CLK with most significant bit (MSB)
first as shown in Figure 44. For SFDP register values and descriptions, please refer to the Winbond
Application Note for SFDP Definition Table.
Note: 1. A23-A8 = 0; A7-A0 are used to define the starting byte address for the 256-Byte SFDP Register.
/CS
CLK
DI
(IO0)
DO
(IO1)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (5Ah)
High Impedance
8 9 10 28 29 30 31
24-Bit Address
23 22 21 3 2 1 0
Data Out 1
*
/CS
CLK
DI
(IO0)
DO
(IO1)
32 33 34 35 36 37 38 39
Dummy Byte
High Impedance
40 41 42 44 45 46 47 48 49 50 51 52 53 54 55
765432107
Data Out 2
*
76543210
*
76543210
4331
0
= MSB
*
Figure 44. Read SFDP Register Instruction Sequence Diagram (SPI Mode only)
Only 24-Bit Address is required when the device is operating in either 3-Byte or 4-Byte Address Mode
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8.2.41 Erase Security Registers (44h)
The W25Q256FV offers three 256-byte Security Registers which can be erased and programmed
individually. These registers may be used by the system manufacturers to store security and other
important information separately from the main memory array.
The Erase Security Register instruction is similar to the Sector Erase instruction. A Write Enable
instruction must be executed before the device will accept the Erase Security Register Instruction (Status
Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the
instruction code “44h” followed by a 24/32-bit address (A23/A31-A0) to erase one of the three security
registers.
ADDRESS {A23/A31}-16
A15-12 A11-8 A7-0
Security Register #1 00h 0 0 0 1 0 0 0 0 Don’t Care
Security Register #2 00h 0 0 1 0 0 0 0 0 Don’t Care
Security Register #3 00h 0 0 1 1 0 0 0 0 Don’t Care
The Erase Security Register instruction sequence is shown in Figure 45. The /CS pin must be driven high
after the eighth bit of the last byte has been latched. If this is not done the instruction will not be executed.
After /CS is driven high, the self-timed Erase Security Register operation will commence for a time
duration of t
SE
(See AC Characteristics). While the Erase Security Register cycle is in progress, the Read
Status Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is
a 1 during the erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept
other instructions again. After the Erase Security Register cycle has finished the Write Enable Latch
(WEL) bit in the Status Register is cleared to 0. The Security Register Lock Bits (LB3-1) in the Status
Register-2 can be used to OTP protect the security registers. Once a lock bit is set to 1, the
corresponding security register will be permanently locked, Erase Security Register instruction to that
register will be ignored (Refer to section 7.1.8 for detail descriptions).
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (44h)
High Impedance
8 9 29 30 31
24-Bit Address
23 22 2 1 0
*
Mode 0
Mode 3
= MSB
*
Figure 45. Erase Security Registers Instruction (SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
Publication Release Date: April 29, 2013
- 82 - Preliminary - Revision F
8.2.42 Program Security Registers (42h)
The Program Security Register instruction is similar to the Page Program instruction. It allows from one
byte to 256 bytes of security register data to be programmed at previously erased (FFh) memory locations.
A Write Enable instruction must be executed before the device will accept the Program Security Register
Instruction (Status Register bit WEL= 1). The instruction is initiated by driving the /CS pin low then shifting
the instruction code “42h” followed by a 24/32-bit address (A23/A31-A0) and at least one data byte, into
the DI pin. The /CS pin must be held low for the entire length of the instruction while data is being sent to
the device.
ADDRESS {A23/A31}-16
A15-12 A11-8 A7-0
Security Register #1 00h 0 0 0 1 0 0 0 0 Byte Address
Security Register #2 00h 0 0 1 0 0 0 0 0 Byte Address
Security Register #3 00h 0 0 1 1 0 0 0 0 Byte Address
The Program Security Register instruction sequence is shown in Figure 46. The Security Register Lock
Bits (LB3-1) in the Status Register-2 can be used to OTP protect the security registers. Once a lock bit is
set to 1, the corresponding security register will be permanently locked, Program Security Register
instruction to that register will be ignored (See 7.1.8, 8.2.25 for detail descriptions).
/CS
CLK
DI
(IO
0
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (42h)
8 9 10 28 29 30 39
24-Bit Address
23 22 21 3 2 1
*
/CS
CLK
DI
(IO
0
)
40 41 42 43 44 45 46 47
Data Byte 2
48 49 50 52 53 54 55
2072
76543210
5139
0
31
0
32 33 34 35 36 37 38
Data Byte 1
7654321
*
Mode 0
Mode 3
Data Byte 3
2073
2074
2075
2076
2077
2078
2079
0
Data Byte 256
*
76543210
*
76543210
*
= MSB
*
Figure 46. Program Security Registers Instruction (SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
- 83 -
8.2.43 Read Security Registers (48h)
The Read Security Register instruction is similar to the Fast Read instruction and allows one or more data
bytes to be sequentially read from one of the four security registers. The instruction is initiated by driving
the /CS pin low and then shifting the instruction code “48h” followed by a 24/32-bit address (A23/A31-A0)
and eight “dummy” clocks into the DI pin. The code and address bits are latched on the rising edge of the
CLK pin. After the address is received, the data byte of the addressed memory location will be shifted out
on the DO pin at the falling edge of CLK with most significant bit (MSB) first. The byte address is
automatically incremented to the next byte address after each byte of data is shifted out. Once the byte
address reaches the last byte of the register (byte address FFh), it will reset to address 00h, the first byte
of the register, and continue to increment. The instruction is completed by driving /CS high. The Read
Security Register instruction sequence is shown in Figure 47. If a Read Security Register instruction is
issued while an Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will
not have any effects on the current cycle. The Read Security Register instruction allows clock rates from
D.C. to a maximum of F
R
(see AC Electrical Characteristics).
ADDRESS {A23/A31}-16
A15-12 A11-8 A7-0
Security Register #1 00h 0 0 0 1 0 0 0 0 Byte Address
Security Register #2 00h 0 0 1 0 0 0 0 0 Byte Address
Security Register #3 00h 0 0 1 1 0 0 0 0 Byte Address
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (48h)
High Impedance
8 9 10 28 29 30 31
24-Bit Address
23 22 21 3 2 1 0
Data Out 1
*
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
32 33 34 35 36 37 38 39
Dummy Byte
High Impedance
40 41 42 44 45 46 47 48 49 50 51 52 53 54 55
765432107
Data Out 2
*
76543210
*
7 6 5 4 3 2 1 0
4331
0
= MSB
*
Figure 47. Read Security Registers Instruction (SPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
Publication Release Date: April 29, 2013
- 84 - Preliminary - Revision F
8.2.44 Set Read Parameters (C0h)
In QPI mode, to accommodate a wide range of applications with different needs for either maximum read
frequency or minimum data access latency, “Set Read Parameters (C0h)” instruction can be used to
configure the number of dummy clocks for “Fast Read (0Bh)”, “Fast Read Quad I/O (EBh)” & “Burst Read
with Wrap (0Ch)” instructions, and to configure the number of bytes of “Wrap Length” for the “Burst Read
with Wrap (0Ch)” instruction.
In Standard SPI mode, the “Set Read Parameters (C0h)” instruction is not accepted. The dummy clocks
for various Fast Read instructions in Standard/Dual/Quad SPI mode are fixed, please refer to the
Instruction Table 1-3 for details. The “Wrap Length” is set by W5-4 bit in the “Set Burst with Wrap (77h)”
instruction. This setting will remain unchanged when the device is switched from Standard SPI mode to
QPI mode.
The default “Wrap Length” after a power up or a Reset instruction is 8 bytes, the default number of
dummy clocks is 2. The number of dummy clocks is only programmable for “Fast Read (0Bh)”, “Fast
Read Quad I/O (EBh)” & “Burst Read with Wrap (0Ch)” instructions in the QPI mode. Whenever the
device is switched from SPI mode to QPI mode, the number of dummy clocks should be set again, prior
to any 0Bh, EBh or 0Ch instructions.
P5 – P4
DUMMY
CLOCKS
MAXIMUM
READ FREQ.
MAXIMUM
READ FREQ.
(A[1:0]=0,0)
MAXIMUM
READ FREQ.
(A[1:0]=0,0
VCC=3.0V~3.6V)
P1 – P0
WRAP
LENGTH
0 0 2 33MHz 33MHz 40MHz
0 0 8-byte
0 1
4 55MHz 80MHz 80MHz
0 1
16-byte
1 0 6 80MHz 80MHz 104MHz
1 0 32-byte
1 1
8 80MHz 80MHz 104MHz
1 1
64-byte
/CS
CLK
Mode 0
Mode 3 0 1
IO0
IO1
IO2
IO3
C0h
2 3
Read
Parameters
P4 P0
P5 P1
P6 P2
P7 P3
Instruction
Mode 0
Mode 3
Figure 48. Set Read Parameters Instruction (QPI Mode only)
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W25Q256FV
- 85 -
8.2.45 Burst Read with Wrap (0Ch)
The “Burst Read with Wrap (0Ch)” instruction provides an alternative way to perform the read operation
with “Wrap Around” in QPI mode. The instruction is similar to the “Fast Read (0Bh)” instruction in QPI
mode, except the addressing of the read operation will “Wrap Around” to the beginning boundary of the
“Wrap Length” once the ending boundary is reached.
The “Wrap Length” and the number of dummy clocks can be configured by the “Set Read Parameters
(C0h)” instruction.
Dummy
*
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
0Ch
2345
20 16 12 8
21 17
22 18
23 19
13 9
14 10
15 11
A23-16
6 7 8 9
4 0
5 1
6 2
7 3
A15-8 A7-0
Byte 1 Byte 2
4 0
5 1
6 2
7 3
4 0
5 1
6 2
7 3
10 11 12 13 14
4
5
6
7
IOs switch from
Input to Output
*
"Set Read Parameters" instruction (C0h) can
set the number of dummy clocks.
Byte 3
Instruction
Figure 49. Burst Read with Wrap Instruction (QPI Mode only)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
'1' winband 1'.
W25Q256FV
Publication Release Date: April 29, 2013
- 86 - Preliminary - Revision F
8.2.46 Enter QPI Mode (38h)
The W25Q256FV support both Standard/Dual/Quad Serial Peripheral Interface (SPI) and Quad
Peripheral Interface (QPI). However, SPI mode and QPI mode cannot be used at the same time. “Enter
QPI (38h)” instruction is the only way to switch the device from SPI mode to QPI mode.
Upon power-up, the default state of the device upon is Standard/Dual/Quad SPI mode. This provides full
backward compatibility with earlier generations of Winbond serial flash memories. See Instruction Set
Table 1-3 for all supported SPI commands. In order to switch the device to QPI mode, the Quad Enable
(QE) bit in Status Register-2 must be set to 1 first, and an “Enter QPI (38h)” instruction must be issued. If
the Quad Enable (QE) bit is 0, the “Enter QPI (38h)” instruction will be ignored and the device will remain
in SPI mode.
See Instruction Set Table 4-6 for all the commands supported in QPI mode.
When the device is switched from SPI mode to QPI mode, the existing Write Enable and Program/Erase
Suspend status, and the Wrap Length setting will remain unchanged.
/CS
CLK
DI
(IO0)
DO
(IO1)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (38h)
High Impedance
Mode 0
Mode 3
Figure 50. Enter QPI Instruction (SPI Mode only)
'1' winband 1'.
W25Q256FV
- 87 -
8.2.47 Exit QPI Mode (FFh)
In order to exit the QPI mode and return to the Standard/Dual/Quad SPI mode, an “Exit QPI (FFh)”
instruction must be issued.
When the device is switched from QPI mode to SPI mode, the existing Write Enable Latch (WEL) and
Program/Erase Suspend status, and the Wrap Length setting will remain unchanged.
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
FFh
Instruction
Mode 0
Mode 3
Figure 51. Exit QPI Instruction (QPI Mode only)
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W25Q256FV
Publication Release Date: April 29, 2013
- 88 - Preliminary - Revision F
8.2.48 Individual Block/Sector Lock (36h)
The Individual Block/Sector Lock provides an alternative way to protect the memory array from adverse
Erase/Program. In order to use the Individual Block/Sector Locks, the WPS bit in Status Register-3 must
be set to 1. If WPS=0, the write protection will be determined by the combination of CMP, TB, BP[3:0] bits
in the Status Registers. The Individual Block/Sector Lock bits are volatile bits. The default values after
device power up or after a Reset are 1, so the entire memory array is being protected.
To lock a specific block or sector as illustrated in Figure 4d, an Individual Block/Sector Lock command
must be issued by driving /CS low, shifting the instruction code “36h” into the Data Input (DI) pin on the
rising edge of CLK, followed by a 24/32-bit address and then driving /CS high.
Figure 52a. Individual Block/Sector Lock Instruction (SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
Figure 52b. Individual Block/Sector Lock Instruction (QPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
- 89 -
8.2.49 Individual Block/Sector Unlock (39h)
The Individual Block/Sector Lock provides an alternative way to protect the memory array from adverse
Erase/Program. In order to use the Individual Block/Sector Locks, the WPS bit in Status Register-3 must
be set to 1. If WPS=0, the write protection will be determined by the combination of CMP, TB, BP[3:0] bits
in the Status Registers. The Individual Block/Sector Lock bits are volatile bits. The default values after
device power up or after a Reset are 1, so the entire memory array is being protected.
To unlock a specific block or sector as illustrated in Figure 4d, an Individual Block/Sector Unlock
command must be issued by driving /CS low, shifting the instruction code “39h” into the Data Input (DI)
pin on the rising edge of CLK, followed by a 24/32-bit address and then driving /CS high.
Figure 53a. Individual Block Unlock Instruction (SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
Figure 53b. Individual Block Unlock Instruction (QPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
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W25Q256FV
Publication Release Date: April 29, 2013
- 90 - Preliminary - Revision F
8.2.50 Read Block/Sector Lock (3Dh)
The Individual Block/Sector Lock provides an alternative way to protect the memory array from adverse
Erase/Program. In order to use the Individual Block/Sector Locks, the WPS bit in Status Register-3 must
be set to 1. If WPS=0, the write protection will be determined by the combination of CMP, TB, BP[3:0] bits
in the Status Registers. The Individual Block/Sector Lock bits are volatile bits. The default values after
device power up or after a Reset are 1, so the entire memory array is being protected.
To read out the lock bit value of a specific block or sector as illustrated in Figure 4d, a Read
Block/Sector Lock command must be issued by driving /CS low, shifting the instruction code “3Dh” into
the Data Input (DI) pin on the rising edge of CLK, followed by a 24/32-bit address. The Block/Sector Lock
bit value will be shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first as
shown in Figure 54. If the least significant bit (LSB) is 1, the corresponding block/sector is locked; if
LSB=0, the corresponding block/sector is unlocked, Erase/Program operation can be performed.
Figure 54a. Read Block Lock Instruction (SPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
Figure 54b. Read Block Lock Instruction (QPI Mode)
32-Bit Address is required when the device is operating in 4-Byte Address Mode
1'. winband Ill P7 InsnucnonWEh) 4% '0” :X: E DI X 7 K X (IOU) '0‘ DO High Impedance '01 (IOU DO ngh Impedance '02
W25Q256FV
- 91 -
8.2.51 Global Block/Sector Lock (7Eh)
All Block/Sector Lock bits can be set to 1 by the Global Block/Sector Lock instruction. The command
must be issued by driving /CS low, shifting the instruction code “7Eh” into the Data Input (DI) pin on the
rising edge of CLK, and then driving /CS high.
Figure 55. Global Block Lock Instruction for SPI Mode (left) or QPI Mode (right)
8.2.52 Global Block/Sector Unlock (98h)
All Block/Sector Lock bits can be set to 0 by the Global Block/Sector Unlock instruction. The command
must be issued by driving /CS low, shifting the instruction code “98h” into the Data Input (DI) pin on the
rising edge of CLK, and then driving /CS high.
Figure 56. Global Block Unlock Instruction for SPI Mode (left) or QPI Mode (right)
1'. winband 1..
W25Q256FV
Publication Release Date: April 29, 2013
- 92 - Preliminary - Revision F
8.2.53 Enable Reset (66h) and Reset Device (99h)
Because of the small package and the limitation on the number of pins, the W25Q256FV provide a
software Reset instruction instead of a dedicated RESET pin. Once the Reset instruction is accepted, any
on-going internal operations will be terminated and the device will return to its default power-on state and
lose all the current volatile settings, such as Volatile Status Register bits, Write Enable Latch (WEL)
status, Program/Erase Suspend status, Read parameter setting (P7-P0), Continuous Read Mode bit
setting (M7-M0) and Wrap Bit setting (W6-W4).
“Enable Reset (66h)” and “Reset (99h)” instructions can be issued in either SPI mode or QPI mode. To
avoid accidental reset, both instructions must be issued in sequence. Any other commands other than
“Reset (99h)” after the “Enable Reset (66h)” command will disable the “Reset Enable” state. A new
sequence of “Enable Reset (66h)” and “Reset (99h)” is needed to reset the device. Once the Reset
command is accepted by the device, the device will take approximately tRST=30us to reset. During this
period, no command will be accepted.
Data corruption may happen if there is an on-going or suspended internal Erase or Program operation
when Reset command sequence is accepted by the device. It is recommended to check the BUSY bit
and the SUS bit in Status Register before issuing the Reset command sequence.
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (99h)
Mode 0
Mode 3
/CS
CLK
DI
(IO
0
)
DO
(IO
1
)
Mode 0
Mode 3 0 1 2 3 4 5 6 7
Instruction (66h)
High Impedance
Figure 57a. Enable Reset and Reset Instruction Sequence (SPI Mode)
Mode 0
Mode 3 0 1
99h
Instruction
Mode 0
Mode 3
/CS
CLK
Mode 0
Mode 3 0 1
IO
0
IO
1
IO
2
IO
3
66h
Instruction
Figure 57b. Enable Reset and Reset Instruction Sequence (QPI Mode)
'1. winband 1'.
W25Q256FV
- 93 -
9. ELECTRICAL CHARACTERISTICS
9.1 Absolute Maximum Ratings
(1)
PARAMETERS SYMBOL
CONDITIONS RANGE UNIT
Supply Voltage VCC –0.6 to 4.6 V
Voltage Applied to Any Pin V
IO
Relative to Ground –0.6 to VCC+0.4 V
Transient Voltage on any Pin V
IOT
<20nS Transient
Relative to Ground –2.0V to VCC+2.0V
V
Storage Temperature T
STG
–65 to +150 °C
Lead Temperature T
LEAD
See Note
(2)
°C
Electrostatic Discharge Voltage
V
ESD
Human Body Model
(3)
–2000 to +2000 V
Notes:
1. This device has been designed and tested for the specified operation ranges. Proper operation outside
of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability.
Exposure beyond absolute maximum ratings may cause permanent damage.
2. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and
the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
3. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 ohms, R2=500 ohms).
9.2 Operating Ranges
PARAMETER SYMBOL
CONDITIONS SPEC UNIT
MIN MAX
Supply Voltage
(1)
VCC F
R
= 80~104MHz, f
R
= 50MHz 2.7 3.6 V
Ambient Temperature,
Operating T
A
Industrial –40 +85 °C
Note:
1. VCC voltage during Read can operate across the min and max range but should not exceed ±10% of
the programming (erase/write) voltage.
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Publication Release Date: April 29, 2013
- 94 - Preliminary - Revision F
9.3 Power-up Timing and Write Inhibit Threshold
PARAMETER SYMBOL SPEC UNIT
MIN MAX
VCC (min) to /CS Low t
VSL(1)
10 µs
Time Delay Before Write Instruction t
PUW(1)
1 10 ms
Write Inhibit Threshold Voltage V
WI(1)
1.0 2.0 V
Note:
1. These parameters are characterized only.
VCC
tVSL Read Instructions
Allowed Device is fully
Accessible
tPUW
/CS must track VCC
Program, Erase and Write Instructions are ignored
Reset
State
VCC
(max)
VCC
(min)
V
WI
Time
Figure 58. Power-up Timing and Voltage Levels
VCC
Time
/CS must track VCC
during VCC Ramp Up/Down
/CS
Figure 58b. Power-up, Power-Down Requirement
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W25Q256FV
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9.4 DC Electrical Characteristics
PARAMETER SYMBOL
CONDITIONS SPEC UNIT
MIN TYP MAX
Input Capacitance C
IN(1)
V
IN
= 0V
(1)
6 pF
Output Capacitance Cout
(1)
V
OUT
= 0V
(1)
8 pF
Input Leakage I
LI
±2 µA
I/O Leakage I
LO
±2 µA
Standby Current I
CC
1
/CS = VCC,
VIN = GND or VCC
10 50 µA
Power-down Current I
CC
2 /CS = VCC,
VIN = GND or VCC
1 20 µA
Current Read Data /
Dual /Quad 1MHz
(2)
I
CC
3 C = 0.1 VCC / 0.9 VCC
DO = Open
4 10 mA
Current Read Data /
Dual /Quad 50MHz
(2)
I
CC
3 C = 0.1 VCC / 0.9 VCC
DO = Open
15 mA
Current Read Data /
Dual /Quad 80MHz
(2)
I
CC
3 C = 0.1 VCC / 0.9 VCC
DO = Open
18 mA
Current Read Data /
Dual Output Read/Quad
Output Read 104MHz
(2)
I
CC
3 C = 0.1 VCC / 0.9 VCC
DO = Open
20 mA
Current Write Status
Register I
CC
4 /CS = VCC
8 12 mA
Current Page Program I
CC
5 /CS = VCC
20 25 mA
Current Sector/Block
Erase I
CC
6 /CS = VCC
20 25 mA
Current Chip Erase I
CC
7 /CS = VCC
20 25 mA
Input Low Voltage V
IL
–0.5 VCC x 0.3
V
Input High Voltage V
IH
VCC x 0.7
VCC + 0.4
V
Output Low Voltage V
OL
I
OL
= 100 µA
0.2 V
Output High Voltage V
OH
I
OH
= –100 µA
VCC – 0.2
V
Notes:
1. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3. 0V.
2. Checker Board Pattern.
'1. winband 1'.
W25Q256FV
Publication Release Date: April 29, 2013
- 96 - Preliminary - Revision F
9.5 AC Measurement Conditions
PARAMETER SYMBOL SPEC UNIT
MIN MAX
Load Capacitance C
L
30 pF
Input Rise and Fall Times T
R
, T
F
5 ns
Input Pulse Voltages V
IN
0.1 VCC to 0.9 VCC V
Input Timing Reference Voltages
IN
0.3 VCC to 0.7 VCC V
Output Timing Reference Voltages O
UT
0.5 VCC to 0.5 VCC V
Note:
1. Output Hi-Z is defined as the point where data out is no longer driven.
Input and Output
Timing Reference Levels
Input Levels
0.9 VCC
0.1 VCC
0.5 VCC
Figure 59. AC Measurement I/O Waveform
1'. winband 1.. (03h, aan, EBh, 63h, EEh, E7h, Eam EBh, 00h), wuh dilierent dummy clocks 2.7V-3.6V VCC & Industrial Temperature
W25Q256FV
- 97 -
9.6 AC Electrical Characteristics
(6)
DESCRIPTION SYMBOL ALT
SPEC UNIT
MIN
TYP
MAX
Clock frequency for Read Data instruction (03h) f
R
D.C.
50 MHz
Clock frequency for Fast Read instructions
(
0Bh, 3Bh, BBh,
6Bh, EBh, E7h, E3h)
F
R
f
C1
D.C.
80 MHz
Clock frequency for QPI Read instructions (0Bh,
EBh, 0Ch), with different dummy clocks
F
R
f
C1
D.C.
33~80 MHz
Clock frequency for all other instructions
2.7V
-
3.6
V VCC & Industrial Temperature
F
R
f
C1
D.C.
104 MHz
Clock High, Low Time
for all instructions except for Read Data (03h) t
CLH
,
t
CLL
(1)
4 ns
Clock High, Low Time
for Read Data (03h) instruction t
CRLH
,
t
CRLL
(1)
8 ns
Clock Rise Time peak to peak t
CLCH
(2)
0.1 V/ns
Clock Fall Time peak to peak t
CHCL
(2)
0.1 V/ns
/CS Active Setup Time relative to CLK t
SLCH
t
CSS
5 ns
/CS Not Active Hold Time relative to CLK t
CHSL
5 ns
Data In Setup Time t
DVCH
t
DSU
2 ns
Data In Hold Time t
CHDX
t
DH
3 ns
/CS Active Hold Time relative to CLK t
CHSH
3 ns
/CS Not Active Setup Time relative to CLK t
SHCH
3 ns
/CS Deselect Time (for Array Read Array Read)
t
SHSL
1
t
CSH
10 ns
/CS Deselect Time (for Erase or Program Read
Status Registers)
Volatile Status Register Write Time
t
SHSL
2
t
CSH
50
50
ns
Output Disable Time t
SHQZ
(2)
t
DIS
7 ns
Clock Low to Output Valid
2.7V-3.0V / 3.0V-3.6V t
CLQV
1
t
V
1
7 / 6 ns
Clock Low to Output Valid (Non-array Read)
2.7V-3.0V / 3.0V-3.6V t
CLQV
2
t
V
2
8.5 / 7.5
ns
Output Hold Time t
CLQX
t
HO
2 ns
/HOLD Active Setup Time relative to CLK t
HLCH
5 ns
Continued – next page
winband 45
W25Q256FV
Publication Release Date: April 29, 2013
- 98 - Preliminary - Revision F
9.7 AC Electrical Characteristics (
cont’d)
DESCRIPTION SYMBOL ALT
SPEC
UNIT
MIN TYP MAX
/HOLD Active Hold Time relative to CLK t
CHHH
5 ns
/HOLD Not Active Setup Time relative to CLK t
HHCH
5 ns
/HOLD Not Active Hold Time relative to CLK t
CHHL
5 ns
/HOLD to Output Low-Z t
HHQX
(
2)
t
LZ
7 ns
/HOLD to Output High-Z t
HLQZ
(
2)
t
HZ
12 ns
Write Protect Setup Time Before /CS Low t
WHSL
(
3)
20 ns
Write Protect Hold Time After /CS High t
SHWL
(
3)
100 ns
/CS High to Power-down Mode t
DP
(
2)
3 µs
/CS High to Standby Mode without ID Read t
RES
1
(
2)
3 µs
/CS High to Standby Mode with ID Read t
RES
2
(
2)
1.8 µs
/CS High to next Instruction after Suspend t
SUS
(
2)
20 µs
/CS High to next Instruction after Reset t
RST
(
2)
30 µs
/RESET pin Low period to reset the device t
RESET
(
2)
1
(5)
µs
Write Status Register Time t
W
10 15 ms
Byte Program Time (First Byte)
(4)
t
BP1
30 50 µs
Additional Byte Program Time (After First Byte)
(4)
t
BP2
2.5 12 µs
Page Program Time t
PP
0.7 3 ms
Sector Erase
Time (4KB)
W25Q256FvxxIG & W25Q256FVxxIP
t
SE
10
0
400 ms
W25Q256FVxxIQ & W25Q256FVxxIF
45
Block Erase Time (32KB) t
BE
1
120 1,600 ms
Block Erase Time (64KB) t
BE
2
150 2,000 ms
Chip Erase Time t
CE
80 400 s
Notes:
1. Clock high + Clock low must be less than or equal to 1/f
C
.
2. Value guaranteed by design and/or characterization, not 100% tested in production.
3. Only applicable as a constraint for a Write Status Register instruction when SRP[1:0]=(0,1).
4. For multiple bytes after first byte within a page,
t
BPN
=
t
BP1
+
t
BP2
*
N
(typical) and
t
BPN
=
t
BP1
+
t
BP2
*
N
(max), where N =
number of bytes programmed.
5. It is possible to reset the device with shorter tRESET (as short as a few hundred ns), a 1us minimum is recommended to
ensure reliable operation.
6. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3. 0V, 100% driver
strength.
T
W25Q256FV
- 99 -
9.8 Serial Output Timing
/CS
CLK
IO
output
tCLQX tCLQV
tCLQX tCLQV tSHQZtCLL
LSB OUT
tCLH
MSB OUT
9.9 Serial Input Timing
/CS
CLK
IO
input
tCHSL
MSB IN
tSLCH
tDVCH tCHDX
tSHCHtCHSH
tCLCH tCHCL
LSB IN
tSHSL
9.10 /HOLD Timing
/CS
CLK
IO
output
/HOLD
tCHHL tHLCH
tCHHH
tHHCH
tHLQZ tHHQX
IO
input
9.11 /WP Timing
/CS
CLK
/WP
tWHSL tSHWL
IO
input
Write Status Register is allowed Write Status Register is not allowed
winband 1..
W25Q256FV
Publication Release Date: April 29, 2013
- 100 - Preliminary - Revision F
10. PACKAGE SPECIFICATIONS
10.1 8-Pad WSON 8x6-mm (Package Code E)
Symbol Millimeters Inches
Min Nom Max Min Nom Max
A 0.70 0.75 0.80 0.028 0.030 0.031
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.35 0.40 0.48 0.014 0.016 0.019
C --- 0.20 REF --- --- 0.008 REF
---
D 7.90 8.00 8.10 0.311 0.315 0.319
D2 3.35 3.40 3.45 0.132 0.134 0.136
E 5.90 6.00 6.10 0.232 0.236 0.240
E2 4.25 4.30 4.35 0.167 0.169 0.171
e --- 1.27 --- --- 0.050 ---
L 0.45 0.50 0.55 0.018 0.020 0.022
y 0.00 --- 0.050 0.000 --- 0.002
winband 1..
W25Q256FV
- 101 -
Symbol Millimeters Inches
Min Nom Max Min Nom Max
A 0.70 0.75 0.80 0.028 0.030 0.031
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.35 0.40 0.48 0.014 0.016 0.019
C --- 0.20 REF --- --- 0.008 REF
---
D 7.90 8.00 8.10 0.311 0.315 0.319
D2 3.35 3.40 3.45 0.132 0.134 0.136
E 5.90 6.00 6.10 0.232 0.236 0.240
E2 4.25 4.30 4.35 0.167 0.169 0.171
e --- 1.27 --- --- 0.050 ---
L 0.45 0.50 0.55 0.018 0.020 0.022
y 0.00 --- 0.050 0.000 --- 0.002
Note:
The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It can be
left floating or connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad.
1'. winband 1.. HHHHHHHHi
W25Q256FV
Publication Release Date: April 29, 2013
- 102 - Preliminary - Revision F
10.2 16-Pin SOIC 300-mil (Package Code F)
Symbol Millimeters Inches
Min Nom Max Min Nom Max
A 2.36 2.49 2.64 0.093 0.098 0.104
A1 0.10 --- 0.30 0.004 --- 0.012
A2 --- 2.31 --- --- 0.091 ---
b 0.33 0.41 0.51 0.013 0.016 0.020
C 0.18 0.23 0.28 0.007 0.009 0.011
D 10.08 10.31 10.49 0.397 0.406 0.413
E 10.01 10.31 10.64 0.394 0.406 0.419
E1 7.39 7.49 7.59 0.291 0.295 0.299
e 1.27 BSC 0.050 BSC
L 0.38 0.81 1.27 0.015 0.032 0.050
y --- --- 0.076 --- --- 0.003
θ 0° --- 8° 0° --- 8°
1'. winband 1.. El .+ + + I \ \ b *-I' l‘ L_.‘ I .— V LLLLL fl
W25Q256FV
- 103 -
10.3 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array)
Symbol Millimeters Inches
Min Nom Max Min Nom Max
A --- --- 1.20 --- --- 0.047
A1 0.25 0.30 0.35 0.010 0.012 0.014
A2 --- 0.85 --- --- 0.033 ---
b 0.35 0.40 0.45 0.014 0.016 0.018
D 7.90 8.00 8.10 0.311 0.315 0.319
D1 4.00 BSC 0.157 BSC
E 5.90 6.00 6.10 0.232 0.236 0.240
E1 4.00 BSC 0.157 BSC
SE 1.00 TYP 0.039 TYP
SD 1.00 TYP 0.039 TYP
e 1.00 BSC 0.039 BSC
Note:
Ball land: 0.45mm. Ball Opening: 0.35mm
PCB ball land suggested <= 0.35mm
1'. winband 1.. ,TH E, % a V E: ' *W‘H ‘ L , +4HTU Eb} ‘Lflfl—HDI
W25Q256FV
Publication Release Date: April 29, 2013
- 104 - Preliminary - Revision F
10.4 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array)
Symbol Millimeters Inches
Min Nom Max Min Nom Max
A --- --- 1.20 --- --- 0.047
A1 0.25 0.30 0.35 0.010 0.012 0.014
b 0.35 0.40 0.45 0.014 0.016 0.018
D 7.95 8.00 8.05 0.313 0.315 0.317
D1 5.00 BSC 0.197 BSC
E 5.95 6.00 6.05 0.234 0.236 0.238
E1 3.00 BSC 0.118 BSC
e 1.00 BSC 0.039 BSC
Note:
Ball land: 0.45mm. Ball Opening: 0.35mm
PCB ball land suggested <= 0.35mm
'1' winband 1'. W 250 256Fy 1 I” x Company Prefix | _ Product Family Product Number / Densiry Supply Voltage Package Type Temperature Range Special Opu’ons
W25Q256FV
- 105 -
11. ORDERING INFORMATION
Notes:
1. The “W” prefix and the Temperature designator “I” are not included on the part marking.
2. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
3. For shipments with special order options, please specify when placing orders.
W
(1)
25Q
256F
V x I
(1)
W = Winbond
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
256F = 256M-bit
V
= 2.7V to 3.6V
F = 16-pin SOIC 300-mil
E = 8-pad WSON 8x6mm
B
=
24-ball TFBGA 8x6-mm (5x5 ball array) C
=
24-ball TFBGA 8x6-mm (6x4 ball array)
I = Industrial (-40°C to +85°C)
(2,3)
G =
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb
2
O
3
)
F = Green Package with Fast Sector Erase time (tSE)
P
=
Green Package with Status Register Power-Down & OTP enabled
Q =
Green Package with QE=1 in Status Register-2
'1' winband 1'.
W25Q256FV
Publication Release Date: April 29, 2013
- 106 - Preliminary - Revision F
11.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q256FV SpiFlash Memory. Please
contact Winbond for specific availability by density and package type. Winbond SpiFlash memories use a
12-digit Product Number for ordering. However, due to limited space, the Top Side Marking on all
packages uses an abbreviated 10-digit number.
PACKAGE TYPE
DENSITY PRODUCT NUMBER TOP SIDE MARKING
F
SOIC-16 300mil
256M-bit
W25Q256FVFIG
W25Q256FVFIP
W25Q256FVFIQ
W25Q256FVFIF
25Q256FVFG
25Q256FVFP
25Q256FVFQ
25Q256FVFF
E
WSON-8 8x6mm
256M-bit W25Q256FVEIG
W25Q256FVEIP
W25Q256FVEIF
25Q256FVEG
25Q256FVEP
25Q256FVEF
B
TFBGA-24 8x6mm
(5x5-1 Ball Array)
256M-bit W25Q256FVBIG
W25Q256FVBIP
W25Q256FVBIF
25Q256FVBG
25Q256FVBP
25Q256FVBF
C
TFBGA-24 8x6mm
(6x4 Ball Array)
256M-bit W25Q256FVCIG
W25Q256FVCIP
W25Q256FVCIF
25Q256FVCG
25Q256FVCP
25Q256FVCF
'1. winband P/ease note me; all flats and spectrum: are sun/eclm change mnomnonce AN me (/adE/navks clumducts am cumnames menfmned m m dates/lee! [mom to (he/I respectwe owners
W25Q256FV
- 107 -
12. REVISION HISTORY
VERSION
DATE PAGE DESCRIPTION
A 03/23/2011
New Create Preliminary
B 07/21/2011
26-27, 29, 92
81-82
99-100
Updated “Read Sector/Block Lock” instruction code
Updated SFDP table
Updated AC parameters
C1 06/06/2012
9, 13, 98
80
98
100
104-105
Updated RESET descriptions
Referred to SFDP definition application note
Updated Erase Time
Updated WSON metal pad size
Added Q order option
D
03/15/2013
94
98
104,105
Added power-down requirement
Modified the t
SE
of W25Q256FVxxIQ & IF
Added W25Q256FVxxIF into order information
E
04/12/2013
98 Modified the t
SE
of W25Q256FVxxIQ & IF
F 04/29/2013
18
19
93
101
Added Quad Enable default description
Added description of DRV default setting
Modified the typo of Supply Voltage
Updated note for metal pad for WSON, USON
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully characterized.
The specifications are subject to change and are not guaranteed. Winbond or an authorized sales
representative should be consulted for current information before using this product.
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Furthermore, Winbond products are not intended for
applications wherein failure of Winbond products could result or lead to a situation wherein personal injury,
death or severe property or environmental damage could occur. Winbond customers using or selling
these products for use in such applications do so at their own risk and agree to fully indemnify Winbond
for any damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document
and the products and services described herein at any time, without notice.

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