



374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | ฿85.67000 | ฿85.67 |
| 10 | ฿75.74900 | ฿757.49 |
| 25 | ฿72.14760 | ฿1,803.69 |
| 50 | ฿69.54820 | ฿3,477.41 |
| 100 | ฿67.03630 | ฿6,703.63 |
| 250 | ฿63.84916 | ฿15,962.29 |
| 756 | ฿60.19966 | ฿45,510.94 |
| 1,512 | ฿58.01738 | ฿87,722.28 |
| 5,292 | ฿54.26595 | ฿287,175.41 |











