Gap Pad® TGP 6000ULM
Bergquist’s Gap Pad TGP 6000ULM is designed for applications where high heat dissipation and low stress are required
Bergquist’s Gap Pad TGP 6000ULM offers high thermal conductivity of 6.0 W/m∙K and an ultra-low modulus for reduced stress, particularly for small footprint components with high power density. The silicone-based, nonelectrically conductive Gap Pad is highly conformable, providing excellent coverage on various topographies. Bergquist Gap Pad TGP 6000 ULM is easy to apply and reworkable, as the material provides a low- and a high-tack side and is available in custom-cut shapes for specific device and application requirements.
- Outstanding thermal performance
- Very low stress
- Ease of handling
- High-tack and low-tack sides
- Reworkable
- Excellent wet-out characteristics
- High dielectric strength
- Telecommunications
- ASICs
- DSPs
- Consumer electronics
- Thermal modules to heat sinks assembly
Gap Pad® TGP 6000ULM
รูปภาพ | Manufacturer Part Number | คำอธิบาย | Available Quantity | ราคา | ดูรายละเอียด | |
---|---|---|---|---|---|---|
![]() | ![]() | GPTGP6000ULM-0.040-12-0816 | THERM PAD 406.4X203.2MM GRAY | 7 - Immediate | $6,163.30 | ดูรายละเอียด |
![]() | ![]() | 2195669 | THERM PAD 406.4X203.2MM GRAY | 0 - Immediate | $8,666.45 | ดูรายละเอียด |
![]() | ![]() | 2214846 | THERM PAD 406.4X203.2MM GRAY | 0 - Immediate | $11,276.85 | ดูรายละเอียด |
![]() | ![]() | 2407938 | THERM PAD 406.4X203.2MM GRAY | 0 - Immediate | See Page for Pricing | ดูรายละเอียด |
![]() | ![]() | GPTGP6000ULM-0.060-12-0816 | THERM PAD 406.4X203.2MM GRAY | 0 - Immediate | See Page for Pricing | ดูรายละเอียด |