Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
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TS991SNL500T3

DigiKey Part Number
315-TS991SNL500T3-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
TS991SNL500T3
Description
SOLDER PASTE THERMALLY STABLE NC
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
CHIPQUIK®
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Base Product Number
TS991S
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Quantity
All prices are in THB
Bulk
QuantityUnit PriceExt Price
1฿3,336.78000฿3,336.78
5฿2,875.14600฿14,375.73
10฿2,696.10300฿26,961.03
25฿2,475.79800฿61,894.95
50฿2,320.64960฿116,032.48
100฿2,174.71800฿217,471.80
Manufacturers Standard Package
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