Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
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Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
374324B00035G
374324B00035G

374324B00035G

DigiKey Part Number
HS318-ND
Manufacturer
Manufacturer Product Number
374324B00035G
Description
HEATSINK BGA W/ADHESIVE TAPE
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Datasheet
 Datasheet
Product Attributes
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Category
Length
1.063" (27.00mm)
Mfr
Width
1.063" (27.00mm)
Series
Fin Height
0.394" (10.00mm)
Packaging
Box
Power Dissipation @ Temperature Rise
3.0W @ 90°C
Part Status
Active
Thermal Resistance @ Forced Air Flow
9.30°C/W @ 200 LFM
Type
Board Level
Thermal Resistance @ Natural
30.60°C/W
Package Cooled
Material
Attachment Method
Thermal Tape, Adhesive (Included)
Material Finish
Black Anodized
Shape
Square, Pin Fins
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 2,483
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
All prices are in THB
Box
QuantityUnit PriceExt Price
1฿85.67000฿85.67
10฿75.74900฿757.49
25฿72.14760฿1,803.69
50฿69.54820฿3,477.41
100฿67.03630฿6,703.63
250฿63.84916฿15,962.29
756฿60.19966฿45,510.94
1,512฿58.01738฿87,722.28
5,292฿54.26595฿287,175.41
Manufacturers Standard Package