Multi-Layer Chip Beads

Fair-Rite’s cost-effective multi-layer chip beads suppress conducted EMI signals. These chip beads are high power for the automotive and mil-aero industries. However, they can also be used in an array of devices such as point-of-load DC/DC converters, thermostats, cellular phones, computers, laptops, pagers, and others. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. Chip beads are 100% tested for impedance and DC resistance. They are available in standard, high, and GHz signal speeds. The multi-layer chip beads are organized by increasing package size and current carrying capacity.