THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pads

Parker Chomerics’ THERM‐A‐GAP PAD 70TP is a high-performing, highly conformable thermally conductive gap filler pad, demonstrating a typical thermal conductivity of 7.0 W/m‐K. It offers exceptional thermal efficiency and enduring stability, outperforming traditional thermal pads while requiring very little compression force.

THERM‐A‐GAP PAD 70TP is engineered to facilitate effective heat exchange between electronic components and their corresponding cooling elements, such as heat sinks. Its physical characteristics enable it to provide high-level adaptability and reduce the compressive stress on the underlying electronics.

The "TP" in the product name signifies "thermal putty," distinguishing it from other gap pads. This material is designed for a static, one-time assembly, as it will permanently adapt to fill air gaps created by uneven or rough surface textures.