NCP1081 Datasheet by ON Semiconductor

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May, 2013 − Rev. 7

1Publication Order Number:

NCP1081/D

NCP1081

Integrated High Power

PoE-PD Interface & DC-DC

Converter Controller

Introduction

The NCP1081 is a member of ON Semiconductor’s high power

HIPO Power over Ethernet Powered Device (PoE−PD) product family

and represents a robust, flexible and highly integrated solution

targeting demanding medium and high power Ethernet applications. It

combines in a single unit an enhanced PoE−PD interface supporting

the IEEE802.3af and the 802.3at standard and a flexible and

configurable DC−DC converter controller.

The NCP1081’s exceptional capabilities offer new opportunities for

the design of products powered directly over Ethernet lines,

eliminating the need for local power adaptors or power supplies and

drastically reducing the overall installation and maintenance cost.

ON Semiconductor’s unique manufacturing process and design

enhancements allow the NCP1081 to deliver up to 25.5 W for the

IEEE802.3at standard and up to 40 W for proprietary high power PoE

applications. The NCP1081 enables the IEEE802.3at and implements

a two event physical layer classification. Additional proprietary

classification procedures support high power power sourcing

equipment (PSE) on the market. The unique high power features

leverage the significant cost advantages of PoE− enabled systems to a

much broader spectrum of products in emerging markets such as

industrial ethernet devices, PTZ and Dome IP cameras, RFID readers,

MIMO WLAN access points, high end VoIP phones, notebooks, etc.

The integrated current mode DC−DC controller facilitates isolated

and non−isolated fly−back, forward and buck converter topologies. It

has all the features necessary for a flexible, robust and highly efficient

design including programmable switching frequency, duty cycle up to

80 percent, slope compensation, and soft start−up.

The NCP1081 is fabricated in a robust high voltage

process and integrates a rugged vertical N−channel DMOS

with a low loss current sense technique suitable for the most

demanding environments and capable of withstanding harsh

environments such as hot swap and cable ESD events.

The NCP1081 complements ON Semiconductor’s ASSP

portfolio in industrial devices and can be combined with

stepper motor drivers, CAN bus drivers and other high−

voltage interfacing devices to offer complete solutions to the

industrial and security market.

Features

•These are Pb−Free Devices

Powered Device Interface

•Supporting the IEEE802.3af and the 802.3at Standard

•Supports IEEE802.3at Two Event Layer 1

Classification

•High Power Layer 1 Classification Indicator

•Extended Power Ranges up to 40 W

•Programmable Classification Current

•Adjustable Under Voltage Lock Out

•Programmable Inrush Current Limit

•Programmable Operational Current Limit up to

1100 mA for Extended Power Ranges

•Over−temperature Protection

•Industrial Temperature Range −40°C to 85°C with Full

Operation up to 150°C Junction Temperature

•0.6 W Hot−swap Pass−switch with Low Loss Current

Sense Technique

•Vertical N−channel DMOS Pass−switch offers the

Robustness of Discrete MOSFETs with Integrated

Temperature Control

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See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

NCP1081 = Specific Device Code

XXXX = Date Code

Y = Assembly Location

ZZ = Traceability Code

TSSOP−20 EP

DE SUFFIX

CASE 948AB

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DC−DC Converter Controller

•Current Mode Control

•Supports Isolated and Non−isolated DC−DC Converter

Applications

•Internal Voltage Regulators

•Wide Duty Cycle Range with Internal Slope

Compensation Circuitry

•Programmable Oscillator Frequency

•Programmable Soft−start Time

(Top View)

PIN DIAGRAM

Exposed

Pad

1SS

COMP

VDDL

VDDH

GATE

ARTN

nCLASS_AT

OSC

VPORTP

CLASS

UVLO

INRUSH

ILIM1

VPORTN1

RTN

VPORTN2

TEST1

TEST2

ORDERING INFORMATION

Part Number Package Shipping Configuration†Temperature Range

NCP1081DEG TSSOP−20 EP

(Pb−Free)

74 units / Tube −40°C to 85°C

NCP1081DER2G TSSOP−20 EP

(Pb−Free)

2500 / Tape & Reel −40°C to 85°C

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specification Brochure, BRD8011/D.

Figure 1. NCP1081 Block Diagram

INTERNAL

SUPPLY

VDDH

INRUSH

ILIM1

CLASSIFICATION

DETECTION

VPORTN1,2

VPORTP

CLASS

INRUSH

ILIM1

VDDH

nCLASS_AT

VDDL

THERMAL

HOT SWAP SWITCH

CONTROL & CURRENT

LIMIT BLOCKS

UVLO

RTN

ARTN

1.2 V

CONTROL

OSC

GATE

VDDL

VDDH

5 K

OSC

VDDL

VPORT

MONITOR

20 mA

COMP

5 mA

SHUT

DOWN

CONVERTER

DC−DC

BANDGAP

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SIMPLIFIED APPLICATION DIAGRAMS

Figure 2. Isolated Fly−back Converter

LD1

Rd1

NCP1081

Cline

Spare

Pairs

Rcs

Cvddh

Cpd

Css Rosc

Cload

Rclass

Rilim1

Rinrush

Optocoupler

Rslope

Voutput

RJ−45

DB1

DB2

OC1

Z_line

GATE

RTN

COMP

VPORTN2

VDDH

VDDL

OSC

VPORTN1

CLASS

ARTN

ILIM1

INRUSH

TEST1

TEST2

UVLO

VPORTP

Cvddl

nCLASS_AT

Data

Pairs

Figure 2 shows the integrated PoE−PD switch and DC−DC controller configured to work in a fully isolated application. The

output voltage regulation is accomplished with an external opto−coupler and a shunt regulator (Z1).

Figure 3. Non−Isolated Fly−back Converter

NCP1081

GATE

RTN

COMP

VPORTN2

VDDH

VDDL

Rcs

Cvddh

Cpd

C1comp

C2comp

Rcomp

OSC

Css

VPORTN1

CLASS

ARTN

ILIM1

INRUSH

TEST1

TEST2

Rclass

Rilim1

Rinrush

UVLO

VPORTP

Rslope

Voutput

Cline

Spare

Pairs

RJ−45

DB1

DB2

Z_line

LD1

Rd1

Cvddl

nCLASS_AT

Rosc

R3 Cload

Data

Pairs

Figure 3 shows the integrated PoE−PD and DC−DC controller configured in a non−isolated fly−back configuration. A

compensation network is inserted between the FB and the COMP pin for overall stability of the feedback loop.

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SIMPLIFIED APPLICATION DIAGRAMS

Figure 4. Non−Isolated Fly−back with Extra Winding

Cpd

NCP1081

GATE

RTN

COMP

VPORTN2

VDDH

VDDL

Rcs

Cvddh

C1comp

C2comp

Rcomp

OSC

Css

VPORTN1

CLASS

ARTN

ILIM1

INRUSH

TEST1

TEST2

Rclass

Rilim1

Rinrush

UVLO

VPORTP

Rslope

D2 T1

Voutput

Cline

Spare

Pairs

RJ−45

DB1

DB2

Z_line

LD1

Rd1

Cvddl

nCLASS_AT

Cload

Rosc

Data

Pairs

Figure 4 shows the same non−isolated fly−back configuration as Figure 3, but adds a 12 V auxiliary bias winding on the

transformer to provide power to the NCP1081 DC−DC controller via its VDDH pin. This topology shuts off the current flowing

from VPORTP to VDDH and therefore reduces the internal power dissipation of the PD, resulting in higher overall power

efficiency.

Figure 5. Non−Isolated Forward Converter

Cpd

NCP1081

GATE

RTN

COMP

VPORTN2

VDDH

VDDL

Rcs

Cvddh

C1comp

C2comp

Rcomp

OSC

Css

Cload

VPORTN1

CLASS

ARTN

ILIM1

INRUSH

TEST1

TEST2

Rclass

Rilim1

Rinrush

UVLO

VPORTP L1

Rslope

Voutput

Cline

Spare

Pairs

RJ−45

DB1

DB2

Z_line

LD1

Rd1

Cvddl

nCLASS_AT

Data

Pairs

Rosc

Figure 5 shows the NCP1081 used in a non−isolated forward topology.

High Power Considerations

The NCP1081 is designed to implement various

configurations of high−power PoE systems including those

based on the IEEE802.3at standard. High power operation

can be enabled by a Dual Event Layer 1 classification or a

Single Event Layer 1 classification combined with a Layer 2

high power classification. The NCP1081 also supports

proprietary designs capable of delivering 25 W to 40 W to

the load in two−pair configurations. A separate application

note describes these implementations (AND8332).

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Table 1. PIN DESCRIPTIONS

Name Pin No. Type Description

VPORTP 1 Supply Positive input power. Voltage with respect to VPORTN1,2.

VPORTN1

VPORTN2

6,8 Ground Negative input power. Connected to the source of the internal pass−switch.

RTN 7 Ground DC−DC controller power return. Connected to the drain of the internal pass−switch. It must

be connected to ARTN. This pin is also the drain of the internal pass−switch.

ARTN 14 Ground DC−DC controller ground pin. Must be connected to RTN as a single point ground connection

for improved noise immunity.

VDDH 16 Supply Output of the 9 V LDO internal regulator. Voltage with respect to ARTN. Supplies the internal

gate driver. VDDH must be bypassed to ARTN with a 1 mF or 2.2 mF ceramic capacitor with

low ESR.

VDDL 17 Supply Output of the 3.3 V LDO internal regulator. Voltage with respect to ARTN. This pin can be

used to bias an external low−power LED (1 mA max.) connected to nCLASS_AT, and can

also be used to add extra biasing current in the external opto−coupler. VDDL must be by-

passed to ARTN with a 330 nF or 470 nF ceramic capacitor with low ESR.

CLASS 2 Input Classification current programming pin. Connect a resistor between CLASS and VPORTN1,2.

INRUSH 4 Input Inrush current limit programming pin. Connect a resistor between INRUSH and VPORTN1,2.

ILIM1 5 Input Operational current limit programming pin. Connect a resistor between ILIM1 and

VPORTN1,2.

UVLO 3 Input DC−DC controller under−voltage lockout input. Voltage with respect to VPORTN1,2. Connect

a resistor−divider from VPORTP to UVLO to VPORTN1,2 to set an external UVLO threshold.

GATE 15 Output DC−DC controller gate driver output pin.

OSC 11 Input Internal oscillator frequency programming pin. Connect a resistor between OSC and ARTN.

nCLASS_AT 13 Output,

Open Drain

Active−low, open−drain Layer 1 dual−finger classification indicator.

COMP 18 I/O Output of the internal error amplifier of the DC−DC controller. COMP is pulled−up internally to

VDDL with a 5 kW resistor. In isolated applications, COMP is connected to the collector of the

opto−coupler. Voltage with respect to ARTN.

FB 19 Input DC−DC controller inverting input of the internal error amplifier. In isolated applications, the pin

should be strapped to ARTN to disable the internal error amplifier.

CS 12 Input Current−sense input for the DC−DC controller. Voltage with respect to ARTN.

SS 20 Input Soft−start input for the DC−DC controller. A capacitor between SS and ARTN determines the

soft−start timing.

TEST1 9 Input Digital test pin must always be connected to VPORTN1,2.

TEST2 10 Input Digital test pin must always be connected to VPORTN1,2.

EP Exposed pad. Connected to VPORTN1,2 ground.

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Table 2. ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Min. Max. Units Conditions

VPORTP Input power supply −0.3 72 V Voltage with respect to VPORTN1,2

RTN

ARTN

Analog ground supply 2 −0.3 72 V Pass−switch in off−state

(Voltage with respect to VPORTN1,2)

VDDH Internal regulator output −0.3 17 V Voltage with respect to ARTN

VDDL Internal regulator output −0.3 3.6 V Voltage with respect to ARTN

CLASS Analog output −0.3 3.6 V Voltage with respect to VPORTN1,2

INRUSH Analog output −0.3 3.6 V Voltage with respect to VPORTN1,2

ILIM1 Analog output −0.3 3.6 V Voltage with respect to VPORTN1,2

UVLO Analog input −0.3 3.6 V Voltage with respect to VPORTN1,2

OSC Analog output −0.3 3.6 V Voltage with respect to ARTN

COMP Analog input / output −0.3 3.6 V Voltage with respect to ARTN

FB Analog input −0.3 3.6 V Voltage with respect to ARTN

CS Analog input −0.3 3.6 V Voltage with respect to ARTN

SS Analog input −0.3 3.6 V Voltage with respect to ARTN

nCLASS_AT Analog output −0.3 3.6 V Voltage with respect to ARTN

TEST1

TEST2

Digital inputs −0.3 3.6 V Voltage with respect to VPORTN1,2

Ta Ambient temperature −40 85 °C

Tj Junction temperature −150 °C

Tj−TSD Junction temperature (Note 1) −175 °CThermal shutdown condition

Tstg Storage Temperature −55 150 °C

TθJA Thermal Resistance,

Junction to Air (Note 2)

37.6 °C/W Exposed pad connected to VPORTN1,2 ground

ESD−HBM Human Body Model 4−kV per JEDEC Standard JESD22

ESD−CDM Charged Device Model 750 −V

ESD−MM Machine Model 300 −V

LU Latch−up ±200 −mA per JEDEC Standard JESD78

ESD−SYS System ESD (contact/air) (Note 3) 8/15 −kV

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Tj−TSD allowed during error conditions only. It is assumed that this maximum temperature condition does not occur more than 1 hour

cumulative during the useful life for reliability reasons.

2. Mounted on a 1S2P (3 layer) test board with copper coverage of 25 percent for the signal layers and 90 percent copper coverage for the

inner planes at an ambient temperature of 85°C in still air. Refer to JEDEC JESD51−7 for details.

3. Surges per EN61000−4−2, 1999 applied between RJ−45 and output ground and between adapter input and output ground of the evaluation

board. The specified values are the test levels and not the failure levels.

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Recommended Operating Conditions

Operating conditions define the limits for functional operation and parametric characteristics of the device. Note that the

functionality of the device outside the operating conditions described in this section is not warranted. Operating outside the

recommended operating conditions for extended periods of time may affect device reliability.

All values concerning the DC−DC controller, VDDH, VDDL, and nCLASS_AT blocks are with respect to ARTN. All others

are with respect to VPORTN1,2 (unless otherwise noted).

Table 3. OPERATING CONDITIONS

Symbol Parameter Min. Typ. Max. Units Conditions

INPUT SUPPLY

VPORT Input supply voltage 0 57 V VPORT = VPORTP −

VPORTN1,2

SIGNATURE DETECTION

Vsignature Input supply voltage signature detection

range

1.4 9.5 V

Rsignature Signature resistance (Note 4) 23.75 26.25 kW

Offset_current I_VportP + I_Rtn −1.8 5 mAVPORTP = RTN = 1.4 V

Sleep_current I_VportP + I_Rtn −15 25 mAVPORTP = RTN = 9.5 V

CLASSIFICATION

Vcl Input supply voltage classification range 13 20.5 V

V_mark Mark event voltage range

(VPORTP falling)

5.4 −9.7 V

I_mark Current consumption I(VPORTP) +

I(Rdet) in Mark Event range

0.5 −2.0 mA 5.4 V ≤ VPORT ≤ 9.5 V

dR_mark Input signature during Mark Event (Note 7) − − 12 kWFor information only

Vreset Classification Reset range

(VPORTP falling)

4.3 4.9 5.4 V

Iclass0 Class 0: Rclass 10 kW (Note 6) 0−4 mA Iclass0 = I_VportP + I_Rdet

Iclass1 Class 1: Rclass 130 W (Note 6) 9−12 mA Iclass1 = I_VportP + I_Rdet

Iclass2 Class 2: Rclass 69.8 W (Note 6) 17 −20 mA Iclass2 = I_VportP + I_Rdet

Iclass3 Class 3: Rclass 44.2 W (Note 6) 26 −30 mA Iclass3 = I_VportP + I_Rdet

Iclass4 Class 4: Rclass 30.9 W (Note 6) 36 −44 mA Iclass4 = I_VportP + I_Rdet

Iclass5 Class 5: Rclass 22.1 W (Notes 5 and 6)

(for proprietary high power applications)

50 −60 mA Iclass5 = I_VportP + I_Rdet

IDCclass Internal current consumption during classi-

fication (Note 8)

−600 −mAFor information only

CLASSIFICATION INDICATOR

nCLASS_AT_i nCLASS_AT current source 13 20 27 mA

NCLASS_AT_pd RDS,ON of NCLASS_AT pull down

transistor

130 WFor information only

4. Test done according to the IEEE802.3af 2 Point Measurement. The minimum probe voltages measured at the PoE−PD are 1.4 V and 2.4 V,

and the maximum probe voltages are 8.5 V and 9.5 V.

5. This extended classification range can be used with a PSE which also uses this classification range to deliver more current than specified

by IEEE802.3.

6. Measured with an external Rdet of 25.5 kW between VPORTP and VPORTN1,2, and for 13 V < VPORT < 20.5 V (with VPORT = VPORTP

– VPORTN1,2). Resistors are assumed to have 1% accuracy.

7. Measured with the 2 Point Measurement defined in the IEEE802.3af standard with 5.4 V and 9.5 V the extreme values for V2 and V1.

8. This typical current excludes the current in the Rclass and Rdet external resistors.

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Table 3. OPERATING CONDITIONS

Symbol Parameter Min. Typ. Max. Units Conditions

UVLO

Vuvlo_on Default turn on voltage (VportP rising) −38 40 V UVLO pin tied to VPORTN1,2

Vuvlo_off Default turn off voltage (VportP falling) 29.5 32 −VUVLO pin tied to VPORTN1,2

Vhyst_int UVLO internal hysteresis −6−VUVLO pin tied to VPORTN1,2

Vuvlo_pr UVLO external programming range 25 −50 V UVLO pin connected to the

resistor divider (R1 & R2).

For information only

Vhyst_ext UVLO external hysteresis −15 −%UVLO pin connected to the

resistor divider (R1 & R2)

Uvlo_Filter UVLO on/off filter time −90 −mSFor information only

PASS−SWITCH AND CURRENT LIMITS

Ron Pass−switch Rds−on −0.6 1.2 WMax Ron specified at

Tj = 130°C

I_Rinrush1 Rinrush = 150 kW (Note 9) 95 125 155 mA Measured at RTN−

VPORTN1,2 = 3 V

I_Rinrush2 Rinrush = 57.6 kW (Note 9) 260 310 360 mA Measured at RTN−

VPORTN1,2 = 3 V

I_Rilim1 Rilim1 = 84.5 kW (Note 9) 450 510 570 mA Current limit threshold

I_Rilim2 Rilim1 = 66.5 kW (Note 9) 600 645 690 mA Current limit threshold

I_Rilim3 Rilim1 = 55.6 kW (Note 9) 720 770 820 mA Current limit threshold

I_Rilim4 Rilim1 = 38.3 kW (Note 9) 970 1100 1230 mA Current limit threshold

INRUSH AND ILIM1 CURRENT LIMIT TRANSITION

Vds_pgood VDS required for power good status 0.8 1 1.2 V RTN−VPORTN1,2 falling; Volt-

age with respect to VPORTN1,2

Vds_pgood_hyst VDS hysteresis required for power

good status

−8.2 −VVoltage with respect to

VPORTN1,2

9. The current value corresponds to the PoE−PD input current (the current flowing in the external Rdet and the quiescent current of the device

are included). Resistors are assumed to have 1% accuracy.

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Table 3. OPERATING CONDITIONS

Symbol Parameter Min. Typ. Max. Units Conditions

VDDH REGULATOR

VDDH_reg Regulator output voltage

(Notes 10 and 11)

Ivddh_load + Ivddl_load < 10 mA

with

0 < Ivddl_load < 2.25 mA

8.4 9 9.6 V

VDDH_Off Regulator turn−off voltage −VDDH_reg

+ 0.5 V

−VFor information only

VDDH_lim VDDH regulator current limit

(Notes 10 and 11)

13 −26 mA

VDDH_Por_R VDDH POR level (rising) 7.3 −8.3 V

VDDH_Por_F VDDH POR level (falling) 6−7 V

VDDH_ovlo VDDH over−voltage level (rising) 16 −18.5 V

VDDL REGULATOR

VDDL_reg Regulator output voltage

(Notes 10 and 11)

0 < Ivddl_load < 2.25 mA

with

Ivddh_load + Ivddl_load < 10 mA

3.05 3.3 3.55 V

VDDL_Por_R VDDL POR level (rising) VDDL

− 0.2

−VDDL

− 0.02

VDDL_Por_F VDDL POR level (falling) 2.5 −2.9 V

GATE DRIVER

Gate_Tr GATE rise time (10−90%) − − 50 ns Cload = 2 nF, VDDHreg = 9 V

Gate_Tf GATE fall time (90−10%) − − 50 ns Cload = 2 nF, VDDHreg = 9 V

PWM COMPARATOR

VCOMP COMP control voltage range 1.3 −3 V For information only

ERROR AMPLIFIER

Vbg_fb Reference voltage 1.15 1.2 1.25 V Voltage with respect to ARTN

Av_ol DC open loop gain −80 −dB For information only

GBW Error amplifier GBW 1− − MHz For information only

SOFT−START

Vss Soft−start voltage range −1.15 −V

Vss_r Soft−start low threshold (rising edge) 0.35 0.45 0.55 V

Iss Soft−start source current 357mA

CURRENT LIMIT COMPARATOR

CSth CS threshold voltage 324 360 396 mV

Tblank Blanking time −100 −ns For information only

OSCILLATOR

DutyC Maximum duty cycle −80% −Fixed internally

Frange Oscillator frequency range 100 −500 kHz

F_acc Oscillator frequency accuracy ±25 %

10.Power dissipation must be considered. Load on VDDH and VDDL must be limited especially if VDDH is not powered by an auxiliary winding.

11. Ivddl_load = current flowing out of the VDDL pin.

Ivddh_load = current flowing out of the VDDH pin + current delivered to the Gate Driver (function of the frequency, VDDH voltage & MOSFET

gate capacitance).

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Table 3. OPERATING CONDITIONS

Symbol Parameter Min. Typ. Max. Units Conditions

CURRENT CONSUMPTION

IvportP1VPORTP internal current consumption

(Note 12)

−2.5 3.5 mA DC−DC controller off

IvportP2VPORTP internal current consumption

(Note 13)

−4.7 6.5 mA DC−DC controller on

THERMAL SHUTDOWN

TSD Thermal shutdown threshold 150 − − °C Tj Tj = junction temperature

Thyst Thermal hysteresis −15 −°C Tj Tj = junction temperature

THERMAL RATINGS

Ta Ambient temperature −40 −85 °C

Tj Junction temperature − − 125

150

°C

Parametric values guaranteed

Max 1000 hours

12.Conditions

a. No current through the pass−switch

b. DC−DC controller inactive (SS shorted to RTN)

c. No external load on VDDH and VDDL

d. VPORTP = 57 V

13.Conditions

a. No current through the pass−switch

b. Oscillator frequency = 100 kHz

c. No external load on VDDH and VDDL

d. Aux winding not used

e. 2 nF on GATE, DC−DC controller enabled

f. VPORTP = 57 V

Ihc CLA§§ pin. Fi Ihc cla [inn b as = in

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DESCRIPTION OF OPERATION

Powered Device Interface

The PD interface portion of the NCP1081 supports the

IEEE802.3af and 802.3at defined operating modes:

detection signature, current source classification, inrush and

operating current limits. In order to give more flexibility to

the user and also to keep control of the power dissipation in

the NCP1081, both current limits are configurable. The

device enters operation once its programmable Vuvlo_on

threshold is reached, and operation ceases when the supplied

voltage falls below the Vuvlo_off threshold. Sufficient

hysteresis and Uvlo filter time are provided to avoid false

power on/off cycles due to transient voltage drops on the

cable.

Detection

During the detection phase, the incremental equivalent

resistance seen by the PSE through the cable must be in the

IEEE802.3af standard specification range (23.75 kW to

26.25 kW) for a PSE voltage from 2.7 V to 10.1 V. In order

to compensate for the non-linear effect of the diode bridge

and satisfy the specification at low PSE voltage, the

NCP1081 presents a suitable impedance in parallel with the

25.5 kW Rdet external resistor connected between VPORTP

and VPORTN. For some types of diodes (especially Schottky

diodes), it may be necessary to adjust this external resistor.

When the Detection_Off level is detected (typically

11.5 V) on VPORTP, the NCP1081 turns on its internal

3.3 V regulator and biasing circuitry in anticipation of the

classification phase as the next step.

Classification

Once the PSE device has detected the PD device, the

classification process begins. The NCP1081 is fully capable

of responding and completing all classification handshaking

procedures as described next.

Classification Current Source Generation

In classification, the PD regulates a constant current

source that is set by the external resistor RCLASS value on

the CLASS pin. Figure 6 shows the schematic overview of

the classification block. The current source is defined as:

Iclass +

Vbg

Rclass

, (where Vbg is 1.2 V)

CLASS

VDDA1

1.2 V

VPORTP

VPORTN1,2 NCP1081

Rclass

Figure 6. Classification Block Diagram

The NCP1081 can handle all defined types of

classification, IEEE802.3af, 802.3at and proprietary

classification.

In the IEEE802.3af standard the classification is

performed with a Single Event Layer 1 classification.

Depending on the current level set during that single event

the power level is determined. The IEEE802.3at standard

allows two ways of classification which can also be

combined. These two approaches enable higher power

applications through a variety of PSE equipment.

For power injectors and midspans a pure physical

hardware handshake is introduced called Two Event Layer 1

classification. This approach allows equipment that has no

data link between PSE and PD to classify as high power.

Since switches can establish a data link between PSE and

PD, a software handshake is possible. This type of

handshake is called Layer 2 classification (or Data Link

Layer classification). It has the main advantage of having a

finer power resolution and the ability for the PSE and PD to

participate in dynamic power allocation.

Table 4. Single and Dual Event Classification

Standard Layer Handshake

802.3af 1 Single event physical classification

802.3at 1 Two event physical classification

802.3at 2 Data-link (IP) communication

classification

One Event Layer 1 Classification

An IEEE802.3af compliant PSE performs only One Event

Layer 1 classification event by increasing the line voltage

into the classification range only once.

Two Event Layer 1 Classification

A IEEE802.3at compliant PSE using this physical

classification performs two classification events and looks

for the appropriate response from the PD to check if the PD

is IEEE802.3at compatible.

The PSE will generate the sequence described in Figure 7.

During the first classification finger, the PSE will measure

the classification current which should be 40 mA if the PD

is at compliant. If this is the case, the PSE will exit the

classification range and will force the line voltage into the

Mark Event range. Within this range, the PSE may check the

non-valid input signature presented by the PD (using the two

point measurement defined in the IEEE802.3af standard).

Then the PSE will repeat the same sequence with the second

classification finger. A PD which has detected the sequence

“Finger + Mark + Finger + Mark” knows the PSE is

IEEE802.3at compliant, meaning the PSE will deliver more

current on the port. (Note that a PSE IEEE802.3at compliant

may apply more than two fingers, but the final result will be

the same as two fingers).

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Figure 7. Hardware Physical Classification Event Sequence

1st Class Event

Class range

Mark Range

Reset Range

2 Fingers Classification with

0 V

5.4 V

9.5 V

13 V

20.5 V

UVLO_on

Power OnDetection

PSE identified as type 2 PSE (at)

PSE Type identification:

Number of Mark Event: 0 1 2

Operation Mode:

Mark Events (.at spec)

1st Mark Event 2nd Class Event 2nd Mark Event

PSE identified by default as type 1 PSE (af)

nCLASS_AT Indicator

The nCLASS_AT active low open drain output pin can be

used to notify to the microprocessor of the powered device

that the PSE performed a one or two event hardware

classification. If a two event hardware classification has

occured and once the PD application is supplied power by

the NCP1081 DC-DC converter, the nCLASS_AT pin will

be pulled down to ARTN by the internal low voltage NMOS

switch (ARTN is the ground connection of the DC-DC

converter). Otherwise, nCLASS_AT will be disabled and

will be pulled up to VDDL (3.3 V typ) via an internal current

source (20 mA typ) and via the external pull-up resistor.

The following scheme illustrates how the nCLASS_AT

pin may be configured with the processor of the powered

device. An opto-coupler is used to guarantee full isolation

between the Ethernet cable and the application.

Figure 8. Isolated nClass_AT Communication with the Powered Device Application

ARTN

NCP1081

nCLASS_AT

Class_AT

VDDL

Csup

Powered Device Application

Rled

Opto 1

Rbip

Isolation

VSUP

Microprocessor

Microcontroller

IN1

IN2

GND

Layer 2

Engine

Features

(Isolated DC/DC converter)

20 mA

To dctlnc [he UVLO ‘hrcshol 1.2

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As soon as the application is powered by the DC-DC

converter and completes initialization, the microprocessor

should check if the NCP1081 detected a two event hardware

classification by reading its digital input (pin IN1 in this

example). If pin IN1 is low, the application knows power is

supplied by a IEEE802.3at compliant PSE, and can deliver

power up to the level specified by the IEEE802.3at standard.

Otherwise the application will have to perform a Layer 2

classification with the PSE. There are several scenarios for

which the NCP1081 will not enable its nCLASS_AT pin:

•The PSE skipped the classification phase.

•The PSE performed a one event hardware classification

(it can be a IEEE802.3af or a 802.3at compliant PSE

with Layer 2 engine).

•The PSE performed a two event hardware classification

but it did not properly control the input voltage in the

mark voltage window, (for example it crossed the reset

range).

Power Mode

When the classification hand−shake is completed, the

PSE and PD devices move into the operating mode.

Under Voltage Lock Out (UVLO)

The NCP1081 incorporates an under voltage lock out

(UVLO) circuit which monitors the input voltage and

determines when to apply power to the DC−DC controller.

To use the default settings for UVLO (see Table 3), the pin

UVLO must be connected to VPORTN1,2. In this case the

signature resistor has to be placed directly between

VPORTP and VPORTN1,2, as shown in Figure 9.

Figure 9. Default UVLO Settings

UVLO

VPORTP

VPORTN1,2

NCP1081

VPORT Rdet

To define the UVLO threshold externally, the UVLO pin

must be connected to the center of an external resistor

divider between VPORTP and VPORTN1,2 as shown in

Figure 10. The series resistance value of the external

resistors must add to 25.5 kW and replaces the internal

signature resistor.

Figure 10. External UVLO Configuration

UVLO

VPORTN1,2

NCP1081

VPORT

VPORTP

For a Vuvlo_on desired turn−on voltage threshold, R1 and

R2 can be calculated using the following equations:

R1 )R2 +Rdet

R2 +1.2

Vulvo_on

Rdet

When using the external resistor divider, the NCP1081 has

an external reference voltage hysteresis of 15 percent typical.

Inrush and Operational Current Limitations

The inrush current limit and the operational current limit

are programmed individually by an external Rinrush and

Rilim1 resistors respectively connected between INRUSH

and VPORTN1,2, and between ILIM1 and VPORTN1,2 as

shown in Figure 11.

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ILIM1 /

INRUSH

VDDA1

Vbg1

VDDA1

VPORTNx

Ilim_ref

NCP1081

Figure 11. Current Limitation Configuration (Inrush & Ilim1 Pins)

Ilim1

Vds_pgood

threshold

VPORTNx

Pass Switch

Inrush

I_pass_switch

NCP1081

RTN

VDS_PGOOD

VDDA1 VDDA1

1 V / 9.2 V

2 V

Current_limit_ON

detector

Figure 12. Inrush and Ilim1 Selection Mechanism

VDDA1

When VPORT reaches the UVLO_on level, the Cpd

capacitor is charged with the INRUSH current (in order to

limit the internal power dissipation of the pass−switch).

Once the Cpd capacitor is fully charged, the current limit

switches from the inrush current to the current limit level

(ilim1) as shown in Figure 12. This transition occurs when

both following conditions are satisfied:

1. The VDS of the pass−switch is below the

Vds_pgood low level (1 V typical).

2. The pass−switch is no longer in current limit

mode, meaning the gate of the pass−switch is

“high” (above 2 V typical).

The operational current limit will stay selected as long as

Vds_pgood is true (meaning that RTN−VPORTN1,2 is

below the high level of Vds_pgood). This mechanism allows

a current level transition without any current spike in the

pass−switch because the operational current limit (ilim1) is

enabled once the pass−switch is not limiting the current

anymore, meaning that the Cpd capacitor is fully charged.

Thermal Shutdown

The NCP1081 includes thermal protection which shuts

down the device in case of high power dissipation. Once the

thermal shutdown (TSD) threshold is exceeded, following

blocks are turned off:

•DC−DC controller

•Pass−switch

•VDDH and VDDL regulators

•CLASS regulator

When the TSD error disappears and if the input line

voltage is still above the UVLO level, the NCP1081

automatically restarts with the current limit set in the inrush

state, the DC−DC controller is disabled and the Css

(soft−start capacitor) discharged. The DC−DC controller

becomes operational as soon as capacitor Cpd is fully

charged.

hllp://onsemi.com 15

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DC−DC Converter Controller

The NCP1081 implements a current mode DC−DC converter controller which is illustrated in Figure 13.

VDDL

360 mV

Oscillator

COMP

Gate

Driver

PWM comp

OSC

VDDL

Blanking

time

Current Slope

Compensation

Soft−start

1.45 V

1.2 V

Current limit

comp

9 V LDO

3.3 V LDO

GATE

VDDH

ARTN

VPORTP

Set

CLK

Reset

CLK

Figure 13. DC−DC Controller Block Diagram

5 kW

10 mA

11 kW

5 mA

Internal VDDH and VDDL Regulators and Gate Driver

An internal linear regulator steps down the VPORTP

voltage to a 9 V output on the VDDH pin. VDDH supplies

the internal gate driver circuit which drives the GATE pin

and the gate of the external power MOSFET. The NCP1081

gate driver supports an external MOSFET with high Vth and

high input gate capacitance. A second LDO regulator steps

down the VDDH voltage to a 3.3 V output on VDDL. VDDL

powers the analog circuitry of the DC-DC controller and

nCLASS_AT blocks. Moreover it can provide current to

light a LED connected on the nCLASS_AT pin.

In order to prevent uncontrolled operations, both regulators

include power−on−reset (POR) detectors which prevent the

DC−DC controller from operating when either VDDH or

VDDL is too low. In addition, an over−voltage lockout

(OVLO) on the VDDH supply disables the gate driver in case

of an open−loop converter with a configuration using the bias

winding of the transformer (see Figure 4).

Both VDDH and VDDL regulators turn on as soon as

VPORT reaches the Vuvlo_on threshold.

Error Amplifier

In non−isolated converter topologies, the high gain

internal error amplifier of the NCP1081 and the internal

1.2 V reference voltage regulate the DC−DC output voltage.

In this configuration, the feedback loop compensation

network should be inserted between the FB and COMP pins

as shown in Figures 3, 4 and 5.

In isolated topologies the error amplifier is not used

because it is already implemented externally with the shunt

regulator on the secondary side of the DC−DC controller

(see Figure 2). Therefore the FB pin must be strapped to

ARTN and the output transistor of the opto−coupler has to

be connected on the COMP pin where an internal 5 kW

pull−up resistor is tied to the VDDL supply (see Figure 13).

Soft−Start

The soft−start function provided by the NCP1081 allows

the output voltage to ramp up in a controlled fashion,

eliminating output voltage overshoot. This function is

programmed by connecting a capacitor CSS between the SS

and ARTN pins.

While the DC−DC controller is in POR, the capacitor CSS

is fully discharged. After coming out of POR, an internal

current source of 5 mA typically starts charging the capacitor

CSS to initiate soft−start. When the voltage on SS pin has

reached 0.45 V (typical), the gate driver is enabled and

DC−DC operation starts with a duty cycle limit which

increases with the SS pin voltage. The soft−start function is

finished when the SS pin voltage goes above 1.6 V for which

the duty cycle limit reaches its maximum value of 80

percent.

Soft−start can be programmed by using the following

equation:

tSS(ms) +0.23 CSS(nF)

FOSC(kHz)

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Current Limit Comparator

The NCP1081 current limit block behind the CS pin

senses the current flowing in the external MOSFET for

current mode control and cycle−by−cycle current limit. This

is performed by the current limit comparator which, on the

CS pin, senses the voltage across the external Rcs resistor

located between the source of the MOSFET and the ARTN

pin.

The NCP1081 also provides a blanking time function on

CS pin which ensures that the current limit and PWM

comparators are not prematurely trigged by the current spike

that occurs when the switching MOSFET turns on.

Slope Compensation Circuitry

To overcome sub−harmonic oscillations and instability

problems that exist with converters running in continuous

conduction mode (CCM) and when the duty cycle is close

or above 50 percent, the NCP1081 integrates a current slope

compensation circuit. The amplitude of the added slope

compensation is typically 110 mV over one cycle.

As an example, for an operating switching frequency of

250 kHz, the internal slope provided by the NCP1081 is

27.5 mV/ mA typically.

DC−DC Controller Oscillator

The frequency is configured with the Rosc resistor

inserted between OSC and ARTN, and is defined by the

following equation:

ROSC(kW)+38600

FOSC(kHz)

The duty cycle limit is fixed internally at 80 percent.

mm @020 CAB D :"gmH H H H H EH TOP VIEW Mr; H Li :1: . H}; «a» >+b1+1 II 71—17 mm SIDE VIEW TES DLMENSLDNLN w 4 SM. ‘594 CONTROLUNG DLMENSLDN MLLLLMETERS DLMENSLDN b DDES NOT LNCLDDE DAMEAR FRDTRDSLDN ALLDWARLE DAMEAR FRDTRDSLDN SHALL BE u D7 w ExcESS DF IHE LEAD WLDTH AI MMC DAMDAR CANNOT BE LOACTED ON THE LDWER RADLDS DR THE FOOT oF THE LEAD 4 DLMENSLDNS h m c a To BE MEASURED BEF TWEEN D H) AND a 25 FROM LEAD up 5 DAmMS A AND B ARE ARE DETERMLNED AI DATUM H DAIUM H LS LOACTED AT IHE MOLD PARTLND UNE AND cowcLDEm WLTH LEAD WHERE IHE LEAD Est THE RLASnc army 5 DLMENSLDN D DOES NOT LNcLuDE MOLD FLASH FRDTRDSLDNS OR GAVE BURRS MOLD FLASH FRDTRDSLDNS OR GATE DDRRS SHALL Not ExcEED D ‘5 PER SLDE DLMENSLDN E‘ DoES NOT LNcLuDE INIERLEAD FLASH DR PRDTRUSLDN wr TERLEAD FLASH 0R FROTRUSION SHALL NOT EXF cEED D ‘5 PER SLDE D AND E ARE DEIERMINED SECTION 5-5 M DATUM H W 7 \\M A , Hn * M L L, L, ., A a nmuLAJ 7| L. my n25 ENDVIEW a nu! ms E1 un‘ osn - mu: |. nsnL m DETAILA SOLDERING FOOTPRINT“ 430 77M M I ‘ f \ + \ 0.6544 k DJ IJIJD 4L H zux 0.35 PITCH http://onsem am 17 DLMENSLDNS MILUMEIERS

NCP1081

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PACKAGE DIMENSIONS

TSSOP−20 EP

CASE 948AB−01

ISSUE O

DIM

MIN MAX

6.60

MILLIMETERS

E1 4.30 4.50

A1.10

A1 0.05 0.15

L0.50 0.70

e0.65 BSC

P--- 4.20

c0.09 0.20

c1 0.09 0.16

b0.19 0.30

b1 0.19 0.25

L2 0.25 BSC

M0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.07 IN EXCESS OF THE LEAD WIDTH AT

MMC. DAMBAR CANNOT BE LOACTED ON THE

LOWER RADIUS OR THE FOOT OF THE LEAD.

4. DIMENSIONS b, b1, c, c1 TO BE MEASURED BE-

TWEEN 0.10 AND 0.25 FROM LEAD TIP.

5. DATUMS A AND B ARE ARE DETERMINED AT DATUM

H. DATUM H IS LOACTED AT THE MOLD PARTING

LINE AND COINCIDENT WITH LEAD WHERE THE

LEAD EXITS THE PLASTIC BODY.

6. DIMENSION D DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH,

PROTRUSIONS OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSION E1 DOES NOT

INCLUDE INTERLEAD FLASH OR PROTRUSION. IN-

TERLEAD FLASH OR PROTRUSION SHALL NOT EX-

CEED 0.15 PER SIDE. D AND E1 ARE DETERMINED

AT DATUM H.

PIN 1

REFERENCE

0.08

SECTION B−B

cc1

SEATING

PLANE

20X b

DETAIL A

6.40

---

4.30

20X

0.98

20X

0.35

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

L2 GAUGE

DETAIL A

e/2

DETAIL B

A2 0.85 0.95

E6.40 BSC

P1 --- 3.00

PLANE

SEATING

PLANE

END VIEW

A-B

0.10 DC

TOP VIEW

SIDE VIEW

A-B0.20 D

110

1120

DETAIL B

2X 10 TIPS

0.05 C

BOTTOM VIEW

3.106.76

20X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

m J and

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ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,

copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC

reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without

limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC

does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for

surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where

personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and

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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture

of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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Phone: 81−3−5817−1050

NCP1081/D

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