Gap Pad® TGP 7000ULM
Bergquist’s ultra-low modulus gap-filling material offers exceptional thermal performance at low pressures
Bergquist’s Gap Pad TGP 7000ULM is an extremely soft gap-filling material rated at a thermal conductivity of 7.0 W/m-K that is specially formulated for high-performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation.
Gap Pad TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
- Low assembly stress due to ultra-low modulus (Shore 000 and ASTM D2240)
- Excellent conformability to rough or irregular surfaces
- Thorough wet out at the interface for maximized thermal transfer
- High thermal conductivity of 7.0 W/m-K
- Simplified application and processability; supplied in pre-cut, custom-sized pads with high tack on both sides
- Room-temperature storage
- Telecommunications
- Routers
- Switches
- Base stations
- Optical transceivers
- ASICs
- DSPs
Gap Pad® TGP 7000ULM
รูปภาพ | Manufacturer Part Number | คำอธิบาย | Available Quantity | ราคา | ดูรายละเอียด | |
---|---|---|---|---|---|---|
![]() | ![]() | GPTGP7000ULM-0.020-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 22 - Immediate | $3,861.33 | ดูรายละเอียด |
![]() | ![]() | GPTGP7000ULM-0.040-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 18 - Immediate | $3,694.28 | ดูรายละเอียด |
![]() | ![]() | 2474875 | THERM PAD 203.2MMX203.2MM GRAY | 4 - Immediate | $4,999.15 | ดูรายละเอียด |
![]() | ![]() | GPTGP7000ULM-0.080-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 0 - Immediate | $6,340.43 | ดูรายละเอียด |
![]() | ![]() | GPTGP7000ULM-0.100-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 0 - Immediate | $5,374.20 | ดูรายละเอียด |
![]() | ![]() | GPTGP7000ULM-0.125-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 0 - Immediate | $9,357.73 | ดูรายละเอียด |