Tight sensor interchangeability (i.e., low part-to-part variation) helps to reduce or eliminate OEM production calibration costs. Interchangeability is closely related to accuracy, hysteresis, repeatability, and output linearity. Also, these devices utilize multi-layer thermoset polymer capacitive sensing element with on-chip integrated signal conditioning. Sensors that employ capacitance technology using a multi-layered thermoset polymer capacitor are inherently more rugged than other available technologies. This is because thermoset polymers provide much better environmental resistance than typical thermoplastic polymers. The CMOS-based, thermoset polymer capacitor sensors also offer a broad relative humidity sensing range. This, along with design ruggedness and inherent stability over numerous environmental conditions, typically offers the OEM the lowest total cost solution. Additionally, sensors with on-chip signal conditioning require limited or zero support electronics and typically offer direct input to control devices. This is another way that the sensor allows for fast, easy, and lower-cost installation at the OEM. On-chip signal conditioning, coupled with CMOS technology and laser trimming, deliver a high degree of sensor interchangeability and accuracy while the molded thermoset plastic housing enhances durability for use in many harsh environments.