THERM-A-GAP™ PAD 80LO Thermally Conductive Gap Filler Pads
Publish Date: 2025-07-02
Parker Chomerics THERM-A-GAP™ PAD 80LO thermally conductive gap filler pads provide a low hardness (35 Shore 00) solution with thermal conductivity of 8.3 W/mK.
THERM-A-GAP GEL 35VT Thermally Conductive Gel
Publish Date: 2024-06-26
Parker Chomerics' THERM-A-GAP GEL 35VT is a one-component silicone, dispensable thermal interface gel material with 3.5 W/m-K typical thermal conductivity.
THERM-A-GAP GEL 50TBL Thermally Conductive Gel
Publish Date: 2024-06-24
Parker Chomerics' THERM-A-GAP GEL 50TBL is a reworkable, high-performance thermal interface material with a typical bulk thermal conductivity of 5.0 W/m-K.
THERM-A-GAP™ GEL 50VT Thermally Conductive Gel
Publish Date: 2024-06-20
Parker Chomerics THERM-A-GAP GEL 50VT is a reworkable, high-performance, dispensable thermal interface gel material with 5.2 W/m-K typical thermal conductivity.
SOFT-SHIELD® 3500 EMI Shielding Gaskets
Publish Date: 2024-05-20
Parker Chomerics’ SOFT-SHIELD® 3500 EMI shielding gaskets feature low closure force for optimum performance in indoor applications.
THERM-A-GAP GEL 60HF
Publish Date: 2024-02-26
Parker Chomerics’ THERM-A-GAP GEL 60HF is a “high flow” gel that is ideal for high volume dispensing applications.
THERM-A-GAP PAD 80 Thermally-Conductive Gap Filler Pads
Publish Date: 2024-02-13
Parker Chomerics' THERM-A-GAP PAD 80 is a 8.3 W/m-K high-performance, thermally-conductive gap filler pad.
THERM-A-GAP GEL 75 Thermally Conductive Gel
Publish Date: 2024-02-06
Parker Chomerics' THERM-A-GAP GEL 75 is designed as a one-component fully cured system with automated dispensing.
THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pads
Publish Date: 2024-01-31
Parker Chomerics’ THERM‐A‐GAP™ PAD 70TP is a high-performing, thermally conductive gap filler pad, demonstrating a thermal conductivity of 7.0 W/m‐K.
METALASTIC Series EMI Gaskets
Publish Date: 2024-01-19
Parker Chomerics' METALASTIC series EMI gaskets can withstand high compression forces.
Parker Chomerics parts will include a -DK extension on all part numbers sold through DigiKey.
THERM-A-GAP™ thermal gap filler pads are soft and easily conformable to provide thermal interfaces between heat sinks and electronic devices, accommodating for uneven surfaces, air gaps, and rough surface textures.
CHO-THERM™ Thermal Dielectric Pads
Publish Date: 2020-02-28
This PTM defines what a Thermal Dielectric Pad is, what are the major product selection criteria, and a ranking based on the level of performance.
Duration: 5 minutes
How to Test a Thermal Interface Material
Publish Date: 2020-01-28
This presentation will explain how to test a thermal interface material from Parker Chomerics.
Duration: 10 minutes
THERM-A-GAP™ Thermally Conductive Gap Pads
Publish Date: 2020-01-24
This presentation will define what Thermal Gap Pads are, what the major product performance criteria used to make the material selection are, and rank the performance of each.
Duration: 5 minutes
CHO-MASK® II EMI Foil Tape
Publish Date: 2019-11-12
Parker Chomerics' CHO-MASK II is an EMI foil tape layered with polyester paint masking, providing a conductive non-corroding surface on electronic enclosures.
THERM-A-GAP™ GEL45 Thermally Conductive Gel
Publish Date: 2019-11-11
Parker Chomerics' THERM-A-GAP™ GEL45 dispensable thermal gel with 4.5 W/m-K thermal conductivity is a one-component fully cured system.
Automated dispensing of Parker Chomerics THERM-A-GAP™ Gel 45, which is a fully cured dispensable thermal gel that has 4.5 W/m-K thermal conductivity and is designed as a one component fully cured system.

