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Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).

To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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The Samtec Story

Image of Samtech's Story

Samtec offers a broad line of electronic interconnect solution blocks, including IC-to-Board/Ultra Micro, High Speed Board-to-Board, High Speed Cables, Future-Proof/Active Optics, Flexible Stacking, and Micro/Rugged components and cables. Learn More

Product Listing View All

Newest Products View All (13)

MEC5 Micro Edge Card Connector

Samtec's MEC5 edge card connector is a flexible solution with multiple pin count and orientation options. Learn More

UMPx Series 2.00 mm Ultra Micro Power Interconnect System

Samtec’s mPOWER™ connector is a high-power/small form factor power interconnect with up to 21 A per blade. Learn More

Edge Rate® High-Speed Contact System

Samtec’s Edge Rate® contact system featuring the ERM8 and ERF8 series is designed for high speeds up to 56 Gbps PAM4 as well as high-cycle applications. Learn More

Tiger Eye™ Interconnect Systems

Samtec’s Tiger Eye™ interconnect systems are available in three pitches and are designed for micro rugged, high-reliability, high-cycle applications. Learn More

MMSD Series Flexible Power Cable Assembly

Samtec’s Mini Mate® series is a discrete wire cable assembly on 0.100” (2.54 mm) pitch with 20 AWG to 30 AWG wire with contacts rated up to 4.8 A per pin. Learn More

SSM/TSM Series Board-Stacking Solutions

Samtec's board-stacking interconnects feature a wide variety of designs, pitches, post height options, orientations, and body positions. Learn More

Recent PTMs View All (2)

Rugged/Power Connectors Publish Date: 2011-11-16

Samtec’s micro rugged connectors features include rugged Tiger Eye and Edge Rate contacts, IP68 waterproofed cables, and high speed, signal integrity Q series.

Duration: 10 minutes
Board-to-Board Connectors Publish Date: 2011-11-16

Summary of Samtec's board-to-board interconnect solutions, discussion of the various types of contact systems available and their features and benefits.

Duration: 5 minutes

Featured Videos View All (13)

Micro Rugged & Power Interconnects - Samtec

High cycle, high speed, high power, and harsh environment solutions that maximize space within a system. This includes IP68 & IP67 Sealed, Flexible Power, Rugged Signal Integrity, and Rugged Contact System designs.

Samtec Product Overview

From standard products to unique high-performance designs, Samtec’s offering is designed to support any interconnectivity need, regardless of application, performance requirements or environment.

XCede® HD - Samtec’s High-Density Backplane System

XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. Visit samtec.com/XCedeHD for more information.

ExaMAX

This brief video showcases our emerging backplane technology in our new ExaMax system capable of 28+ Gbps while providing reliable contacts and low mating force. Visit samtec.com/ExaMax for more information.

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