µIPM™ Integrated Power Module

Infineon Technologies' µIPM family consists of ultra-compact, surface-mount intelligent power modules designed for low power, motor-drive applications. The modules offer a combination of Infineon Technologies' low R_DS(ON) trench MOSFET technology and the industry benchmark 3-phase high voltage, rugged driver in an ultra-compact package. At only 12 mm x 12 mm x 0.9 mm, µIPM modules are the smallest in the industry, making them suitable for applications that are space-constrained. Integrated bootstrap functionality eliminates the need for external high-voltage diodes, while overcurrent protection, fault reporting, and undervoltage lockout functions deliver a high level of protection and fail-safe operation.

Infineon Technologies' µIPM product family offers a scalable power solution with common pin-out and package size. Featuring the most rugged and efficient high-voltage FredFET MOSFET switches specifically optimized for variable frequency drives and Infineon Technologies' most advanced high-voltage driver ICs, the µIPM product family offers DC current ratings ranging from 2 A to 4 A and voltages of 250 V and 500 V.