Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

NC191SNL250T5

DigiKey Part Number
315-NC191SNL250T5-ND
Manufacturer
Manufacturer Product Number
NC191SNL250T5
Description
SMOOTH FLOW LEAD-FREE SOLDER PAS
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
Datasheet
 Datasheet
Product Attributes
Filter Similar Products
Show Empty Attributes
Category
Flux Type
No-Clean
Manufacturer
Chip Quik Inc.
Mesh Type
5
Series
Process
Lead Free
Packaging
Bulk
Form
Jar, 8.8 oz (250g)
Part Status
Active
Shelf Life
6 Months
Type
Solder Paste
Shelf Life Start
Date of Manufacture
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Melting Point
422 ~ 428°F (217 ~ 220°C)
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 9
Check for Additional Incoming Stock
All prices are in THB
Bulk
QuantityUnit PriceExt Price
1฿2,843.42000฿2,843.42
Manufacturers Standard Package