TI900 has a thermal conductivity of 1.8 W/m.k and is designed for applications where the lowest possible thermal impedance is needed. The principle applications of this product are to enhance heat-flow from the device to the heat sink and to provide electrical isolation. TI900 can provide both of these functionalities and offers a great design solution.
 
                 
                 
                 
 
 
 
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                                 Thailand
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