Polyimide Film Protection Tapes

3M polyimide film protection tapes are engineered to provide reliable performance under high temperatures and other harsh environmental conditions. They can be used for a variety of applications requiring temporary or permanent holding, including solder masking, dielectric insulation, and gold finger protection. 3M polyimide film tapes are dimensionally stable at high temperatures and release cleanly without leaving a sticky residue behind.

DigiKey offers quotes on secondary services. For more information on 3M available options or if assistance is needed, contact CustomCut.3MProducts@digikey.com. Please send outlined dimensional drawings to the aforementioned e-mail address.

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Polyimide Film Tape 5413 Series

• 3M polyimide film tape 5413 with DuPont™ Kapton® polyimide film and silicone adhesive used for PCB solder masking and other high-temperature applications. Amber, 2.7 mils thick.
  • DuPont Kapton polyimide film does not soften at elevated temperatures; thus, the film provides an excellent release surface at elevated temperatures
  • No rework required, enabling high productivity
  • Protects surfaces helping reduce replacement parts
  • Available on cardboard or polyethylene core

Polyimide Film Tape 5419 Series

• 3M low static polyimide film tape 5419 with DuPont Kapton polyimide film and silicone adhesive used for PCB solder masking and other high-temperature applications. Gold, 2.7 mils thick.
  • DuPont Kapton polyimide film does not soften at elevated temperatures; thus, the film provides an excellent release surface at elevated temperatures
  • No rework required, enabling high productivity
  • Protects surfaces, helping reduce replacement parts
  • Available on cardboard or polyethylene core

Polyimide Film Tape 7419 Series

• 3M low static, non-silicone polyimide film tape 7419 with DuPont Kapton polyimide film and acrylic adhesive used for PCB solder masking and other high temperature applications. Amber.
  • Specially formulated acrylic adhesive is resistant to typical solder mask temperatures for short periods of time. Stays firmly in place during processing and removes cleanly from typical electronic substrates even after 10 min @ 500°F (260°C).
  • Non-silicone adhesive formulation eliminates the potential for silicone contamination which can interfere with subsequent bonding or conformal coating operations.
  • The high-temperature acrylic adhesive also has excellent chemical resistance and should be considered for demanding chemical masking applications.
  • Available on cardboard or polyethylene core